Abstract: A sheet alignment device includes a first alignment arm, a second alignment arm, a first sensor and a controller. The first alignment arm includes a first blocking piece and a second blocking piece. During the sheet-aligning action of each sheet, the first alignment arm is moved for a preset distance from a standby position. Then, the first alignment arm is moved back to the standby position, and a waiting time is required to introduce a next sheet into the sheet placement tray. When the first sensor is no longer interrupted by the second blocking piece of the first alignment arm, the controller starts to calculate the moving distance of the first alignment arm. Since the moving distance of the first alignment arm is calculated at the same start point during the sheet-aligning action of each sheet is performed, the possibility of resulting in the moving distance error is minimized.

Abstract: Apparatus and methods are described for encoding and decoding an enhancement layer. A deblocking filter is applied at the enhancement layer for bit depth scalability. The deblocking filter is adjusted to remove coding artifacts caused by local inverse tone mapping for intra-layer texture prediction for the bit depth scalability. The boundary strength of the deblocking filter is adjusted based on a threshold that, in turn, is based on a difference of inverse tone mapping parameters for a block and an adjacent block.

Abstract: In a method for image localization of an object using an image capturing device, a panoramic image of the object is captured using the image capturing device. The panoramic image includes an image of the object and an image background of the object. One or more boundary points of the object image are obtained according to a pixel value of each pixel point of the object image. Actual coordinate values of each boundary point are calculated, and original coordinate values of each boundary point are obtained based on a standard image retrieved from a storage device. Localization coordinate values of each pixel of the object image are calculated according to the actual coordinate values and the original coordinate values of each boundary point, and a sub-pixel localization image of the object is generated by mapping to the localization coordinate values of each of the pixel points.

Abstract: A chip package includes a substrate, a pad, a double-sided adhesive tape, a chip, and a sealing member. The pad is arranged on the substrate and has a top surface facing away from the substrate. The double-sided adhesive tape includes a first paste surface and an opposing second paste surface. The first paste surface is attached to the top surface. The chip is attached onto the second paste surface and includes a light emitting surface or a light receiving surface facing away from the second paste surface. The sealing member is formed on the pad and tightly surrounds the chip and the double-sided adhesive.

Abstract: An image processing method for a display device, for enhancing image quality, includes receiving video signals, sequentially generating a plurality of image data according to the video signals, and sequentially displaying the plurality of image data on a panel of the display device. Each of the plurality of image data includes a frame data and a low-gray-level frame data respectively corresponding to a frame output duration and a vertical blanking duration in a timing sequence of the video signals.

Abstract: There are provided methods and apparatus for inter-layer residue prediction for scalable video. An apparatus is described for an encoder for encoding a block of a picture, or a decoder for decoding a block of a picture, by applying inverse tone mapping to an inter-layer residue prediction process for the block, wherein the inverse tone mapping is performed in the pixel domain. Methods for encoding or decoding a block of a picture are also described; and performed by applying inverse tone mapping to an inter-layer residue prediction process for the block, wherein the inverse tone mapping is performed in the pixel domain.

Abstract: An exemplary electronic device is connected with an earphone. The earphone includes a first storage unit storing information as to functions of the earphone. The electronic device includes a second storage unit storing a function information table recording information as to user-controllable functions of the electronic device, function units corresponding to the user-controllable functions, an identifying module, and a control module. The identifying module retrieves the information as to functions stored in the first storage unit, and determines whether one or more of the controllable functions of the electronic device are controllable by the earphone. The control module activates all of the function units corresponding to the controllable functions of the electronic device which are controllable by the earphone, and controls one or more of the activated function units according to one or more control signals transmitted from the earphone to the electronic device. A related method is also provided.

Abstract: An optical fiber connector assembly includes a first, and second plug connectors, and a socket connector. The first plug connector includes a first main portion and a first plate with a first front surface defining alignment holes. A first distance is defined between the first front surface and the first main portion. The second plug connector includes a second main portion and a second plate with a second front surface. A second distance is defined between the second front surface and the second main portion. The socket connector includes a side surface defining a recess with a bottom surface. A third distance is defined between the side surface and the bottom surface. Alignment pins extend from the bottom surface. The length of each alignment pin is defined as a fourth distance. The third distance is equal to the first distance and greater than sum of the second and fourth distances.

Abstract: A chip package includes a circuit board, a pad, a chip, and an adhesive layer. The circuit board includes a substrate and a circuit layer formed on the substrate. The pad includes an electrical connection area in a center portion thereof and an extending area extending outward from the electrical connection area. The electrical connection area covers the circuit layer. The extending area surrounds the electrical connection area and the circuit layer. The chip includes two chip areas and an enlarging area. The two chip areas are separated from each other and electrically connected to the electrical connection area. The enlarging area surrounds the two chip areas. The adhesive layer attaches the chip to the pad. The chip and the pad are positioned on opposite sides of the adhesive layer.

