Abstract: Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

Abstract: The invention provides a method of forming porous polyurethane polishing pad that includes feeding liquid polyurethane onto a web sheet with a doctor blade while back tensioning the web. Coagulating liquid polyurethane onto the web sheet forms a two-layer substrate. The two-layer substrate has a porous matrix wherein the porous matrix has large pores extending upward from a base surface and open to an upper surface. Spring-arm sections connect lower and upper sections of the large pores.

Abstract: The invention provides a porous polyurethane polishing pad that includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores extend to the top polishing surface and have lower and upper sections with a vertical orientation. The lower and upper sections are offset in a horizontal direction. Middle-sized pores with a columnar shape and a vertical orientation originate adjacent the middle sections and small pores with a columnar shape and a vertical orientation originate between the middle-sized pores. The pores combine for increasing compressibility of the polishing pad and contact area of the top polishing surface during polishing.

Abstract: The invention provides a porous polyurethane polishing pad that includes a porous matrix. The matrix has large pores that extend upward from a base surface and open to an upper surface. The large pores are interconnected with tertiary pores, a portion of the large pores is open to a top polishing surface and at least a portion of the large pores extend to the top polishing surface. Spring-arm sections connect lower and upper sections of the large pores. The spring-arm sections all are in a same horizontal direction as measured from the vertical orientation and they combine for increasing compressibility of the polishing pad and contact area of the top polishing surface during polishing.

Abstract: An optical lens is provided. The optical lens includes a first lens element to a fifth lens element sequentially arranged from a light incident side to a light exit side. An image generation device is disposed at the light incident side, and the optical lens is configured to receive an image beam provided by the image generation device. The image beam forms a stop at the light exit side. The stop has a minimum cross-sectional area of beam shrinkage of the image beam. The optical lens provided by the invention exhibits good optical quality and thermal stability.

Abstract: A light guide module is provided. The light guide module includes a first light guide unit, a second light guide unit and an elastic unit. The elastic unit is disposed between the first light guide unit and the second light guide unit. One side of the elastic unit is connected to the first light guide unit, and the other side of the elastic unit is connected to the second light guide unit. In an initial state, a first distance is formed between the first light guide unit and the second light guide unit. In an extended state, the elastic unit is elastically deformed, and a second distance is formed between the first light guide unit and the second light guide unit.

Abstract: A light guide module is provided. The light guide module includes a first light guide unit, a second light guide unit and an elastic unit. The elastic unit is disposed between the first light guide unit and the second light guide unit. One side of the elastic unit is connected to the first light guide unit, and the other side of the elastic unit is connected to the second light guide unit. In an initial state, a first distance is formed between the first light guide unit and the second light guide unit. In an extended state, the elastic unit is elastically deformed, and a second distance is formed between the first light guide unit and the second light guide unit.

Abstract: The present invention provides an imprinting method, which includes the steps of: adding a soluble material to a master mold; solidifying the soluble material to form a soluble mold having a mold pattern; adhering a taking device to the soluble mold to separate the soluble mold from the master mold; placing the soluble mold on a polymer layer of a workpiece for imprint; applying a high temperature and a pressure to the soluble mold to allow the polymer layer having an imprint pattern corresponding to the mold pattern and being solidified, and to remove the taking device from the soluble mold; and providing a solvent to dissolve the soluble mold to obtain an imprint workpiece having the imprint pattern.

Abstract: A touch input device includes a frame unit, a circuit unit and a touch pad. The circuit unit includes a circuit board, a dome-shaped actuating member including an actuating portion and a resilient metal sheet connected between the actuating portion and the circuit board, and a noise reduction member having a main body connected to the resilient metal sheet, made of an elastic material and formed with a recess surrounding the actuating portion. A touch surface of the touch pad is touchable to push the circuit unit toward the block member, such that the actuating portion contacts the block member to deform the resilient metal sheet to electrically connect the actuating portion with the circuit board.

Abstract: A beam pattern design method is adapted to an antenna array system. An antenna array of the antenna array system includes a plurality of antenna devices. The beam pattern design method includes the following procedures. A plurality of first virtual beamforming vectors having a first resolution are set. Each of the plurality of first virtual beamforming vectors corresponds to all the antenna devices in the antenna array. Corresponding weights are respectively assigned to phases of the plurality of first virtual beamforming vectors to generate a plurality of correspondingly weighted first virtual beamforming vectors. The plurality of correspondingly weighted first virtual beamforming vectors are linearly combined to synthesize a provisional vector having a second resolution. The phase of each element in the provisional vector is extracted, and a fixed amplitude is provided to the extracted phase of each element in the provisional vector to generate a final beamforming vector.

