Abstract: A scalable video bitstream may have an H.264/AVC compatible base layer (BL) and a scalable enhancement layer (EL), where scalability refers to color bit depth. The H.264/AVC scalability extension SVC provides also other types of scalability, e.g. spatial scalability where the number of pixels in BL and EL are different. According to the invention, BL information is upsampled (TUp,BDUp) in two logical steps in adaptive order, one being texture upsampling and the other being bit depth upsampling. Texture upsampling is a process that increases the number of pixels, and bit depth upsampling is a process that increases the number of values that each pixel can have, corresponding to the pixels color intensity. The upsampled BL data are used to predict the collocated EL. A prediction order indication is transferred so that the decoder can upsample BL information in the same manner as the encoder, wherein the upsampling refers to spatial and bit depth characteristics.

Abstract: A method and system for detecting a virtual electrode (VE) on a coronary sinus (CS) catheter in a fluoroscopic image sequence is disclosed. User inputs indicating locations of CS catheter electrodes and a location of a VE are received. A catheter electrode model and a VE part model is initialized in a first frame of the fluoroscopic image sequence. The VE is tracked by detecting electrode position candidates and catheter body point candidates in the subsequent frames of the fluoroscopic image sequence using respective trained detectors, tracking the catheter electrode model in the subsequent frames based on the detected electrode position candidates, generating VE part hypotheses in the subsequent frames based on detection of the most proximal electrode (MPE) in each subsequent frame, calculating a probability score for each of the VE part hypotheses, and selecting an VE part hypothesis with the highest probability score.

Abstract: A motherboard includes a first circuit board, a second circuit board, and wiring. The first circuit board includes at least a programmable chip, a programming interface, a first data interface, and at least one jumper corresponding to the programmable chip. The second circuit board includes a CPU (central processing unit), a RAM unit, and at least a second data interface corresponding to the programmable chip. The motherboard of the present disclosure concentrates programmable chips on the first circuit board, thereby providing a unified programming interface to enhance the convenience of programming multiple programmable chips.

Abstract: A resistive switching memory element including a doped silicon electrode is described, including a first electrode comprising doped silicon having a first work function, a second electrode having a second work function that is different from the first work function by between 0.1 and 1.0 electron volts (eV), a metal oxide layer between the first electrode and the second electrode, the metal oxide layer switches using bulk-mediated switching and has a bandgap of greater than 4 eV, and the memory element switches from a low resistance state to a high resistance state and vice versa.

Abstract: A three-dimensional (3D) video processing device capable of avoiding crosstalk between adjacent frames includes a video processing circuit and a control circuit. The video processing circuit is configured to generate a 3D video signal having a first frame timing. The 3D video signal is used to control a panel to update, to thereby display 3D video frames in accordance with a second frame timing which is a delayed version of the first frame timing. The control circuit is utilized for generating a backlight control signal. A switching timing of the backlight control signal is determined according to the second frame timing.

Abstract: The disclosure relates to fabrication of to a metal pillar. An exemplary method of fabricating a semiconductor device comprises the steps of providing a substrate having a contact pad; forming a passivation layer extending over the substrate having an opening over the contact pad; forming a metal pillar over the contact pad and a portion of the passivation layer; forming a solder layer over the metal pillar; and causing sidewalls of the metal pillar to react with an organic compound to form a self-assembled monolayer or self-assembled multi-layers of the organic compound on the sidewalls of the metal pillar.

Abstract: An electronic device includes a main body and an earphone. The main body includes an earphone socket and a first processing unit. The earphone includes an earphone plug, a storage unit, and a second processing unit. The earphone is connected to the main body by inserting the earphone plug into the earphone socket. The storage unit stores a password. The second processing unit transmits the password to the main body when the second processing unit detects that the earphone plug is inserted into the earphone socket. The first processing unit unlocks the main body if the password received from the earphone matches a predetermined condition.

Abstract: An LED lamp with replaceable light unit according to the invention includes a heat dissipation housing, a metal connector, a driver circuit board, a light unit slice, a pad and a shade. The heat dissipation housing has an opening at one end and a joint portion at another end. The metal connector is disposed to the joint portion of the heat dissipation housing. The driver circuit board disposed inside the heat dissipation housing to electrically connect with metal connector. The light unit slice and the pad are disposed inside the opening, and the light unit slice is electrically connected with the driver circuit board. The shade is disposed inside the opening. The LED lamp with replaceable light unit can be realized by the assembly of the above elements according to the different preferred embodiment of the present invention.

Abstract: The disclosure relates to fabrication of to a metal pillar. An exemplary method of fabricating a semiconductor device comprises the steps of providing a substrate having a contact pad; forming a passivation layer extending over the substrate having an opening over the contact pad; forming a metal pillar over the contact pad and a portion of the passivation layer; forming a solder layer over the metal pillar; and causing sidewalls of the metal pillar to react with an organic compound to form a self-assembled monolayer or self-assembled multi-layers of the organic compound on the sidewalls of the metal pillar.

Abstract: An audio player includes a control module and an audio interface, wherein the audio interface includes a microphone pin, a ground pin respectively connected to corresponding pins of an earphone when the earphone is connected to the player through the audio interface. The control module is used for detecting a change in a resistance value between the microphone pin and the ground pin, and powers off the audio player when detecting the earphone is entered into an idle state according to the detected change in the resistance value that is a change from a first resistance value to a second resistance value. The present disclosure also provides an audio player system using the audio player, and a method.

