Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.

Abstract: A semiconductor package includes a substrate component having a first surface, a second surface opposite to the first surface, and a sidewall surface extending between the first surface and the second surface; a re-distribution layer (RDL) structure disposed on the first surface and electrically connected to the first surface through first connecting elements comprising solder bumps or balls; a plurality of ball grid array (BGA) balls mounted on the second surface of the substrate component; and at least one integrated circuit die mounted on the RDL structure through second connecting elements.

Abstract: A semiconductor package is provided. The semiconductor package includes a semiconductor device bonded to a base through a first conductive structure. The semiconductor device includes a carrier substrate including a conductive trace. A portion of the conductive trace is elongated. The semiconductor device also includes a second conductive structure above the carrier substrate. A portion of the second conductive structure is in contact with the portion of the conductive trace. The semiconductor device further includes a semiconductor body mounted above the conductive trace. The semiconductor body is connected to the second conductive structure.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor die surrounded by a first molding compound layer. A redistribution layer (RDL) structure is formed on a non-active surface of the semiconductor die and the first molding compound layer. A second molding compound layer is formed on the RDL structure. An insulating capping layer covers the second molding compound layer. An antenna is electrically coupled to the semiconductor die and includes a first antenna element formed in the RDL structure and a second antenna element formed between the second molding compound layer and the insulating capping layer.

Abstract: A lighting device includes a lighting unit with a snapping member formed on each of two ends thereof. A lighting portion is formed to the lighting unit and located between the two snapping members. A room defined in the lighting unit. A light emitting unit is located in the room and includes a light emitting member which is located corresponding to the lighting portion. A switch is connected to the underside of the lighting unit and electrically connected to the light emitting unit so as to control the operation of the light emitting member. Two clip members are respectively connected to the two snapping members of the lighting unit, or two connection portions are respectively formed on the two ends of the lighting unit. The clip members or the connection portions are attached to the visor to maintain the lighting device to the underside of the visor.

Abstract: A lighting device includes a lighting unit with a snapping member formed on each of two ends thereof. A lighting portion is formed to the lighting unit and located between the two snapping members. A room defined in the lighting unit. A light emitting unit is located in the room and includes a light emitting member which is located corresponding to the lighting portion. A switch is connected to the underside of the lighting unit and electrically connected to the light emitting unit so as to control the operation of the light emitting member. Two clip members are respectively connected to the two snapping members of the lighting unit, or two connection portions are respectively formed on the two ends of the lighting unit. The clip members or the connection portions are attached to the visor to maintain the lighting device to the underside of the visor.

Abstract: A method of forming a semiconductor package structure includes providing a first wafer-level package structure having a die region surrounded by a scribe line region. The first wafer-level package structure includes a first encapsulating layer, a first redistribution layer (RDL) structure formed on the first encapsulating layer, a first antenna element formed in the first RDL structure and corresponding to the die region, and a semiconductor die in the first encapsulating layer and corresponding to the die region. A second wafer-level package structure is bonded onto the first RDL structure using a first adhesive layer. The second wafer-level package structure includes a second encapsulating layer attached to the first adhesive layer, and a second antenna element formed on the second encapsulating layer. The second antenna element and the first antenna element form a pitch antenna after the bonding of the second wafer-level package structure.

Abstract: A semiconductor package structure includes a substrate, a bridge structure, a redistribution layer, a first semiconductor component, and a second semiconductor component. The substrate has a wiring structure. The bridge structure is over the substrate. The redistribution layer is over the bridge structure. The first semiconductor component and the second semiconductor component are over the redistribution layer, wherein the first semiconductor component is electrically coupled to the second semiconductor component through the redistribution layer and the bridge structure.

Abstract: A semiconductor package is provided. The semiconductor package includes a semiconductor device bonded to a base through a first conductive structure. The semiconductor device includes a carrier substrate including a conductive trace. A portion of the conductive trace is elongated. The semiconductor device also includes a second conductive structure above the carrier substrate. A portion of the second conductive structure is in contact with the portion of the conductive trace. The semiconductor device further includes a semiconductor body mounted above the conductive trace. The semiconductor body is connected to the second conductive structure.

Abstract: A semiconductor chip package includes a substrate having a top surface and a bottom surface, and a semiconductor device mounted on the top surface of the substrate. A gap is provided between the semiconductor device and the top surface of the substrate. A pre-cut laminate epoxy sheet is disposed on the top surface of the substrate and around a perimeter of the semiconductor device.

