Abstract: An electrical connector (100) includes an insulative housing (2) defining a plurality of passageways (21) and a plurality of contacts (1) received in corresponding passageways. Each contact includes a moveable part (10) forming a pair of guiding beams (105), an immoveable part (20) coupled with the moveable part and a biasing device (30) constantly urging the moveable part away from immoveable part. The immoveable part includes a pair of posts (205) and defines a pair of guiding slots (207). The guiding beams are received in the guiding slots and are capable of moving with regard to the immovable part along opposite surfaces of the immoveable part. The guiding beams and the posts are decussated to surround the biasing device for preventing the biasing device from disengaging therefrom.

Abstract: An electrical contact comprises an upper contact pin, a lower contact pin and a spring enveloping between the upper contact pin and the lower contact pin. The upper contact pin has an upper contacting portion and a guiding portion, and the lower contact pin is coupled to the upper contact pin and has a lower contacting portion and a main portion extending from the contacting portion. The main portion of the lower contact pin includes two elastic arms, and each elastic arm has a first and a second locking protrusions engaging with a slot defined on the guiding portion of the upper contact pin respectively to reliably connect the upper contact pin and the lower contact pin.

Abstract: An electrical connector (100) for receiving a central process unit comprises: a first insulative housing (14) defining a number of receiving channels (141) extending along a first direction; a second insulative housing (13) located above the first insulative housing and defining a number of passageways (131) aligned to corresponding receiving channels; a third insulative housing (15) located below the first insulative housing and defining a number of holes (151) extending therethrough and aligned to corresponding passageways; and a number of thin, elongated contacts (11) received in the first, the second and the third insulative housing. Each thin, elongated contact has a contact portion (111) positioned above a top surface of the second insulative housing, a tail portion (112) extending through the holes of the third insulative housing, and a base portion (115) retained in the first and the second insulative housing.

Abstract: An electrical connector (1) for receiving an IC package includes a socket body (2) with a plurality of contacts (4) therein. A cover (3) is pivotally mounted with respect to the socket body (2) and defines an inner side close to the socket body (2) and an outer side opposite to the socket body (2). A heat sink (5) is provided to be mounted with the cover (3) by a plurality of fasteners (6). The fasteners (6) are inserted into the cover (3) and the heat sink (6) from the inner side of the cover (3).

Abstract: A burn-in socket for receiving an IC package includes a base, a platform located within the base for loading the IC package, a number of contacts arranged in the base for connecting with the IC package, a cover movably mounted upon the base, and at least one slider arrangement actuated by the cover. The slider arrangement comprises a first rod pivotally connected to the cover, a slider capable of abutting against the IC package, and a second rod with one end pivotally connected to the first rod and the other end pivotally connected to the slider.

Abstract: An electrical contact includes a first contact pin, a second contact pin and an elastic member surrounding the first contact pin and the second contact pin. Both of the first contact pin and the second contact pin include contacting portions. The first contact pin has a guiding portion including two lead-in arms and a stop portion between the two leading arms. The second contact has a main body and a protrusion on a top end of the main body. The leading arms define a guiding groove therebetween for the main body of the second contact pin moving up and down. The protrusion abuts against the stop portion of the first contact pin to prevent the second contact from sliding out of the guiding groove.

Abstract: An IC socket (100) for receiving an IC package includes a socket body for carrying the IC package, a plurality of contacts (3) received in the socket body for electrical connection with the IC package, a driving member (5) mounted upon the socket body, and at least one latch device (19) driven by the driving member (5) to shift between a closed position and an opened position. The driving member (5) is able to be operated between an upper position and a lower position. The latch device (19) has a movable pressing member (194) engaging with a spring member (1943) and pressing the IC package toward the socket body. The position of pressing member (194) is adjusted in a vertical direction by abutting against the IC package.

Abstract: An electrical connector contact adapted for connecting a chip to a circuit board comprises a first terminal, a second terminal electrically connecting with the first terminal and a spring. The first terminal is defined with a first abutting portion and a contact beam extending from one end of the abutting portion. The second terminal is defined with a second abutting portion and a elastic beam extending from one end of the second abutting portion. The spring is set between the first and second abutting portion with the two ends thereof separately abutting against the first abutting portion and second abutting portion. Along the contact beam there forms a retain slot, the elastic beam mating with and retain in the retain slot. A good electrical performance can be achieved according to the structure of the invention and the contact is convenient for assembling and changing.

Abstract: A test socket, adapted for electrically connecting an IC package to a printed circuit board, comprises a bottom board (10) and four separated clumps (20). The bottom board has a main body (11) having a rectangular shape and four mounting portions (12) integrally extending outwardly from four corners of the main body, respectively. The clumps are assembled upon the four mounting portions of the bottom board to cooperate with the bottom board to define a receiving space for receiving the IC package.

