Patents by Inventor Wen Yin
Wen Yin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250142969Abstract: A display panel is provided by the present disclosure. In the display panel of the present disclosure, a projection of a contact surface between a part of a second interlayer insulating layer and a part of a gate insulating layer on a first substrate does not coincide with a projection of a black matrix unit on the first substrate, thereby reducing reflection of the display panel to ambient light, improving a contrast ratio of the display panel, and improving a display effect of the display panel.Type: ApplicationFiled: December 30, 2024Publication date: May 1, 2025Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.Inventor: Wen YIN
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Patent number: 12287665Abstract: A clock circuit constructed in a processor integrated circuit includes a phase lock loop PLL, a clock tree, and a clock grid. The clock tree includes a plurality of clock buffers in a layered structure, The clock tree is configured to receive a first clock signal clk_1 that is output by the phase lock loop PLL, and to output a second clock signal clk_2. A plurality of child node circuits (400) are disposed on some nodes of the clock grid, and are configured to generate a third clock signal clk_3 based on the second clock signal clk_2. The clock grid (330) and the clock tree (320) are distributed on multiple dies in a three-dimensional structure of the processor integrated circuit.Type: GrantFiled: September 19, 2022Date of Patent: April 29, 2025Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventor: Wen Yin
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Patent number: 12256519Abstract: An immersion cooling system includes a cooling tank, a housing and a valve. The coolant tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The housing covers a side of the cooling tank and thereby forms an enclosure. The valve has two ports, one of which communicates with the enclosure and the other communicates with a part of the cooling tank above the liquid coolant. The valve is configured to open in response to a gas pressure inside the cooling tank exceeding an upper limit.Type: GrantFiled: May 30, 2022Date of Patent: March 18, 2025Assignee: DELTA ELECTRONICS, INC.Inventors: Wei-Chih Lin, Ren-Chun Chang, Yan-Hui Jian, Chia-Hsing Chen, Li-Hsiu Chen, Wen-Yin Tsai
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Patent number: 12224290Abstract: An array substrate includes an opening area and a non-opening area, and further includes a first substrate, a gate insulating layer, a first interlayer insulating layer, and a second interlayer insulating layer. The gate insulating layer is disposed on the first substrate and located in the opening area and the non-opening area. The first interlayer insulating layer is disposed on a side of the gate insulating layer away from the first substrate and located in the non-opening area. The second interlayer insulating layer is disposed on a side of the first interlayer insulating layer away from the first substrate and located in the opening area and the non-opening area. A projection of the first interlayer insulating layer on the first substrate is tangent to or separated from a projection of the opening area on the first substrate. A display panel includes the array substrate.Type: GrantFiled: March 14, 2022Date of Patent: February 11, 2025Assignee: Wuhan China Star Optoelectronics Technology Co., Ltd.Inventor: Wen Yin
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Patent number: 12200904Abstract: An immersion cooling system includes a cooling tank and a filtration system. The cooling tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The filtration system includes a pipeline, a pump, a filter and a cooling device. The pipeline is in fluid communication with the cooling tank. The pump is disposed in the pipeline and is configured to drive the liquid coolant to flow through the pipeline. The filter is disposed in the pipeline and is configured to filter the liquid coolant. The cooling device is connected to the pipeline and is configured to cool the liquid coolant. The pipeline has an inlet connected to the cooling tank. The cooling device is located between the pump and the inlet of the pipeline.Type: GrantFiled: June 5, 2022Date of Patent: January 14, 2025Assignee: DELTA ELECTRONICS, INC.Inventors: Wei-Chih Lin, Ren-Chun Chang, Yan-Hui Jian, Wen-Yin Tsai, Li-Hsiu Chen
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Patent number: 12193188Abstract: An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed inside the tank. The enclosure is disposed outside the tank. The enclosure forms a second space together with the tank. The second condenser is disposed in the second space. The connecting pipe includes a first end and a second end opposite to the first end. The first end is connected with the second condenser. The second end is communicated with the first space.Type: GrantFiled: May 17, 2022Date of Patent: January 7, 2025Assignee: DELTA ELECTRONICS, INC.Inventors: Chia-Yi Lin, Wei-Chih Lin, Ren-Chun Chang, Yan-Hui Jian, Hsuan-Ting Liu, Li-Hsiu Chen, Wen-Yin Tsai
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Publication number: 20240396227Abstract: An antenna module having an antenna in a mold layer, and related fabrication methods are disclosed. The antenna module includes a substrate that supports one or more semiconductor dies (“dies”). The die(s) can include radio-frequency (RF) circuits. A mold layer is formed over the die(s) and the package substrate to insulate and protect the die(s). The antenna is electrically coupled to the die(s). In exemplary aspects, an antenna (e.g., an antenna patch, waveguide, and/or dipole antenna elements) is provided in the mold layer. For example, the antenna can be formed in the mold layer adjacent to the die(s), wherein the antenna is electrically coupled to the die(s) through the substrate. In this manner, the mold layer can be provided having a desired dielectric constant to achieve better attenuation characteristics for the antenna to meet the performance requirements for supporting higher frequencies as an example.Type: ApplicationFiled: May 25, 2023Publication date: November 28, 2024Inventors: Chien-Te Feng, Jay Scott Salmon, Wen Yin
