Abstract: The present invention relates generally to methods of treating cancer with arginine deiminase, and in particular pegylated arginine deiminase.

Abstract: The present disclosure is directed to a semiconductor structure that includes a semiconductor substrate. A first interconnect layer is disposed over the semiconductor substrate. The first interconnect layer includes a first dielectric material having a conductive body embedded therein. The conductive body includes a first sidewall, a second sidewall, and a bottom surface. A spacer element has a sidewall which contacts the first sidewall of the conductive body and which contacts the bottom surface of the conductive body. A second interconnect layer overlies the first interconnect layer and includes a second dielectric material with at least one via therein. The at least one via is filled with a conductive material which is electrically coupled to the conductive body of the first interconnect layer.

Abstract: A via opening including an etch stop layer (ESL) opening and methods of forming the same are provided which can be used in the back end of line (BEOL) process of IC fabrication. A metal feature is provided with a first part within a dielectric layer and with a top surface. An ESL is formed with a bottom surface of the ESL above and in contact with the dielectric layer, and a top surface of the ESL above the bottom surface of the ESL. An opening at the ESL is formed exposing the top surface of the metal feature; wherein the opening at the ESL has a bottom edge of the opening above the bottom surface of the ESL, a first sidewall of the opening at a first side of the metal feature, and a second sidewall of the opening at a second side of the metal feature.

Abstract: A fishing lure light emitting device includes a body, a light guiding bar, and a light emitting member. The body has a holder. The light guiding bar is embedded in the body. One end of the light guiding bar has a light receiving portion connected in the holder. The light emitting member includes a base and a light emitter. The base is detachably inserted into the holder. The light emitter is received in the holder and faces the light receiving portion of the light guiding bar. Since the base can be detached from the holder of the body, the light emitting member can be assembled to different bodies.

Abstract: A computer-implemented method for tracking one or more objects in a sequence of images includes generating a dictionary based on object locations in a first image included in the sequence of images. One or more object landmark candidates are identified in the sequence of images and a plurality of tracking hypothesis for the object landmark candidates are generated. A first tracking hypothesis is selected from the plurality of tracking hypothesis based on the dictionary.

Abstract: A via or pillar structure, and a method of forming, is provided. In an embodiment, a polymer layer is formed having openings exposing portions of an underlying conductive pad. A conductive layer is formed over the polymer layer, filling the openings. The dies are covered with a molding material and a planarization process is performed to form pillars in the openings. In another embodiment, pillars are formed and then a polymer layer is formed over the pillars. The dies are covered with a molding material and a planarization process is performed to expose the pillars. In yet another embodiment, pillars are formed and a molding material is formed directly over the pillars. A planarization process is performed to expose the pillars. In still yet another embodiment, bumps are formed and a molding material is formed directly over the bumps. A planarization process is performed to expose the bumps.

Abstract: A semiconductor package includes a semiconductor substrate, a contact pad overlying the semiconductor substrate, an interconnect layer overlying the contact pad, a passivation layer formed between the contact pad and the interconnect layer, a bump overlying the interconnect layer, and a protection layer overlying the interconnect layer and the passivation layer and covering a lower portion of the bump. The protection layer includes a curved surface region.

Abstract: A touch system using a processor to configure a touch detection architecture and including a sensor unit, a connection unit, a touch scan unit, a touch detection unit, and a processor unit. The sensor unit has a plurality of sensors. The connection unit determines a sensors-joined configuration of the plurality of sensors according to at least one connection control signal. The touch scan unit coupling at least one touch signal to the connection unit according to at least one scan configuration signal. The touch detection unit outputting the touch signal and deriving touch information from a parameter of the touch signal according to at least one operation mode configuration signal. The processor unit outputting the at least one connection control signal, the scan configuration signal, and the operation mode configuration signal according to a content of a control table, and receiving the touch information.

Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.

Abstract: An interconnection structure includes a first dielectric layer, a bottom conductive feature present in the first dielectric layer, a second dielectric layer present on the first dielectric layer, an aluminum-containing etch stop layer present between the first dielectric layer and the second dielectric layer, an upper conductive via present at least in the second dielectric layer and electrically connected to the bottom conductive feature, and at least one aluminum-containing fragment present at least at a bottom corner of the upper conductive via.

Abstract: A method of forming an integrated circuit device includes forming a conductive element over a substrate, wherein the conductive element is over an under bump metallurgy (UBM) layer, and the UBM layer comprises a first UBM layer and a second UBM layer over the first UBM layer. The method further includes etching the second UBM layer to expose a portion of the first UBM layer beyond a periphery of the conductive element. The method further includes forming a protection layer over sidewalls of the conductive element, over sidewalls of the second UBM layer and over a top surface of the first UBM layer. The method further includes etching the first UBM layer to remove a portion of the first UBM layer. The method further includes forming a cap layer over a top surface of the conductive element.

