Abstract: A touch input device includes a base board, a circuit module having a free end portion and a connecting end portion, a metallic connecting member and an annular, metallic frame. The connecting member includes a positioning portion fixedly mounted to the connecting end portion of the circuit module, and an elastic arm extending from the positioning portion away from the connecting end portion and toward a free end portion in such a way to define a coupling groove that indents away therefrom. The frame is spaced apart from the circuit module and includes a coupling portion that is embossed from a side of the frame proximate to the connecting member, and that has a coupling block coupled to the coupling groove of the elastic arm.

Abstract: A touch display device at least including a gate driver is provided. The gate driver at least includes a pull-up control circuit, a pull-down control circuit and a pull-up output circuit. The pull-up control circuit sets the voltage level of a first node to a first voltage level. The pull-down control circuit is configured to set the voltage level of the first node to a second voltage level and includes a first transistor receiving an operation voltage. The second voltage level is lower than the first voltage level. The pull-up output circuit generates a scan signal according to the voltage level of the first node. During a first display period and a second display period, the operation voltage is equal to a first gate voltage. During a touch-sensing period, the operation voltage is equal to a second gate voltage that is lower than the first gate voltage.

Abstract: A solar cell device with improved performance and a method of fabricating the same is described. The solar cell includes a back contact layer formed on a substrate, an absorber layer formed on the back contact layer, a buffer layer formed on the absorber layer, and a front contact layer formed by depositing a transparent conductive oxide layer on the buffer layer and annealing the deposited TCO layer.

Abstract: A device and method of improving efficiency of a thin film solar cell by providing a back reflector between a back electrode layer and an absorber layer. Back reflector reflects sunlight photons back into the absorber layer to generate additional electrical energy. The device is a photovoltaic device comprising a substrate, a back electrode layer, a back reflector, an absorber layer, a buffer layer, and a front contact layer. The back reflector is formed as a plurality of parallel lines.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; nonionic polyacrylamide; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive having a negative zeta potential; and, optionally, a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten is inhibited as well as erosion of dielectrics underlying the tungsten.

Abstract: A device includes a substrate, and an alignment mark including a conductive through-substrate via (TSV) penetrating through the substrate.

Abstract: A display device including a panel having a gate driver is provided. The gate driver includes a multi-stage shift register. The N-th stage shift register includes a control module, a leakage compensation module, and an output module. The control module has a first terminal for receiving a first signal from the (N?M)-th stage shift register and a second terminal electrically connected to a node for transmitting a first signal to the node. The leakage compensation module has a third terminal electrically connected to the compensation voltage and a fourth terminal electrically connected to the node. The output module has a fifth terminal electrically connected to the node for receiving the first signal, and a sixth terminal for outputting a second signal of the N-th stage shift register for driving at least some parts of the pixel array. The compensation voltage charges the node during a touch sensing period.

Abstract: A process and composition are disclosed for polishing tungsten containing select quaternary phosphonium compounds at low concentrations to at least reduce corrosion rate of tungsten. The process and composition include providing a substrate containing tungsten; providing a stable polishing composition, containing, as initial components: water; an oxidizing agent; select quaternary phosphonium compounds at low concentrations to at least reduce corrosion rate; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten is polished away from the substrate, and corrosion rate of tungsten is reduced.

Abstract: The light source device includes a substrate, a light emitting unit mounted on the substrate, a frame disposed on the substrate, a metal shield fixed to an inner side of the frame and electrically coupled to the substrate, a light permeable member disposed on the frame, a cover plate disposed on the light permeable member and fixed to the frame, a detection unit electrically coupled to the substrate, and an uplift block that provides for the substrate to be disposed thereon.

Abstract: The present disclosure provides a neutron capture therapy system, including an accelerator for generating a charged particle beam, a neutron generator for generating a neutron beam having neutrons after irradiation by the charged particle beam, and a beam shaping assembly for shaping the neutron beam. The beam shaping assembly includes a moderator and a reflecting assembly surrounding the moderator. The neutron generator generates the neutrons after irradiation by the charged particle beam. The moderator moderates the neutrons generated by the neutron generator to a preset energy spectrum. The reflecting assembly includes a reflecting assembly to deflected neutrons back to the neutron beam and a supporting member to support the reflectors. A lead-antimony alloy is for the reflecting assembly to mitigate a creep effect that occurs when only a lead material is for the reflectors, thereby improving the structural strength of a beam shaping assembly.

