Patents by Inventor Wen Wu

Wen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8515156
    Abstract: An image analysis device reads a reference image and a real-time image of a printed circuit board (PCB), determines feature points and feature information of the feature points in the reference image; and creates two 1×N matrices based on the feature points. Furthermore, a mapping matrix is determined based on the two 1×N matrices. The device then reads coordinates of base points designated in the reference image, and determines matching points in the real-time image based on the coordinates of base points and the mapping matrix. A reference region in the reference image is determined based on all the base points, and a matching region is determined in the real-time image based on all the matching points. The reference region and the matching region are compared to determine existence of any surface feature defects of the PCB.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: August 20, 2013
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wen-Wu Wu, Meng-Zhou Liu, Xiao-Jun Fu
  • Publication number: 20130210287
    Abstract: A terminal holder structure installed in a RJ45 dual-port jack is disclosed to include a plastic intermediate bracket mounted on a middle part of a circuit board to hold the 3rd and 5th terminals of a first set of terminals numbered from 1st through 8th and the 3rd and 5th terminals of a second set of terminals numbered from 1st through 8th in reversed directions so that the distance? between the 3rd and 5th terminals of the first set of terminals and the 3rd and 5th terminals of the second set of terminals is extended for crosstalk compensation to avoid crosstalk interference in the RJ45 dual-port jack.
    Type: Application
    Filed: February 14, 2012
    Publication date: August 15, 2013
    Inventor: Fu-Wen Wu
  • Publication number: 20130207098
    Abstract: A semiconductor device including a first wafer assembly having a first substrate and a first oxide layer over the first substrate. The semiconductor device further includes a second wafer assembly having a second substrate and a second oxide layer over the second substrate. The first oxide layer and the second oxide layer are bonded together by van der Waals bonds or covalent bonds. A method of bonding a first wafer assembly and a second wafer assembly including forming a first oxide layer over a first substrate. The method further includes forming a second oxide layer over a second wafer assembly. The method further includes forming van der Waals bonds or covalent bonds between the first oxide layer and the second oxide layer.
    Type: Application
    Filed: February 10, 2012
    Publication date: August 15, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tung-Ti YEH, Chung-Yi HUANG, Ya Wen WU, Hui-Mei JAO, Ting-Chun WANG, Shiu-Ko JiangJian, Chia-Hung CHUNG
  • Publication number: 20130207258
    Abstract: A semiconductor device including a dielectric layer formed on the surface of a post-passivation interconnect (PPI) structures. A polymer layer is formed on the dielectric layer and patterned with an opening to expose a portion of the dielectric layer. The exposed portion of the dielectric layer is then removed to expose a portion of the PPI structure. A solder bump is then formed over and electrically connected to the first portion of the PPI structure.
    Type: Application
    Filed: February 10, 2012
    Publication date: August 15, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsien-Wei CHEN, Yi-Wen WU
  • Patent number: 8501615
    Abstract: A system and method for forming metal bumps is provided. An embodiment comprises attaching conductive material to a carrier medium and then contacting the conductive material to conductive regions of a substrate. Portions of the conductive material are then bonded to the conductive regions using a bonding process to form conductive caps on the conductive regions, and residual conductive material and the carrier medium are removed. A reflow process is used to reflow the conductive caps into conductive bumps.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: August 6, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Da Cheng, Chih-Wei Lin, Hsiu-Jen Lin, Tzong-Hann Yang, Wen-Hsiung Lu, Zheng-Yi Lim, Yi-Wen Wu, Chung-Shi Liu
  • Patent number: 8502187
    Abstract: A resistive switching memory element including a doped silicon electrode is described, including a first electrode comprising doped silicon having a first work function, a second electrode having a second work function that is different from the first work function by between 0.1 and 1.0 electron volts (eV), a metal oxide layer between the first electrode and the second electrode, the metal oxide layer switches using bulk-mediated switching and has a bandgap of greater than 4 eV, and the memory element switches from a low resistance state to a high resistance state and vice versa.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: August 6, 2013
    Assignee: Intermolecular, Inc.
    Inventors: Prashant Phatak, Tony Chiang, Michael Miller, Wen Wu
  • Patent number: 8496500
    Abstract: A terminal holder structure installed in a RJ45 dual-port jack is disclosed to include a plastic intermediate bracket mounted on a middle part of a circuit board to hold the 3rd and 5th terminals of a first set of terminals numbered from 1st through 8th and the 3rd and 5th terminals of a second set of terminals numbered from 1st through 8th in reversed directions so that the distance' between the 3rd and 5th terminals of the first set of terminals and the 3rd and 5th terminals of the second set of terminals is extended for crosstalk compensation to avoid crosstalk interference in the RJ45 dual-port jack.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: July 30, 2013
    Assignee: Telebox Industries Corp.
