Abstract: A process and composition are disclosed for polishing tungsten containing select quaternary phosphonium compounds at low concentrations to at least reduce corrosion rate of tungsten. The process and composition include providing a substrate containing tungsten; providing a stable polishing composition, containing, as initial components: water; an oxidizing agent; select quaternary phosphonium compounds at low concentrations to at least reduce corrosion rate; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten is polished away from the substrate, and corrosion rate of tungsten is reduced.

Abstract: A card module includes a transceiver, multiple connector interfaces that are each matable with a system connector of a respective type, a detection mechanism and a switching component. The detection mechanism can detect any one of the multiple connector interfaces being mated with the system connector of the respective type. Based on the respective type of the mated system connector, the switching component implements a switch state to connected the mated system connector to the transceiver.

Abstract: A computer aided method for analyzing fibrosis is provided. First, a segmentation algorithm is performed on a medical image to obtain a segmentation image. Circular fibrosis is detected according to the segmentation image to determine a score. In some cases, it is also necessary to determine a number of fibrosis bridges and the condition of fiber expansion.

Abstract: A process for chemical mechanical polishing a substrate containing titanium nitride and titanium is provided comprising: providing a polishing composition, containing, as initial components: water; an oxidizing agent; a linear polyalkylenimine polymer; a colloidal silica abrasive with a positive surface charge; a carboxylic acid; a source of ferric ions; and, optionally pH adjusting agent; wherein the polishing composition has a pH of 1 to 4; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein at least some of the titanium nitride and at least some of the titanium is polished away with a selectivity between titanium nitride and titanium.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising: providing the substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; an allylamine additive; a carboxylic acid; a source of iron ions; a colloidal silica abrasive with a positive surface charge; and, optionally pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein the tungsten (W) is selectively polished away from the substrate relative to the titanium (Ti).

Abstract: A solar cell with a molybdenum back electrode layer and a molybdenum selenide ohmic contact layer over the molybdenum back electrode, is provided. The molybdenum selenide layer includes an accurately controlled thickness. A distinct interface exists between the molybdenum back electrode layer and the molybdenum silicide layer. The molybdenum silicide layer is produced by forming a molybdenum layer or a molybdenum nitride layer or a molybdenum oxide layer over an initially formed molybdenum layer such that an interface exists between the two layers. A selenization and sulfurization process is carried out to selectively convert the molybdenum-containing layer to molybdenum selenide but not the original molybdenum back electrode layer which remains as a molybdenum layer.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce static corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; guar gum; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, static corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: The disclosure relates to ankle foot orthosis including foot plate, lower leg piece, first and second connecting parts, and pin. The first connecting part is connected to the foot plate, the second connecting part is connected to the lower leg piece, the first connecting part has an engagement portion, the second connecting part has a groove and an opening connected to the groove, the first connecting part is pivotably engaged with the second connecting part, the pin is detachably disposed on the first connecting part of the first pivoting mechanism, and the second connecting part has a first stopper and a second stopper spaced apart from each other. The first pivoting mechanism has a first detachable state; when the first pivoting mechanism is in first detachable state, the engagement portion is located at the opening and is detachable from the groove via the opening.

Abstract: The invention provides a gate driving circuit for an in-cell touch panel to improve the issue wherein the undesired falling time of a pre-stage shift register and the undesired rising time of a next-stage shift register during a touch sensing period, in which the undesired falling time and the undesired rising time are caused by the output signal of the shift register cannot be correctly transmitted to the pre-stage shift register and the next-stage shift register during the touch sensing period.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten to reduce static corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics is disclosed. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; xanthan gum; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; optionally a surfactant; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, static corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce static corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; alginate; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive; and, optionally a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) is polished away from the substrate, static corrosion rate is reduced, dishing of the tungsten (W) is inhibited as well as erosion of dielectrics underlying the tungsten (W).

Abstract: A process for chemical mechanical polishing a substrate containing tungsten is disclosed to reduce corrosion rate and inhibit dishing of the tungsten and erosion of underlying dielectrics. The process includes providing a substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; nonionic polyacrylamide; a dicarboxylic acid, a source of iron ions; a colloidal silica abrasive having a negative zeta potential; and, optionally, a pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten is polished away from the substrate, corrosion rate is reduced, dishing of the tungsten is inhibited as well as erosion of dielectrics underlying the tungsten.