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Patent number: 12150275Abstract: The present disclosure provides an immersion cooling system for a server cabinet including a plurality of server boxes, a cooling tank and a plurality of liquid connecting pipes. Each server box includes an electronic device immersed in the cooling liquid, and the electronic device generates a thermal energy so that part of the cooling liquid evaporates into a hot vapor. The cooling tank is connected to the plurality of server boxes and includes a condenser and a storage part. The condenser is connected to each server box and condenses the hot vapor to form the cooling liquid. The storage part storages the cooling liquid from the condenser. Two ends of the liquid connecting pipe is connected to the storage part and the server box respectively. The cooling liquid in the storage part and the cooling liquid of each server box are maintained in a same liquid level.Type: GrantFiled: August 8, 2022Date of Patent: November 19, 2024Assignee: Delta Electronics, Inc.Inventors: Li-Hsiu Chen, Ming-Tang Yang, Wei-Chih Lin, Peng-Yuan Chen, Sheng-Chi Wu, Ren-Chun Chang, Wen-Yin Tsai
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Patent number: 12128082Abstract: A method for extracting flavone aglycones in Chrysanthemum morifolium is provided. The method includes: (a) immersing a Chrysanthemum morifolium raw material in water or an aqueous solution to perform an immersion procedure for 3.5 hours or more to obtain an immersion sample; and (b) adding an extraction solvent to the immersion sample to perform an extraction procedure 5-60 minutes to obtain an extract. The Chrysanthemum morifolium raw material includes at least one of the following parts of Chrysanthemum morifolium: whole plant, roots, stems, leaves and flowers.Type: GrantFiled: December 23, 2021Date of Patent: October 29, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin Jan Yao, Yu-Wen Chen, Chu-Hsun Lu, I-Hong Pan, Wen-Yin Chen, Tsung-Lin Yang, Angela Goh
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Publication number: 20240338328Abstract: A data processing system includes a computing subsystem and a memory subsystem. In the computing subsystem, a processor is connected to one end of a high-speed parallel bus via a first bus interface. The processor transmits data to the memory subsystem and receives data transmitted through the high-speed parallel bus. The memory subsystem receives and transmits data to the computing subsystem through the high-speed parallel bus.Type: ApplicationFiled: June 14, 2024Publication date: October 10, 2024Inventors: Wen Yin, Wei Li, Yigang Zhou, Manbo Wu, Xianzhou Lin, Chuanwei Wen, Ruonan Wang, Yining Li
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Patent number: 12100649Abstract: A device comprising a package and a board. The package includes a substrate comprising a first surface and a second surface, a passive component coupled to the first surface of the substrate, an integrated device coupled to the second surface of the substrate, a back side metal layer coupled to a back side of the integrated device, a first solder interconnect coupled to the back side metal layer, and a plurality of solder interconnects coupled to the second surface of the substrate. The board is coupled to the package through the plurality of solder interconnects. The first solder interconnect is coupled to the board.Type: GrantFiled: September 22, 2021Date of Patent: September 24, 2024Assignee: QUALCOMM INCORPORATEDInventors: Chien-Te Feng, Wen Yin, Jay Scott Salmon
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Patent number: 12041751Abstract: An immersion cooling system includes a tank, an isolation plate and a condenser. The tank includes a base plate and a sidewall connected with the base plate. The sidewall defines with the base plate a space configured to accommodate a cooling liquid. The isolation plate connects with the sidewall or the base plate and divides the space into a first subsidiary space and a second subsidiary space. The first subsidiary space is configured to accommodate electronic equipment which is immersed in the cooling liquid. The isolation plate and the base plate are separated from each other. The sidewall surrounds the condenser. A vertical projection of the condenser towards the base plate at least partially overlaps with the second subsidiary space. The electronic equipment evaporates a portion of the cooling liquid to form a vapor. The condenser is configured to condense the vapor into a liquid form.Type: GrantFiled: May 5, 2022Date of Patent: July 16, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Yan-Hui Jian, Chiu-Chin Chang, Wei-Chih Lin, Ren-Chun Chang, Chih-Hung Tsai, Li-Hsiu Chen, Wen-Yin Tsai
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Patent number: 12041746Abstract: A fixing device includes a main body, a sliding block, and a fixing rod. The main body has a sliding rail and a guiding hole, and the sliding rail which is disposed at a front side of the main body vertically extends. The guiding hole adjoins the sliding rail and horizontally extends through the main body. The sliding block is slidably connected to the sliding rail. The fixing rod is movably connected to the sliding block extending through the guiding hole, and the sliding block is configured to move along the sliding rail and enable the guiding hole to drive the fixing rod to horizontally move.Type: GrantFiled: April 1, 2022Date of Patent: July 16, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Chiu-Chin Chang, Kuan-Lung Wu, Li-Hsiu Chen, Wen-Yin Tsai