Abstract: A sample chip for electron microscope includes a first substrate having a film layer, a buffer layer, and a body layer, a spacing layer positioned below the first substrate, and a second substrate positioned below the spacing layer. The buffer layer is positioned on the film layer and has a buffer opening corresponding to an area of the film layer, the body layer is positioned on the buffer layer and has a body opening corresponding to the buffer opening of the buffer layer to expose the area of the film layer corresponding to the buffer opening, the body layer has a thickness of 10 ?m-800 ?m, and etching properties of the film layer, the buffer layer, and the body layer are different. A specimen accommodating space is defined in the spacing layer to correspond to the area of the film layer corresponding to the buffer opening.

Abstract: An imprint method provided herein includes the steps of: adding a soluble material to a master mold; solidifying the soluble material to form a soluble mold having a mold pattern; adhering a dissociable tape to the soluble mold to separate the soluble mold from the master mold; placing the soluble mold onto a polymer layer of a workpiece for imprint; applying a high temperature and a pressure to the soluble mold to allow the polymer layer having an imprint pattern corresponding to the mold pattern and solidification, and to dissociate the tape; and providing a solvent to dissolve the soluble mold to obtain an imprint workpiece having the imprint pattern.

Abstract: The disclosure provides an electronic device including a panel. The panel includes a display area, a first peripheral area and a plurality of driving units. The display area includes a plurality of odd-numbered gate lines and a plurality of even-numbered gate lines. The first peripheral area is disposed adjacent to the display area. The driving units are disposed in the first peripheral area and include a first driving unit group and a second driving unit group. The first driving unit group includes N driving units which correspond to N gate lines among first 2N of the odd-numbered gate lines or to N gate lines among first 2N of the even-numbered gate lines, wherein N is a positive integer greater than 1. The second driving unit group is disposed adjacent to the first driving unit group and includes 2P driving units which respectively correspond to P odd-numbered gate lines and P even-numbered gate lines.

Abstract: A process and composition are disclosed for polishing tungsten containing select quaternary phosphonium compounds at low concentrations to at least reduce corrosion rate of tungsten. The process and composition include providing a substrate containing tungsten; providing a stable polishing composition, containing, as initial components: water; an oxidizing agent; select quaternary phosphonium compounds at low concentrations to at least reduce corrosion rate; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten is polished away from the substrate, and corrosion rate of tungsten is reduced.

Abstract: A transition structure for millimeter wave is provided. The transition structure includes a first layer signal element coupled to an end of a first transmission line and a plurality of first layer ground elements surrounding the end of the first transmission line equidistantly from the end of the first transmission line and disposed along two opposite sides of a strip body of the first transmission line equidistantly from the strip body of the first transmission line. The transition structure further includes an intermediate layer signal element coupled to the first layer signal element and a plurality of intermediate layer ground elements surrounding the intermediate layer signal element quasi-coaxially. A multilayer transition structure including a multilayer structure and the transition structure is also provided. Therefore, the problem of operating frequency caused by the thickness of the multilayer structure can be overcome, thereby increasing the resonance frequency of the multilayer structure.

Abstract: An antennas-in-package (AiP) verification board is provided, which includes a carrier board configured for disposing an antenna array or an electronic circuit; and a plurality of SMPM connectors. The plurality of SMPM connectors are arranged in an array on the carrier board and electrically connected with the antenna array or the electronic circuit of the carrier board for testing the characteristics of the antenna array on the carrier board or the characteristics of the electronic circuit on the carrier board. The AiP verification board is fixed on a beamforming test platform. In addition to the aforementioned AiP verification board, an AiP verification board including a plurality of adaptor structures and an AiP verification board including a plurality of connectors and a plurality of adaptor structures are also provided.

Abstract: Provided is a rapid over-the-air (OTA) production line test platform, including a device under test (DUT), an antenna array and two reflecting plates. The DUT has a beamforming function. The antenna array is arranged opposite to the DUT, and emits beams with beamforming. Two reflecting plates are disposed opposite to each other, and are arranged between the DUT and the antenna array. The beam OTA test of the DUT is carried out by propagation of the beams between the antenna array, the DUT and the two reflecting plates. Accordingly, the test time can be greatly shortened and the cost of test can be effectively reduced. In addition to the above-mentioned rapid OTA production line test platform, platforms for performing the OTA production line test by using horn antenna arrays together with bending waveguides and using a 3D elliptic curve are also provided.

Abstract: A device includes a substrate, and an alignment mark including a conductive through-substrate via (TSV) penetrating through the substrate.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; nonionic polyacrylamide; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive having a negative zeta potential; and, optionally, a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten is inhibited as well as erosion of dielectrics underlying the tungsten.

Abstract: A power converter and a method for receiving an input voltage and providing an output voltage is presented. The power converter has a switching circuit to generate the output voltage. The switching circuit has a first switch, a switch control circuit arranged to selectively operate the first switch in a first state or a second state. There is a ripple reduction circuit to set a first state duration based on a property of a load current. The load current is a current that the power converter provides to a load that is coupled to the output voltage.