Abstract: A test socket, adapted for connecting the semiconductor package and a printed circuit board comprises a base and a plurality of contacts received in the base. The base has a retaining board defining a plurality of first receiving holes and a positioning board defining a plurality of second receiving holes. The contacts has a contacting portion, an elastic portion and a retaining portion, the elastic portion is disposed between the retaining board and the positioning board and protruding rightward, and the contacting portion extends beyond the elastic portion and defines a acute angle with a horizontal line in a right hand before contacting with the semiconductor package to prevent the contacting portion from scratching with the left inner sidewall of the second receiving hole when pushed downward by the semiconductor package and rotating leftward.

Abstract: A NROM memory device includes an array of memory cells and first and second bit lines. The first and second bit lines are coupled to opposite sides of the memory cells. During an erase operation, one of the sides of the memory cells receives a positive voltage and the other side couples to a common node or a limited current source. Methods are also disclosed that can easily screen for marginal memory cells based on a threshold voltage distribution of the memory cells.

Abstract: An IC socket includes a socket body with a plurality of contacts disposed therein, a cover rotatablely coupled to the socket body and at least one slider in the socket body. The socket body defines a receiving space for receiving an IC package, and the cover has a driving member. The slider has one end engageable with the driving member and the other end extending toward the receiving space. When the IC socket is in a close position, the slider touches the IC package or close to the IC package to keep a reliable connection between the IC socket and the IC package.

Abstract: A burn-in socket for receiving an IC package comprises a socket body, a plurality of contacts mounted in the socket body and an actuator movably mounted upon the socket body. Each contact in the socket body includes a pair of clipping arms with tip portions at free ends thereof respectively. Solder balls attached to the bottom of the IC package are respectively clipped between the pair of the tip portions and thus the IC package should be brought into electrical contact with the contacts of the burn-in socket. The tip portion is plated with a Pd—Co layer for reducing the attachment of the Sn and preventing the impedance of the contacts to increase. Meanwhile, the IC package can be sucked up successfully without absorption from the contacts of the burn-in socket.

Abstract: A NROM memory device includes an array of memory cells and first and second bit lines. The first and second bit lines are coupled to opposite sides of the memory cells. During an erase operation, one of the sides of the memory cells receives a positive voltage and the other side couples to a common node or a limited current source. Methods are also disclosed that can easily screen for marginal memory cells based on a threshold voltage distribution of the memory cells.

Abstract: A test socket comprising an insulative base with a plurality of contacts received in the base and a cover pivotally mounted to one end of the base. The cover comprises a pusher with an opening extending therethrough and a lid aligned with the pusher. The lid has a through hole corresponding to the opening of the pusher. Between the pusher and the lid have a plurality of elastic members for making the lid moveably with respect to the pusher.

Abstract: An electrical connector (100) for electrically connecting an electronic package (8) with a circuit substrate comprising a housing assembly with a plurality of first passageways (90) and a plurality of contacts (1) received in the housing assembly, the first passageways (90) comprise a back wall (902), a front wall (901) and two side walls (903) connecting with the back wall (902) and the front wall (901), the contact (1) comprises a base portion (10) defining a plane extending along the back wall (902), a contacting portion (11) extending upwardly from one end of the base portion (10), a tail portion (13) extending downwardly from the other end of the base portion (10) and a retention portion (12) extending away from the plane.

Abstract: The present invention provides a complementary metal-oxide-semiconductor (CMOS) device and a fabrication method thereof. The CMOSFET device includes a compressively strained SiGe channel for a PMOSFET, as well as a tensile strained Si channel for an NMOSFET, thereby enhancing hole and electron mobility for the PMOSFET and the NMOSFET, respectively. As such, the threshold voltages of the two types of transistors can be obtained in oppositely symmetric by single metal gate.

Abstract: A burn-in socket for receiving an IC package includes a base, a platform located within the base for loading the IC package, a number of contacts arranged in the base for connecting with the IC package, a cover movably mounted upon the base, and at least one slider arrangement actuated by the cover. The slider arrangement comprises a first rod pivotally connected to the cover, a slider capable of abutting against the IC package, and a second rod with one end pivotally connected to the first rod and the other end pivotally connected to the slider.

Abstract: An burn-in socket used for connecting an IC package includes an base, a actuated device floatably assembled on said base, a frame retained on said base, a plurality of contacts received in said base and a switch member rotatable assembled on said base. Said actuated device includes a plurality of sustaining shafts with a plurality of rollers ringed thereon. Said switch member includes a plurality of rotating shafts retained on said base and a plurality of latching members engaged with said rotating shafts and rotating between an open position and a locking position. Said rollers of sustaining shafts moveable engaged with said latching member, which lowers the abrasion while the latching members are rotating between said open position and said locking position around said rotating shafts.

Abstract: An IC socket includes a socket body with a plurality of contacts disposed therein, a cover rotatablely coupled to the socket body and at least one slider in the socket body. The socket body defines a receiving space for receiving an IC package, and the cover has a driving member. The slider has one end engageable with the driving member and the other end extending toward the receiving space. When the IC socket is in a close position, the slider touches the IC package or close to the IC package to keep a reliable connection between the IC socket and the IC package.