    Inventor: Fu-Wen Wu
  • Patent number: 8493363
    Abstract: A touch method is applied in a touch device. The touch device includes a display unit, first infrared receivers, first infrared emitters, second infrared receivers, second infrared emitters, a storage unit, and motors. The first infrared receivers and the first infrared emitters are arranged on a first side of the display unit, and the second infrared receivers and the second infrared emitters are arranged on a second side of the display unit. The storage unit stores a table recording a relationship between identification and set of coordinates of the infrared receivers. The method includes: controlling motors to drive infrared emitters and infrared receivers to rotate; determining whether electrical signals comprising the identification of one first infrared receiver and one second infrared receiver are simultaneously received; if yes, determining the set of coordinates of the touch spot; determining an icon and determining the corresponding function corresponding to the touch spot.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: July 23, 2013
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wen-Dong Luo, Wen-Wu Wang, Bin Liu, Tsung-Jen Chuang, Shih-Fang Wong
  • Publication number: 20130181338
    Abstract: A structure comprises a post passivation interconnect layer formed over a semiconductor substrate, a metal bump formed over the post passivation interconnect layer and a molding compound layer formed over the semiconductor substrate. A lower portion of the metal bump is embedded in the molding compound layer and a middle portion of the metal bump is surrounded by a concave meniscus molding compound protection layer.
    Type: Application
    Filed: January 12, 2012
    Publication date: July 18, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Hsiung Lu, Yi-Wen Wu, Chih-Wei Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu
  • Patent number: 8485938
    Abstract: An omni-wheel based driving mechanism includes a spherical wheel, a pair of first omni wheels, and a pair of second omni wheels. The first omni wheels are arranged at two sides of the spherical wheel to space from each other by a predetermined distance in a first direction, so that the spherical wheel is rollably positioned between the first omni wheels. The second omni wheels are arranged at another two sides of the spherical wheel to space from each other by a predetermined distance in a second direction, so that the spherical wheel is rollably positioned between the second omni wheels. Therefore, a good driving efficiency can be obtained between the spherical wheel and the first omni wheels and the second omni wheels.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: July 16, 2013
    Assignee: Chung Hua University
    Inventors: Chia-Wen Wu, Chi-Kuang Hwang
  • Publication number: 20130175685
    Abstract: A method includes forming a polymer layer over a metal pad, forming an opening in the polymer layer to expose a portion of the metal pad, and forming an under-bump-metallurgy (UBM). The UBM includes a portion extending into the opening to electrically couple to the metal pad.
    Type: Application
    Filed: January 5, 2012
    Publication date: July 11, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Wen Wu, Zheng-Yi Lim, Ming-Che Ho, Chung-Shi Liu
  • Publication number: 20130172732
    Abstract: A method (200, 300) and system (100) for performing real-time, dynamic overlays on fluoroscopic images to aid in navigation and localization during medical procedures.
    Type: Application
    Filed: January 3, 2013
    Publication date: July 4, 2013
    Applicants: Siemens Aktiengesellschaft, Siemens Corporation
    Inventors: Atilla Peter Kiraly, Wen Wu, Norbert Strobel, Alexander Benjamin Brost, Terrence Chen
  • Publication number: 20130170796
    Abstract: An optical fiber coupler includes a male port and a female port. The male port includes a main body, the male transmission lens and the male receiving lens positioned on the main body, and a male optical wave guide assembly. The male base board includes at least one male optical wave guide. Each male optical wave guide includes a male first alignment portion and a male second alignment portion. The male first alignment portion is optically coupled with one male receiving lens; and a male second alignment portion has a greater width than that of the male first alignment portion. The structure of the female port is similar to the male port.
    Type: Application
    Filed: August 23, 2012
    Publication date: July 4, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Publication number: 20130170795
    Abstract: An optical coupler includes a male port and a female port. The male port includes a first main body, a first optical fiber, and a male port lens unit. The male port lens unit includes a first base body, a first male port lens coupling with the first optical fiber, and a second male port lens. The first base body includes a male port reflecting sidewall. The female port includes a second main body, a second optical fiber, and a female port lens unit. The female port lens unit includes a second base body, a first female port lens coupling with the second optical fiber, and a second female port lens coupling with the second male port lens. The second base body includes a female port reflecting surface parallel with the male port reflecting sidewall.