Abstract: A device includes a substrate, and an alignment mark including a conductive through-substrate via (TSV) penetrating through the substrate.

Abstract: A chip packaging device is provided, which includes a main body unit, packaging unit and an aligning unit. The main body unit includes a mounting base, holder and a rotational platform. The packaging unit includes upper and lower bonding elements, upper and lower chips and a mask; a vertical axis is at the middle of the upper and the lower bonding elements, and a horizontal axis is above the lower bonding element. The aligning unit includes an aligning detector and a first focusing detector. When the lower chip and the mask are disposed on the lower bonding element, place the liquid sample in the mask and spread a packaging adhesive over the surface thereof; then, remove the mask and use the aligning detector and the first focusing detector to detect the position of the lower chip respectively, such that the chips can be aligned and bonded with each other.

Abstract: The present invention relates to a method for manufacturing a device for heat transmission, dissipation and highly efficient capillary siphoning action. The method comprises preparing a metal substrate; processing a surface of the metal substrate to form a rugged surface layer thereon; neutralizing, cleaning and drying the metal substrate to remove oil and rust thereon; placing the metal substrate into a first vacuum chamber for heating, deoxygenizing by hydrogen gas and ion bombarding to the rugged surface layer. Further, the metal substrate can be selectively subject to deposition, decomposition, degradation and reaction treatments for obtainment of a device for heat transmission, dissipation and highly efficient capillary siphoning action.

Abstract: The present invention relates to a method for manufacturing a device for heat transmission, dissipation and highly efficient capillary siphoning action. The method comprises preparing a metal substrate; processing a surface of the metal substrate to form a rugged surface layer thereon; neutralizing, cleaning and drying the metal substrate to remove oil and rust thereon; placing the metal substrate into a first vacuum chamber for heating, deoxygenizing by hydrogen gas and ion bombarding to the rugged surface layer. Further, the metal substrate can be selectively subject to deposition, decomposition, degradation and reaction treatments for obtainment of a device for heat transmission, dissipation and highly efficient capillary siphoning action.

Abstract: A solar cell device with improved performance and a method of fabricating the same is described. The solar cell includes a back contact layer formed on a substrate, an absorber layer formed on the back contact layer, a buffer layer formed on the absorber layer, and a front contact layer formed by depositing a transparent conductive oxide layer on the buffer layer and annealing the deposited TCO layer.

Abstract: A method of making a curved electrochromic film includes: disposing a UV curable adhesive layer between a first electrochromic member and a second electrochromic member to form an electrochromic film semi-product in flat form; arching the electrochromic film semi-product between the first and second bending members of a forming apparatus and by moving the first and second bending members toward each other; and curing the UV curable adhesive layer using a UV light source while the electrochromic film semi-product is arched. Forming apparatuses for forming a flat electrochromic film semi-product into a curved electrochromic film are also disclosed.

Abstract: A chip packaging device is provided, which includes a main body unit, packaging unit and an aligning unit. The main body unit includes a mounting base, holder and a rotational platform. The packaging unit includes upper and lower bonding elements, upper and lower chips and a mask; a vertical axis is at the middle of the upper and the lower bonding elements, and a horizontal axis is above the lower bonding element. The aligning unit includes an aligning detector and a first focusing detector. When the lower chip and the mask are disposed on the lower bonding element, place the liquid sample in the mask and spread a packaging adhesive over the surface thereof; then, remove the mask and use the aligning detector and the first focusing detector to detect the position of the lower chip respectively, such that the chips can be aligned and bonded with each other.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce static corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; guar gum; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, static corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A process for chemical mechanical polishing a substrate containing tungsten to reduce static corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics is disclosed. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; xanthan gum; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; optionally a surfactant; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, static corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce static corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; alginate; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, static corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).