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Publication number: 20240074119Abstract: An immersion cooling system includes a pressure seal tank, an electronic apparatus, a pressure balance pipe and a relief valve. The pressure seal tank is configured to store coolant. A vapor space is formed in the pressure seal tank above the liquid level of the coolant. The electronic apparatus is completely immersed in the coolant. The pressure balance pipe has a gas collection length. The first port of the pressure balance pipe is disposed on the top surface of the pressure seal tank. The relief valve is disposed on the second port of the pressure balance pipe. The second port is farther away from the top surface of the pressure seal tank than the first port. The gas collection length of the pressure equalization tube allows the concentration of vaporized coolant at the first port to be greater than the concentration of vaporized coolant at the second port.Type: ApplicationFiled: May 9, 2023Publication date: February 29, 2024Inventors: Ren-Chun CHANG, Wei-Chih LIN, Sheng-Chi WU, Wen-Yin TSAI, Li-Hsiu CHEN
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Publication number: 20240047483Abstract: An array substrate includes an opening area and a non-opening area, and further includes a first substrate, a gate insulating layer, a first interlayer insulating layer, and a second interlayer insulating layer. The gate insulating layer is disposed on the first substrate and located in the opening area and the non-opening area. The first interlayer insulating layer is disposed on a side of the gate insulating layer away from the first substrate and located in the non-opening area. The second interlayer insulating layer is disposed on a side of the first interlayer insulating layer away from the first substrate and located in the opening area and the non-opening area. A projection of the first interlayer insulating layer on the first substrate is tangent to or separated from a projection of the opening area on the first substrate. A display panel includes the array substrate.Type: ApplicationFiled: March 14, 2022Publication date: February 8, 2024Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.Inventor: Wen YIN
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Publication number: 20230401459Abstract: An image inference method is provided by the present disclosure. The method includes determining a target collocation scheme for an image according to an inference request and a preset weight table, the target collocation scheme including a hardware accelerator in an idle state and an estimated time duration of inferring the image. A usage state of the hardware accelerator in the target collocation scheme is updated to be an in use state, and the image is inferred according to the target collocation scheme. When the inferring of the image is completed, the usage state of the hardware accelerator is updated from the in use state to be the idle state. Once an actual time duration of inferring the image is obtained, the estimated time duration is updated to be the actual time duration.Type: ApplicationFiled: June 30, 2022Publication date: December 14, 2023Inventors: YUNG-CHING CHIEN, WEN-YIN WANG
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Publication number: 20230389231Abstract: The present disclosure provides an immersion cooling system for a server cabinet including a plurality of server boxes, a cooling tank and a plurality of liquid connecting pipes. Each server box includes an electronic device immersed in the cooling liquid, and the electronic device generates a thermal energy so that part of the cooling liquid evaporates into a hot vapor. The cooling tank is connected to the plurality of server boxes and includes a condenser and a storage part. The condenser is connected to each server box and condenses the hot vapor to form the cooling liquid. The storage part storages the cooling liquid from the condenser. Two ends of the liquid connecting pipe is connected to the storage part and the server box respectively. The cooling liquid in the storage part and the cooling liquid of each server box are maintained in a same liquid level.Type: ApplicationFiled: August 8, 2022Publication date: November 30, 2023Inventors: Li-Hsiu Chen, Ming-Tang Yang, Wei-Chih Lin, Peng-Yuan Chen, Sheng-Chi Wu, Ren-Chun Chang, Wen-Yin Tsai
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Patent number: 11824128Abstract: A photocurrent-generating electrode includes a supporting substrate, a first nanoparticle layer, a second nanoparticle layer, and a semiconductor nanostructure formed on the second nanoparticle layer and having a biocompatible semiconductor nanomaterial. The first nanoparticle layer has first noble metal nanoparticles bonded to the supporting substrate. The second nanoparticle layer is formed on the first nanoparticle layer, and has second noble metal nanoparticles having an average dimension larger than an average dimension of the first noble metal nanoparticles. Two adjacent ones of the second noble metal nanoparticles are electrically connected to each other through one of the first noble metal nanoparticles.Type: GrantFiled: January 26, 2022Date of Patent: November 21, 2023Assignee: NATIONAL CHUNG-HSING UNIVERSITYInventors: Kuan-Jiuh Lin, Wen-Yin Ko
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Patent number: 11804428Abstract: Disclosed is a package and method of forming the package with a mixed pad size. The package includes a first set of pads having a first size and a first pitch, where the first set of pads are solder mask defined (SMD) pads. The package also includes a second set of pads having a second size and a second pitch, where the second set of pads are non-solder mask defined (NSMD) pads.Type: GrantFiled: November 13, 2020Date of Patent: October 31, 2023Assignee: QUALCOMM INCORPORATEDInventors: Wen Yin, Yonghao An, Manuel Aldrete
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Patent number: D1064815Type: GrantFiled: May 10, 2022Date of Patent: March 4, 2025Assignee: Kenvue Brands LLCInventors: Wen Yin Hsueh, Travis England, Chung-Tao Tu