Abstract: A method and apparatus for controlling a cellulosic pulp process for producing a pulp product having a desired pulp property is disclosed. The method involves illuminating an in-process portion of pulp using a first wavelength of light, and receiving a scattered light spectrum from the illuminated portion of pulp, the scattered light spectrum including spectral components that have been shifted in wavelength through interaction with a constituent of the illuminated portion of pulp. The method also involves filtering the scattered light spectrum to separate the spectral components, and identifying spectral features in the filtered scattered light spectrum that correspond to the pulp property. The method further involves generating a control signal for controlling the pulp process based on variations in the identified spectral features to cause the pulp property to fall within a desired range.

Abstract: A limb prosthesis including a palm, a forearm, an upper arm, an elbow joint and a wrist joint is provided. The palm has a first pivot and a first lock set. The upper arm has a socket. The elbow joint connects the forearm to the upper arm. The wrist joint includes a first connecting rod connected to the forearm. The first pivot rotatably penetrates through the first connecting rod. The first lock set is locked to the first pivot. A first wedge surface of the first lock set contacts a second wedge surface of the first connecting rod. By adjusting a distance between the first lock set and the first pivot, a magnitude of a forward force between the first wedge surface and the second wedge surface is adjusted, such that the palm is fixed relative to the first connecting rod or rotatable around an axial direction perpendicular to an extending direction of the forearm.

Abstract: The present invention provides a polishing roll capable of, for example, realizing three-dimensional polishing of hard materials such as sapphire glass at a high removal amount. The polishing roll is a cylindrical polishing roll capable of rotating about a central axis, characterized in that the polishing roll includes a core part serving as a central axis to which torque is applied, an intermediate part having a cross-section concentric with the core part, and a polishing part disposed on the outer peripheral surface of the intermediate part, and the intermediate part is made of a cushion material that is softer than the polishing part.

Abstract: A sample chip for electron microscope includes a first substrate having a film layer, a buffer layer, and a body layer, a spacing layer positioned below the first substrate, and a second substrate positioned below the spacing layer. The buffer layer is positioned on the film layer and has a buffer opening corresponding to an area of the film layer, the body layer is positioned on the buffer layer and has a body opening corresponding to the buffer opening of the buffer layer to expose the area of the film layer corresponding to the buffer opening, the body layer has a thickness of 10 ?m-800 ?m, and etching properties of the film layer, the buffer layer, and the body layer are different. A specimen accommodating space is defined in the spacing layer to correspond to the area of the film layer corresponding to the buffer opening.

Abstract: A neutron capture therapy system and a target for a particle beam generating device, which may improve the heat dissipation performance of the target, reduce blistering and extend the service life of the target. The neutron capture therapy system includes a neutron generating device and a beam shaping assembly. The neutron generating device includes an accelerator and a target, and a charged particle beam generated by acceleration of the accelerator interacts with the target to generate a neutron beam. The target includes an acting layer, a backing layer and a heat dissipating layer, the acting layer interacts with the charged particle beam to generate the neutron beam, the base layer supports the action layer, and the heat dissipating layer includes a tubular member composed of tubes arranged side by side.

Abstract: A display device including a panel having a gate driver is provided. The gate driver includes a multi-stage shift register. The N-th stage shift register includes a control module, a leakage compensation module, and an output module. The control module has a first terminal for receiving a first signal from the (N?M)-th stage shift register and a second terminal electrically connected to a node for transmitting a first signal to the node. The leakage compensation module has a third terminal electrically connected to the compensation voltage and a fourth terminal electrically connected to the node. The output module has a fifth terminal electrically connected to the node for receiving the first signal, and a sixth terminal for outputting a second signal of the N-th stage shift register for driving at least some parts of the pixel array. The compensation voltage charges the node during a touch sensing period.

Abstract: A card module includes a transceiver, multiple connector interfaces that are each matable with a system connector of a respective type, a detection mechanism and a switching component. The detection mechanism can detect any one of the multiple connector interfaces being mated with the system connector of the respective type. Based on the respective type of the mated system connector, the switching component implements a switch state to connected the mated system connector to the transceiver.

Abstract: A substrate carrier, includes: a unitary body fabricated from a single block of graphite, wherein the body comprises a back plate, and a pair of spaced apart, substantially parallel, side rails, wherein each of the side rails comprises: an inwardly facing surface extending outwardly of the back plate; a longitudinally extending selenium vapor bore formed therein, a top end of the selenium vapor bore being open and configured for coupling to a selenium supply container for receiving selenium vapor by gravity, a bottom end of the selenium vapor bore being closed; an inwardly directed selenium vapor channel; a plurality of selenium vapor outlets disposed between the selenium vapor bore and the inwardly directed selenium vapor channel so as provide a plurality of conduits between the selenium vapor bore and the selenium vapor channel; and, a longitudinally extending engagement slot formed in the inwardly facing surface of each side rail adjacent the back plate to engage and hold a substrate in proximity to the ba