Abstract: A touch method is applied in a touch device. The touch device includes a display unit, first infrared receivers, first infrared emitters, second infrared receivers, second infrared emitters, a storage unit, and motors. The first infrared receivers and the first infrared emitters are arranged on a first side of the display unit, and the second infrared receivers and the second infrared emitters are arranged on a second side of the display unit. The storage unit stores a table recording a relationship between identification and set of coordinates of the infrared receivers. The method includes: controlling motors to drive infrared emitters and infrared receivers to rotate; determining whether electrical signals comprising the identification of one first infrared receiver and one second infrared receiver are simultaneously received; if yes, determining the set of coordinates of the touch spot; determining an icon and determining the corresponding function corresponding to the touch spot.

Abstract: Apparatus and methods are described for encoding and decoding image data for image blocks which form a picture by having a deblocking filter remove coding artifacts caused by local inverse tone mapping for intra-layer texture prediction for bit depth-scalability. A deblocking filter is applied at the enhancement layer for bit depth scalability. The deblocking filter is adjusted to remove coding artifacts caused by local inverse tone mapping for intra-layer texture prediction for the bit depth scalability. The boundary strength of the deblocking filter is adjusted based on a threshold that is based on a difference of inverse tone mapping parameters for the block and at least one adjacent block with respect to the block.

Abstract: An electronic device is positioned in an environment regulating device controlling the environmental regulating device, and is tested under different test environments of the environment regulating device. The electronic device stores a number of standard environment values corresponding to the test environments. The environment regulating device regulates the testing environments according to the standard environment values. The electronic device tests itself in the different test environments.

Abstract: An electronic accessory for an electronic device includes an audio processing circuit. The audio processing circuit includes a first switch circuit, an echo cancellation circuit and an amplification circuit. The echo cancellation circuit removes echoes from a first voice signal from a user in a call and a second voice signal from a caller, outputs the first voice signal to the electronic device via the first switch circuit, and outputs the second voice signal to the amplification circuit. The amplification circuit amplifies the second voice signal. The amplification circuit further directly receives and amplifies a third voice signal from multimedia content stored in the electronic device via the first switch circuit.

Abstract: A double-sided PCB includes a circuit plate, a first chip, and a second chip. The circuit plate includes a spacer layer having a first surface and an opposing second surface, a first multilayer structure, and a second multilayer structure. The first multilayer structure includes a first wire layer, a first middle layer, and a second wire layer having a first grounding portion and first conductive pattern portions, that are stacked on each other on the first surface. The second multilayer structure on the second surface is either a mirror image of the first multilayer structure, or is very similar thereto. The first and second chips are each arranged on a grounding portion and are each electrically connected to their respective conductive pattern portions.

Abstract: A chip package includes a circuit board, a chip, and wires. The circuit board includes a metal layer, a middle layer formed on the metal layer, and a wire pattern layer formed on the middle layer. The metal layer is configured to be grounded. A through hole is defined through the wire pattern layer and the middle layer to expose the metal layer. The chip is mounted on the metal layer and received in the through hole. The wires interconnect the chip and the wire pattern layer.

Abstract: A method includes forming a passivation layer over a metal pad, which is overlying a semiconductor substrate. A first opening is formed in the passivation layer, with a portion of the metal pad exposed through the first opening. A seed layer is formed over the passivation layer and to electrically coupled to the metal pad. The seed layer further includes a portion over the passivation layer. A first mask is formed over the seed layer, wherein the first mask has a second opening directly over at least a portion of the metal pad. A PPI is formed over the seed layer and in the second opening. A second mask is formed over the first mask, with a third opening formed in the second mask. A portion of a metal bump is formed in the third opening. After the step of forming the portion of the metal bump, the first and the second masks are removed.

Abstract: An optical fiber connector adapter for coupling a first optical fiber connector to a second optical fiber connector includes a lens body. The lens body includes a first surface and an opposite second surface. A positioning hole is defined in the first surface. A lens hole is defined in the first surface and a first lens is formed on a bottom in the lens hole. The first lens is beneath the first surface and adjacent to the positioning hole. A positioning post and a second lens protrude from the second surface. The second lens is aligned with the first lens. An optical fiber connector assembly having the optical fiber connector adapter is also provided.

Abstract: An optical fiber connector assembly includes an optical socket and an optical plug. The optical socket defines a recess, and a coupling surface in the recess, with light emitters and light detectors on the coupling surface. Each light emitter includes a light emitting surface exposed in the recess, and is configured for converting a first electrical signal into a first optical signal. Each light detector includes a light incident surface exposed in the recess, and is configured for converting a second optical signal into a second electrical signal. The optical plug can be inserted into the recess, and includes optical output fibers aligned with the light emitting surface for outputting the first optical signal from the light emitting surface, and optical input fibers aligned with the light incident surface for inputting the second optical signal to the light incident surface.

Abstract: A system and method for forming metal bumps is provided. An embodiment comprises attaching conductive material to a carrier medium and then contacting the conductive material to conductive regions of a substrate. Portions of the conductive material are then bonded to the conductive regions using a bonding process to form conductive caps on the conductive regions, and residual conductive material and the carrier medium are removed. A reflow process is used to reflow the conductive caps into conductive bumps.

Abstract: One embodiment of a sleeping bag extension piece or elongated sleeping bag with sufficient length beyond a traditional sleeping bag to rest upon the sleep surface above the user's shoulder line creating a natural body heat seal and restricting air flow between the sleeping bag top and sleep surface above the shoulder line, and having a separation to allow a user's head to protrude.