Abstract: An isolated Clostridium cadaveris ITRI04005 and its uses are provided. The isolated Clostridium cadaveris ITRI04005 was deposited at German Collection of Microorganisms and Cell Cultures (Deutsche Sammlung von Mikroorganismen and Zellkulturen GmbH, DSMZ) under the accession number DSM 32078.

Abstract: The disclosure illustrates a fish lure vocalization device which includes a main body defining an enclosed chamber inside. A vocalization module, a control module and a battery are disposed in the chamber. The vocalization module has a box in which an electromagnet and a metal diaphragm are disposed. The control module is used to control the electromagnet. A magnet is disposed on the metal diaphragm. The magnet is attracted by the electromagnet after the magnetic force is produced by electrifying the electromagnet, to deform the metal diaphragm to make sound. Thereby, the purpose of luring the fish to take the bait may be achieved.

Abstract: A fishing lure light emitting device includes a body, a light guiding bar, and a light emitting member. The body has a holder. The light guiding bar is embedded in the body. One end of the light guiding bar has a light receiving portion connected in the holder. The light emitting member includes a base and a light emitter. The base is detachably inserted into the holder. The light emitter is received in the holder and faces the light receiving portion of the light guiding bar. Since the base can be detached from the holder of the body, the light emitting member can be assembled to different bodies.

Abstract: A fishing lure power charging device includes a body. A circuit board is assembled in the body. The circuit board has a power switching circuit and a charging circuit. A light emitter is assembled in the body and electrically connected to the power switching circuit, so that the light emitter emits light when the light emitter is electrically conducted. A battery is assembled in the body and electrically connected to the charging circuit, so that the battery is chargeable. Two conductive members are electrically connected to the circuit board, separately assembled to the body, and exposed from the body. A light sensing switch is assembled to the body and electrically connected to the circuit board, so that the light sensing switch switches the two conductive members to conduct with the power switching circuit or the charging circuit based on the light illuminating on the light sensing switch.

Abstract: A semiconductor device including a dielectric layer formed on the surface of a post-passivation interconnect (PPI) structures. A polymer layer is formed on the dielectric layer and patterned with an opening to expose a portion of the dielectric layer. The exposed portion of the dielectric layer is then removed to expose a portion of the PPI structure. A solder bump is then formed over and electrically connected to the first portion of the PPI structure.

Abstract: A method of manufacturing a packaging device may include: forming a plurality of through-substrate vias (TSVs) in a substrate, wherein each of the plurality of TSVs has a protruding portion extending away from a major surface of the substrate. A seed layer may be forming over the protruding portions of the plurality of TSVs, and a conductive ball may be coupled to the seed layer and the protruding portion of each of the plurality of TSVs. The seed layer and the protruding portion of each of the plurality of TSVs may extend into an interior region of the conductive ball.

Abstract: A stable manufacturing efficiency generating method includes the steps: generating a real-time grouping parameter set according to a plurality of historical efficiency values; grouping a plurality of real-time efficiency values corresponding to a product to generate a plurality of real-time efficiency groups according to the real-time grouping parameter set; selecting one of the real-time efficiency groups having most real-time efficiency values as a stable efficiency group; and generating a stable manufacturing efficiency value according to an average value of the real-time efficiency values in the stable efficiency group.

Abstract: Methods and systems for detecting properties of sample tubes in a laboratory environment include a drawer vision system that can be trained and calibrated. Images of a tube tray captured by at least one camera are analyzed to extract image patches that allow a processor to automatically determine if a tube slot is occupied, if the tube has a cap, and if the tube has a tube top cup. The processor can be trained using a random forest technique and a plurality of training image patches. Cameras can be calibrated using a three-dimensional calibration target that can be inserted into the drawer.

Abstract: The present disclosure is directed to a semiconductor structure and a method of manufacturing a semiconductor structure in which a spacer element is formed adjacent to a metal body embedded in a first dielectric layer of a first interconnect layer. A via which is misaligned relative to an edge of the metal body is formed in a second dielectric material in second interconnect layer disposed over the first interconnect layer and filled with a conductive material which is electrically coupled to the metal body. The method allows for formation of an interconnect structure without encountering the various problems presented by via substructure defects in the dielectric material of the first interconnect layer, as well as eliminating conventional gap-fill metallization issues.