Abstract: A motor control system includes an electric motor and inverter. The electric motor includes a stator, rotor, and winding structure. The stator includes an iron core with a plurality of slots formed therein along a radial direction of the stator. The winding structure has a plurality of hairpin wires with pins disposed in the slots. The winding structure is configured to provide a plurality of phase windings and each phase winding includes a plurality of motor windings. The inverter includes a switching controller configured to control the turning-on and turning-off of the motor windings of each phase winding of the winding structure. When the electric motor operates in a high-speed mode, the switching controller controls the turning-on and turning-off of the motor windings of each phase winding such that a number of the phase windings turned-on is ? less than a number of all the phase windings.

Abstract: A limb prosthesis including a palm, a forearm, an upper arm, an elbow joint and a wrist joint is provided. The palm has a first pivot and a first lock set. The upper arm has a socket. The elbow joint connects the forearm to the upper arm. The wrist joint includes a first connecting rod connected to the forearm. The first pivot rotatably penetrates through the first connecting rod. The first lock set is locked to the first pivot. A first wedge surface of the first lock set contacts a second wedge surface of the first connecting rod. By adjusting a distance between the first lock set and the first pivot, a magnitude of a forward force between the first wedge surface and the second wedge surface is adjusted, such that the palm is fixed relative to the first connecting rod or rotatable around an axial direction perpendicular to an extending direction of the forearm.

Abstract: The present application provides a method for rejuvenating cells, characterized in that providing a cell to culture in a composition for a suitable period of time of time, wherein the composition is obtained by adding a chitosan solution to a cultural environment. The present application further provides a composition for rejuvenating cells, comprising a chitosan solution in a cultural environment.

Abstract: A method of making a curved electrochromic film includes: disposing a UV curable adhesive layer between a first electrochromic member and a second electrochromic member to form an electrochromic film semi-product in flat form; arching the electrochromic film semi-product between the first and second bending members of a forming apparatus and by moving the first and second bending members toward each other; and curing the UV curable adhesive layer using a UV light source while the electrochromic film semi-product is arched. Forming apparatuses for forming a flat electrochromic film semi-product into a curved electrochromic film are also disclosed.

Abstract: An additive manufacturing method for a 3D object is provided and includes (a) providing a 3D digital model of the 3D object; (b) dividing the 3D digital model into repeat arrangement of at least one type of polyhedral 3D units and an X-Y plane is an acute angle or an obtuse angle; (c) cutting the 3D digital model along a Z-axis into a plurality of 2D slices; (d) defining a scanning path covering one of the 2D slices; (e) providing an energy beam to a material on a working plane along the scanning path to form a construction layer corresponding to the one of the 2D slices; and (f) repeating the steps (d) and (e) to build up the 3D object by adding a plurality of construction layers in sequence.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a thiolalkoxy compound; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A device includes a substrate, and an alignment mark including a conductive through-substrate via (TSV) penetrating through the substrate.

Abstract: A medication concentration detecting device includes a medicine container, a three-way pipe, a light emitting member, a first light receiver and a processor. The medicine container has a chamber configured for accommodating nebulized medicine. The three-way pipe has a passageway connected to the chamber for the nebulized medicine to flow along the passageway. The light emitting member is disposed on the three-way pipe and configured for emitting a light beam toward the passageway. The first light receiver is disposed on the three-way pipe and configured for receiving the light beam and outputting a luminous flux signal. The processor is connected to the first light receiver and configured for calculating a luminous flux reference value according to the luminous flux signal. The luminous flux reference value is used for determining whether outputs a low nebulized medicine concentration warning.

Abstract: A gate driving circuit includes a plurality of shift registers arranged to output the gate driving signals in sequence. The shift registers are divided into groups arranged in sequence, wherein the driving signal from a first one of a N+1th group of shift registers is next to the driving signal from a first one of a Nth group of shift registers; and at least one first compensation circuit connected to the last one of the Nth group of shift registers and the first one of the N+1th group of shift registers, wherein the first compensation circuit provides a first control signal to enable the last one of the Nth group of shift registers to perform signal holding, and provides a second control signal to enable the first one of the N+1th group of shift registers to perform pre-charging, wherein N is an integer greater than zero.

Abstract: A touch display device at least including a gate driver is provided. The gate driver at least includes a pull-up control circuit, a pull-down control circuit and a pull-up output circuit. The pull-up control circuit sets the voltage level of a first node to a first voltage level. The pull-down control circuit is configured to set the voltage level of the first node to a second voltage level and includes a first transistor receiving an operation voltage. The second voltage level is lower than the first voltage level. The pull-up output circuit generates a scan signal according to the voltage level of the first node. During a first display period and a second display period, the operation voltage is equal to a first gate voltage. During a touch-sensing period, the operation voltage is equal to a second gate voltage that is lower than the first gate voltage.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising: providing the substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a chitosan; a dicarboxylic acid, wherein the dicarboxylic acid is selected from the group consisting of propanedioic acid and 2-hydroxypropanedioic acid; a source of iron ions; a colloidal silica abrasive with a positive surface charge; and, optionally pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) and some of the titanium (Ti) is polished away from the substrate with a removal selectivity for the tungsten (W) relative to the titanium (Ti).

Abstract: A process for chemical mechanical polishing a substrate containing titanium nitride and titanium is provided comprising: providing a polishing composition, containing, as initial components: water; an oxidizing agent; a linear polyalkylenimine polymer; a colloidal silica abrasive with a positive surface charge; a carboxylic acid; a source of ferric ions; and, optionally pH adjusting agent; wherein the polishing composition has a pH of 1 to 4; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein at least some of the titanium nitride and at least some of the titanium is polished away with a selectivity between titanium nitride and titanium.

Abstract: A method of displaying frame rate includes the following steps. First, a quantity of image display units of a display is detected. Then, a plurality of refresh rate images are provided according to the quantity of image display units and by using an on-screen display manipulation function. A refresh rate of the display is calculated, to provide refresh rate data. One of the refresh rate images corresponding to the refresh rate data is determined, and is displayed on the display.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising: providing the substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; an allylamine additive; a carboxylic acid; a source of iron ions; a colloidal silica abrasive with a positive surface charge; and, optionally pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein the tungsten (W) is selectively polished away from the substrate relative to the titanium (Ti).

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a polyglycol or polyglycol derivative; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: The present invention provides substantially nonionic brush polymers having pendant polyether groups, preferably poly(alkylene glycol) groups, which polymers are useful as synthetic polymer substitutes for cellulose ethers in mortars and hydraulic binders. The brush polymers are preferably crosslinked, such as with ethylene glycol di(meth)acrylates.

Abstract: A motor control system includes an electric motor and inverter. The electric motor includes a stator, rotor, and winding structure. The stator includes an iron core with a plurality of slots formed therein along a radial direction of the stator. The winding structure has a plurality of hairpin wires with pins disposed in the slots. The winding structure is configured to provide a plurality of phase windings and each phase winding includes a plurality of motor windings. The inverter includes a switching controller configured to control the turning-on and turning-off of the motor windings of each phase winding of the winding structure. When the electric motor operates in a high-speed mode, the switching controller controls the turning-on and turning-off of the motor windings of each phase winding such that a number of the phase windings turned-on is 1/3 less than a number of all the phase windings.

Abstract: A device includes a substrate, and an alignment mark including a conductive through-substrate via (TSV) penetrating through the substrate.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a thiolalkoxy compound; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a polyglycol or polyglycol derivative; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).