Abstract: A semiconductor package structure including an encapsulating layer, a package substrate, and a conductive shielding layer is provided. The package substrate has a device region covered by the encapsulating layer and an edge region surrounding the device region and exposed from the encapsulating layer. The package substrate includes an insulating layer and a patterned conductive layer in a level of the insulating layer. The patterned conductive layer includes conductors in and along the edge region. The edge region is partially exposed from the conductors, as viewed from a top-view perspective. The conductive shielding layer covers and surrounds the encapsulating layer and is electrically connected to the conductors.

Abstract: A lighting device includes a lighting unit with two arms formed on two ends thereof. The arms each include at least one reception portion. Multiple attachments each have a slide and a clip. The slide of each attachment is slidably engaged with the at least one reception portion of each arm. The clip is pivotably connected to the slide. Each clip includes a slot so as to clip a hat visor. The clip is adjustable by sliding the slide relative to the at least one reception portion. Also, the clip is pivotable relative to the slide to adjust a direction of the slot. The lighting device is able to clip to a hat visor of different shapes by sliding the slide relative to the at least one reception, and by pivoting the clip relative to the slide.

Abstract: The present disclosure provides an oral drug composition including a prodrug and a carrier. The prodrug bonds an active drug to a spacer with a covalent bond, in which the spacer has a disulfide bond. The carrier is for carrying the prodrug with an efficient amount, and the carrier includes a ?-1,3-D-glucan.

Abstract: Systems and methods for processing a workpiece are provided. In one example, a method includes placing a workpiece on a workpiece support in a processing chamber. The workpiece has at least one material layer and at least one structure thereon. The method includes admitting a process gas into a plasma chamber, generating one or more species from the process gas, and filtering the one or more species to create a filtered mixture. The method further includes providing RF power to a bias electrode to generate a second mixture and exposing the workpiece to the second mixture to etch a least a portion of the material layer and to form a film on at least a portion of the material layer.

Abstract: An oral drug delivery system includes a biomimetic mineralized carrier and a yeast capsule. The biomimetic mineralized carrier has a surface with positive charge and includes a metal organic framework having an internal space and a biological macromolecule encapsulated in the internal space of the metal organic framework. A surface of the metal organic framework has a plurality of pores. The yeast capsule is composed of a ?-glucan cell-wall shell that removes a cytoplasm from yeast and has a surface with negative charge. The biomimetic mineralized carrier is loaded into the yeast capsule by an electrostatic force to form the oral drug delivery system.

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

Abstract: Apparatus, systems, and methods for conducting an etch removal process on a workpiece are provided. The method can include generating a plasma from a deposition process gas in a plasma chamber using a plasma source to deposit a passivation layer on certain layers of a high aspect ratio structure. The method can include generating a plasma from an etch process gas in a plasma chamber using a plasma source to remove certain layers from the high aspect ratio structure. The method can include removing silicon nitride layers at a faster etch rate than silicon dioxide layers on the high aspect ratio structure.

Abstract: A power saving system for underwater vehicles includes a control system, a power unit and a battery. The control system controls the power unit to drive the underwater vehicle, and generates an output driving value. The control system includes a calculation unit, a three-axis accelerometer and gyro and an underwater vehicle weight value. The calculation unit creates a correspondent acceleration value by the output driving value and the underwater vehicle weight value. The three-axis accelerometer and gyro detects the acceleration of the underwater vehicle by every less than 0.5 second interval, and generates an acceleration value. The control system compares the correspondent acceleration value and the acceleration value to control the output driving value so as to save battery power and elongate the range of travelling of the underwater vehicles.

Abstract: Systems and methods for processing a workpiece are provided. In one example, a method includes placing a workpiece on a workpiece support in a processing chamber. The method includes performing a spacer treatment process to expose the workpiece to species generated from a first process gas in a first plasma to perform a spacer treatment process on a spacer layer on the workpiece. The first plasma can be generated in the processing chamber. After performing the spacer treatment process, the method can include performing a spacer etch process to expose the workpiece to neutral radicals generated from a second process gas in a second plasma to etch at least a portion of the spacer layer on the workpiece. The second plasma can be generated in a plasma chamber that is remote from the processing chamber.