Abstract: Novel PMOS-bound and NMOS-bound diodes for ESD protection, together with their application circuits, are disclosed in this invention. The PMOS-bound (or NMOS bound) diode has a PMOS (or an NMOS) structure. The source/drain region enclosed by the control gate of the PMOS (or NMOS) is used as an anode (or cathode) of the PMOS-bound (or NMOS-bound) diode. The base of the PMOS (or NMOS) is used as a cathode (or anode) of the PMOS-bound (or NMOS-bound) diode. The control gate prevents any shallow trench isolation region from forming beside the p-n junction of the PMOS-bound (or NMOS-bound) diode, such that the ESD sustaining level doesn't suffer from the formation of the STI regions. Furthermore, by ensuring proper bias to the control gate during an ESD event, the turn-on speed of the PMOS-bound or NMOS-bound diode can be increased, such that the overall ESD level of an IC chip is improved.

Abstract: New level shifting circuits, one using dynamic current compensation and one using dynamic voltage equalization, are described. An input swings between a low supply and ground. An output swings between a high supply and ground. An inverter input is connected to the input of the level shifting circuit to form an inverted level shifting input. A first NMOS transistor has the gate tied to the level shifting input and the source tied to ground. A first PMOS transistor has the gate tied to the level shifting output, the source tied to the high supply, and the drain tied to the first NMOS drain. A second NMOS transistor has the gate tied to the inverted level shifter input, the source tied to the ground, and the drain tied to the level shifting output. A second PMOS transistor has the gate tied to the first NMOS drain, the source tied to the high supply, and the drain is tied to the level shifting output.