    Type: Application
    Filed: October 19, 2012
    Publication date: July 4, 2013
    Inventor: KAI-WEN WU
  • Patent number: 8477853
    Abstract: A scalable video bitstream may have an H.264/AVC compatible base layer (BL) and a scalable enhancement layer (EL), where scalability refers to color bit depth. The SVC standard allows spatial inter-layer prediction, wherein a residual in the EL is generated which is then intra coded. Another spatial intra-coding mode for EL is pure intra coding (I_N×N). The invention discloses a new intra-coding mode and two new inter coding modes, particularly for bit depth scalability. The new intra coding mode uses encoding of the residual between upsampled reconstructed BL and original EL, using mode selection. Two possible modes are residual prediction from BL and additional intra-coding of this residual. The new inter coding modes use also prediction of EL from reconstructed BL. In a first inter coding mode, the residual is encoded using Motion Estimation based on this residual. In a second inter coding mode, the residual is encoded using upsampled motion information from the BL.
    Type: Grant
    Filed: December 14, 2006
    Date of Patent: July 2, 2013
    Assignee: Thomson Licensing
    Inventors: Yu Wen Wu, Yong Ying Gao
  • Publication number: 20130162864
    Abstract: The disclosure provides a capturing apparatus and a capturing method for the capturing apparatus. The method includes steps: controlling the capturing unit to capture an image; performing an image processing function in relation to the captured image to obtain pixels of the captured image; comparing the pixels of the captured image with the pixels of the pre-stored standard images and determining whether a percentage of the pixels of the image is similar to the pixels of one of the standard images. If the percentage of the pixels of the image reaches a threshold of similarity to the pixels of one standard image, acquiring the parameters associated with the standard image; and controlling the capturing unit to capture subsequent images according to the parameters associated with the standard image.
    Type: Application
    Filed: August 31, 2012
    Publication date: June 27, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: WEN-WU WANG, TSUNG-JEN CHUANG, SHIH-FANG WONG
  • Publication number: 20130163925
    Abstract: An optical fiber coupler includes two insertion ports inserted into each other. Each insertion port includes a main body having a connecting wall, at least two lenses positioned adjacent to the connecting wall, and at least two optical fibers coupled with the at least two lenses. While the connecting wall has an axis of symmetry, one insertion port acts as a male port, and the other insertion port acts as a female port. A positioning post protrudes from the connecting wall. A guiding hole is formed on the connecting wall. The projections of the positioning post and the guiding hole on the connecting wall are symmetrical around the longitudinal center axis of the optical fiber coupler, respectively. The lenses are symmetrical around the longitudinal center of axis.
    Type: Application
    Filed: July 17, 2012
    Publication date: June 27, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Publication number: 20130154060
    Abstract: A wafer including a substrate, a dielectric layer over the substrate, and a conductive layer over the dielectric layer is disclosed. The substrate has a main portion. A periphery of the dielectric layer and the periphery of the main portion of the substrate are separated by a first distance. A periphery of the conductive layer and the periphery of the main portion of the substrate are separated by a second distance. The second distance ranges from about a value that is 0.5% of a diameter of the substrate less than the first distance to about a value that is 0.5% of the diameter greater than the first distance.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 20, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tung-Ti YEH, Wu-Chang LIN, Chung-Yi HUANG, Ya Wen WU, Hui-Mei JAO, Ting-Chun WANG, Chia-Hung CHUNG
  • Publication number: 20130156374
    Abstract: An optical-electrical module includes a base board and an optical transmitting unit fixed on the base board. The optical transmitting unit includes an edge-emitting laser transmitting optical signals parallel to the base board, a driving integrated circuit for driving the edge-emitting laser to transmit optical signals, and a first lens unit for transmitting and converging the optical signals. Furthermore, the optical-electrical module can also include an optical receiving unit used to receive the optical signals transmitted by the optical transmitting unit and convert the optical signals into electrical signals. The optical receiving unit includes a photo diode, a transimpedance amplifier, and a second lens unit.
    Type: Application
    Filed: April 13, 2012
    Publication date: June 20, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: KAI-WEN WU
  • Publication number: 20130156276
    Abstract: An electronic device with a function of searching images based on a facial feature is provided. The electronic device includes a capturing unit, a storage unit, an acquiring module, a searching module, and a folder establishing module. The capturing unit captures facial images. The storage unit stores a plurality of images. The acquiring module acquires facial features of the facial image captured by the capturing unit. The searching module searches for images that include the acquired facial feature from the plurality of images stored in the storage unit. The folder establishing module establishes a new folder and stores the searched images to the established new folder.
    Type: Application
    Filed: December 30, 2011
    Publication date: June 20, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: WEN-WU WANG, TSUNG-JEN CHUANG, SHIH-FANG WONG