Abstract: An optical-electrical module includes a base board, a laser diode, an integrated circuit, and a lens unit. The laser diode and the integrated circuit are both fixed on the base board. The lens unit and the base board cooperatively define a receiving space to receive the laser diode and the integrated circuit. The laser diode has a transmitting window at an end of the laser diode away from the base board. The integrated circuit drives the laser diode to transmit optical signals. The lens unit has an inner surface facing the base board, and the inner surface of the lens unit has a light transmitting area. The lens unit includes a metal film formed on the inner surface of the lens unit except on the light transmitting area.

Abstract: A semiconductor device includes a post-passivation interconnect (PPI) structure having a landing pad region. A polymer layer is formed on the PPI structure and patterned with a first opening and a second opening to expose portions of the landing pad region. The second opening is a ring-shaped opening surrounding the first opening. A bump structure is formed on the polymer layer to electrically connect the landing pad region through the first opening and the second opening.

Abstract: A chip package includes a substrate, an electrical module, an optical module and a transmission module. The electrical module and the optical module are positioned on the substrate and electrically connect with each other. The optical module is used for converting optical signals to electrical signals, and vice versa. The optical module includes an optical emitting element and optical receiving element. The transmission module is positioned on the substrate. The transmission module includes an optical wave guide array having a reflection surface and a plurality of optical fibers that are optically coupled with the optical wave guide array. The optical signals emitted by the optical module are reflected by the reflection surface and reach the optical fibers to be transmitted; the optical module is capable of receiving optical signals from the optical fibers.

Abstract: An optical fiber coupling assembly includes a first optical fiber connector, a second optical fiber connector, and a cable. The first optical fiber connector defines a number of first blind holes receiving first focus lenses, and first through holes respectively communicating with the first blind holes. The second optical fiber connector defines a number of second blind holes receiving second focus lenses, and second through holes respectively communicating with the second blind holes. The cable includes a number of optical fibers. Each optical fiber includes a first end and a second end, and the first end is received in a corresponding one of the first through holes and aligned with the a corresponding one of the first focus lenses, and the second end is received in a corresponding one of the second through holes and aligned with a corresponding one of the second focus lenses.

Abstract: An optical fiber coupling assembly includes a first optical fiber connector and a second optical fiber connector. The first optical fiber connector includes a first body having a first light incident surface, first optical lenses, first plugs, and second plugs. The first optical lenses, the first plugs, and the second plugs are formed on the first light incident surface. The first optical lenses are positioned between the first plugs, and the first plugs are positioned between the second plugs. The second plugs are longer than the first plugs. The second optical fiber connector includes a second body having a second light incident surface and second optical lenses formed on the second light incident surface. First engaging holes and second engaging holes are defined in the second light incident surface. The first plugs are inserted into the first engaging holes, and the second plugs are inserted into the second engaging holes.

Abstract: An optical element package includes an optical wave guide array, at least one optical assembly and at least one optical transmission member. The optical wave guide array has a reflection groove. The reflection groove includes a reflection surface. The at least one optical assembly is positioned on the optical wave guide array adjacent to the reflection surface. The at least one optical transmission member is positioned on the optical wave guide array, and is optically coupled with the reflection surface. The optical signals emitted by the at least one optical assembly are reflected by the reflection surface and then reaching the at least one optical transmission member for transmission.

Abstract: An optical fiber transmitting system including a first Optical/Electrical (O/E) module, a first interface, a second interface, a fiber cable and a second Optical/Electrical (O/E) module is provided. The first O/E module includes a laser diode (LD) configured to emit laser optical signals. The fiber cable includes two pieces of optical fiber and a third piece of optical fiber for transmitting the laser optical signals to the second O/E module via the first interface and the second interface. The second O/E module includes a photo-detector (PD) configured to convert the laser optical signals into electronic signals to supply power energy to a peripheral device.

Abstract: An optical fiber connector includes a body, a photoelectric conversion module received in the body, a receiving member, and two L-shaped optical fibers. The photoelectric conversion module includes a base, a light emitting unit, and a light receiving unit. The light emitting unit and the light receiving unit are mounted on the base. The receiving member is disposed over the light emitting unit and the light receiving unit and defines two L-shaped receiving holes. The optical fibers are received in the respective receiving holes. One end of one of the two optical fibers is optically aligned and coupled with the light emitting unit. One end of the other optical fiber is optically aligned and coupled with the light receiving unit.

Abstract: A multiplication circuit generates a product of a matrix and a first scalar when in matrix mode and a product of a second scalar and a third scalar when in scalar mode. The multiplication circuit comprises a sub-product generator, an accumulator and an adder. The adder is configured to sum outputs of the accumulator to generate the product of the first scalar second scalar and the third scalar when in scalar mode. The sub-product generator generates sub-products of the matrix and the first scalar when in matrix mode and sub-products of the second scalar and the third scalar when in scalar mode. The accumulator is configured to generate the product of the matrix and the first scalar by providing save of the multiplication operation of the outputs from the sub-product generator.

Abstract: A sidewall protection structure is provided for covering at least a portion of a sidewall surface of a bump structure, in which a protection structure on the sidewalls of a Cu pillar and a surface region of an under-bump-metallurgy (UBM) layer is formed of at least one non-metal material layers, for example a dielectric material layer, a polymer material layer, or combinations thereof.