Abstract: A card tray ejection mechanism for an electronic device, which includes a first elongated member rotatably mounted to the base, a second elongated member, and a driving member. The first elongated member includes a first end portion resisting against a side of the tray, a second end portion opposite to the first end portion and a pivoting rod located between the first and second end portions. The second elongated member is rotatably connected to the second end portion. The driving member drives the second elongated member to move longitudinally. When the second elongated member is driven to move longitudinally by the driving member, the first elongated member is driven to rotate around the pivoting rod by the second elongated member, and the card tray is ejected. An electronic device using the card tray ejection mechanism is also provided.

Abstract: A computing device reads a reference image and a real-time of a printed circuit board (PCB), determines feature points and feature information of the feature points in the reference image; and creates two 1×N matrices based on the feature points. Furthermore, a mapping matrix is determined based on the two 1×N matrices. The device determines matching points in the real-time image based on coordinates of base points in the reference image and the mapping matrix, determines a matching region the real-time image based on the matching points, and determines an angle between the matching region and an X-axis of a coordinate system. If the angle does not equal zero, the device determines that the real-time is tilted, and corrects the real-time image to obtain a corrected image by taking a center of the real-time image as a turning pivot to rotate the real-time image until the angle equals zero.

Abstract: A tooth bleaching catalytic, the manufacturing method and the applications thereof are provided, wherein the tooth bleaching catalytic comprises a plurality of mesoporous silica nano-particles (MSNs), and the MSNs at least comprise a condensate having histidine, silane and a plurality of metal ions.

Abstract: An image analysis device reads a reference image and a real-time image of a printed circuit board (PCB), determines feature points and feature information of the feature points in the reference image; and creates two 1×N matrices based on the feature points. Furthermore, a mapping matrix is determined based on the two 1×N matrices. The device then reads coordinates of base points designated in the reference image, and determines matching points in the real-time image based on the coordinates of base points and the mapping matrix. A reference region in the reference image is determined based on all the base points, and a matching region is determined in the real-time image based on all the matching points. The reference region and the matching region are compared to determine existence of any surface feature defects of the PCB.

Abstract: An image capture apparatus comprises an image sensor array including a plurality of image sensors arranged in a two-dimensional (2-D) array and an analog-to-digital converter (ADC) array including a plurality of ADCs arranged in a 2-D array. The image sensor array is divided into a plurality of sub-arrays, each of which includes at least two image sensors. The image sensor array is vertically stacked on the ADC array. Each ADC corresponds to one sub-array of image sensors and is coupled to process signals output by the image sensors in the corresponding sub-array.

Abstract: A resistive switching memory element including a doped silicon electrode is described, including a first electrode comprising doped silicon having a first work function, a second electrode having a second work function that is different from the first work function by between 0.1 and 1.0 electron volts (eV), a metal oxide layer between the first electrode and the second electrode, the metal oxide layer switches using bulk-mediated switching and has a bandgap of greater than 4 eV, and the memory element switches from a low resistance state to a high resistance state and vice versa.

Abstract: Nonvolatile memory elements that are based on resistive switching memory element layers are provided. A nonvolatile memory element may have a resistive switching metal oxide layer. The resistive switching metal oxide layer may have one or more layers of oxide. A resistive switching metal oxide may be doped with a dopant that increases its melting temperature and enhances its thermal stability. Layers may be formed to enhance the thermal stability of the nonvolatile memory element. An electrode for a nonvolatile memory element may contain a conductive layer and a buffer layer.

Abstract: A coupling element, an injection molding object with the coupling element implanted therein, and an injection mold for manufacturing the injection molding object are provided. The coupling element has two reversely extended fixing ribs. The injection mold has a first mold and a second mold. The first mold has a first molding cavity and two positioning blocks separated by the first molding cavity. The second mold has a second molding cavity. When the first mold and the second mold are shut together and their molding cavities combine to define a closed room, the positioning blocks hold the coupling element by clamping the fixing ribs so the coupling element is suspended in midair of the closed room.

Abstract: A microfluidic chip with a built-in gravity-driven micropump is provided. The gravity-driven micropump comprises a winding channel, an inert fluidic material placed inside the winding channel, and a suction channel that links the winding channel to the microfluidic chip. The winding channel is for the inert fluidic material to flow in. A fixed volume of high density, inert fluidic material is placed in the winding channel to act as a micropump in the bio chip. When the microfluidic chip is placed in a declining or standing position, the inert fluidic material flows along the winding channel due to the gravity. The invention provides a simple, convenient, and robust microfluid pumping source. With the built-in micropump, this invention is free-of-pollution and saves the manufacturing cost for the pipe link between the bio chip and peripheral devices.

Abstract: The present invention relates to a light-emitting diode (LED) streetlight structure, which comprises a light-emitting module, a power module, and a lamppost. The light-emitting module is disposed on side of the power module; the lamppost is disposed on the other side of the power module and corresponds to the light-emitting module. A heat-dissipating structure is disposed on the surface of a housing of the power module. The heat-dissipating structure corresponds to a power supply in the power module, and can dissipate the heat generated by the power supply and reduce the temperature thereof. Accordingly, heat dissipation of the power supply is enhanced, and hence increasing its lifetime.