Abstract: A semiconductor device includes a conductive layer formed on the surface of a post-passivation interconnect (PPI) structure by an immersion tin process. A polymer layer is formed on the conductive layer and patterned with an opening to expose a portion of the conductive layer. A solder bump is then formed in the opening of the polymer layer to electrically connect to the PPI structure.

Abstract: A power supply device for supplying power via internet network comprises a power supply unit and a power consumption unit. The power supply unit comprises a power source unit and a first processing unit. The power source unit provides a first voltage with a first power and a second voltage with a second power. The first processing unit detects a connection status of the power supply unit for controlling the power source unit to provide the first voltage, and controlling the power source unit to provide the second voltage according to a control signal. The power consumption unit comprises a connecting unit and a second processing unit. The connecting unit is for connecting the power source unit and the first processing unit. The second processing unit receives the first voltage via the connecting unit and provides the control signal according to the first voltage.

Abstract: In a method for processing location holes of a motherboard, a motherboard image of the motherboard is converted into a grayscale image. The grayscale image is normalized and converted into a binary image. Closed contours in the binary image and a minimum circumscribed circle of each of the closed contours are acquired from the binary image. A radius, a circumcenter coordinate and an average pixel value of each minimum circumscribed circle, and an average pixel value of the binary image are calculated. One or more minimum circumscribed circles are selected if each of the selected minimum circumscribed circles has a radius in a predetermined radius range and an average pixel value that is greater than the average pixel value of the binary image.

Abstract: A method for transferring one or more guest operating system (OS) using a remote server. The remote server periodically obtains a central processing unit (CPU) utilization ratio of each guest OS installed in each cloud server of the data center. The remote server counts the number of times of obtaining the CPU utilization ratio, and calculates a predicted average of the CPU utilization ratio for each cloud server if the counted number of the times is equal to a predetermined number. The remote server transfers one or more guest OS from the cloud server to other cloud servers before a predetermined time, in response to a determination that the predicted average of the CPU utilization ratio of the cloud server is greater than a predetermined average.

Abstract: The present disclosure provides a label detecting system, apparatus and a detecting label method for the label detecting system. The method includes steps whereby an image processing function for the image of the circuit board under test to obtain a binary image of the circuit board takes place, dividing the binary image of the circuit board into a number of areas and scanning the binary image of the circuit board, performing a generalization and correlation analysis between each area and the binary image of the standard label to obtain a matching value, acquiring a maximum and location information of the area associated with a maximum, comparing the maximum with two threshold values to detect a result of the determination as to the correctness of the location information of the area as compared to that of the standard label, and displaying the result.

Abstract: A scalable video bitstream may have an H.264/AVC compatible base layer and a scalable enhancement layer, where scalability refers to color bit depth. The H.264/AVC scalability extension SVC provides also other types of scalability, e.g. spatial scalability where the number of pixels in BL and EL are different. According to the invention, BL information is upsampled in two logical steps, one being texture upsampling and the other being bit depth upsampling. Texture upsampling is a process that increases the number of pixels, and bit depth upsampling is a process that increases the number of values that each pixel can have, corresponding to the pixels color intensity. The upsampled BL data are used to predict the collocated EL. The BL information is upsampled at the encoder side and in the same manner at the decoder side, wherein the upsampling refers to spatial and bit depth characteristics.

Abstract: In a method for generating engineering tolerances of a manufactured object using a computing device, the computing device sets engineering tolerances to a determined number of decimal places and stores the engineering tolerances into a storage system. The computing device receives a measured dimension of the manufactured object and a nominal dimension corresponding to the measured dimension. A number of decimal places of the nominal dimension is determined, and a pair of engineering tolerances of the manufactured object is retrieved from the storage system. The measured dimension, the nominal dimension, and the retrieved pair of engineering tolerances are displayed on a display device.

Abstract: Method of processing a biological sample to yield nucleic acid appropriate for use in a subsequent in vitro nucleic acid amplification reaction. The method involves a rapid, transient exposure to alkaline conditions which can be achieved by mixing an alkaline solution with a pH-buffered solution that includes a detergent and the biological sample to be tested for the presence of particular nucleic acid species using in vitro amplification. The invented method advantageously can improve detection of some target nucleic acids without substantially compromising detectability of others. The method is particularly useful for simultaneously preparing RNA and DNA templates that can be used in multiplex amplification reactions.

Abstract: The disclosure provides a hybrid display device, comprising: a substrate, wherein the substrate comprises a first surface and a second surface; a TFT array layer formed on the first surface of the substrate; a first display device formed on the TFT array layer; and a second display device formed on the second surface of the substrate, wherein there exists a corresponding relationship between a dielectric constant (k) of the substrate and a thickness (t) of the substrate to drive at least one of the first display device and the second display device, or to drive both of the first display device and the second display device by the TFT array layer, especially the TFT array layer actively drive the first display device, the second display device or combinations thereof. The dielectric constant of the substrate is about 1-100 and the thickness of the substrate is about 0.1-60 ?m.

Abstract: A method for manufacturing a light unit for LED lamp first provides an aluminum substrate, which is surface-treated to form a thin aluminum oxide insulating layer thereon. A circuit board is attached to the insulating layer and includes a through hole to expose part of the insulating layer. An LED die is mounted to the exposed part of the insulating layer, and two bonding wires electrically connect the LED die and the circuit board. A wall is formed on the circuit board to enclose the LED die and the bonding wires. Finally, plastic material is dispensed into the wall to form a lens.