Patents by Inventor Wen Yuan
Wen Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250109057Abstract: A glass composition includes, based on 100 wt % of the glass composition, silicon dioxide present in an amount ranging from 45 wt % to 61 wt %, aluminum oxide present in an amount (A) ranging from 15 wt % to 22 wt %, calcium oxide present in an amount (C) ranging from 0.1 wt % to 6 wt %, magnesium oxide present in an amount (M) of greater than 0 wt % and lower than 2 wt %, zinc oxide present in an amount of greater than 0 wt % and lower than 8 wt %, copper oxide present in an amount of greater than 0 wt % and lower than 7 wt %, and boron oxide present in an amount of greater than 6 wt % and lower than 18 wt %. A glass fiber including the glass composition, and an electronic product including the glass fiber are also provided.Type: ApplicationFiled: April 26, 2024Publication date: April 3, 2025Inventors: Hsien-Chung HSU, Bih-Cherng CHERN, Ching-Shuo CHANG, Chih-Yuan CHANG, Wei-Chih LO, Wen-Ho HSU
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Publication number: 20250110039Abstract: Provided are a method and apparatus for analyzing a laying stress on a cable. The method for analyzing a laying stress on a cable includes: segmenting, according to cable grounding manners, cable laying manners and cable bending types that correspond to the discrete points of pipeline detection in a cable laying channel, the discrete points; and performing, according to segmentation information and measurement information of the discrete points, stress analysis calculation on minimum segments in which the discrete points are located. In the present application, stress analysis of each segment of the cable during the cable laying process is achieved in real time, providing data support for laying the cable. Workers responsible for laying the cable can adopt corresponding protective measures during the laying process according to a stress analysis result so that the cable can be really protected, improving the safety of the cable during the cable laying process.Type: ApplicationFiled: November 24, 2022Publication date: April 3, 2025Inventors: Jianhua CUI, Wen HE, Zhibin YUAN, Xun WU, Zhiyang LIU, Jufen YE, Rui YANG, Guanke LIU, Ganbiao WANG, Fan KUANG, Huan LI, Yunfeng HU, Guo ZHAI, Zhuojia LI, Hang DU, Runhu LU
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Publication number: 20250109118Abstract: Disclosed herein are compounds of formula (I), and/or a stereoisomer, a stable isotope, or a pharmaceutically acceptable salt or solvate thereof; and therapeutic uses of these compounds, which are inhibitors of SHP2, potentially useful in the treatment of SHP2-associated diseases, such as SHP2-associated cancers.Type: ApplicationFiled: December 28, 2021Publication date: April 3, 2025Inventors: Qun LI, Jintao ZHANG, Shanzhong JIAN, Ao LI, Xia YUAN, Wen XU
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Publication number: 20250108774Abstract: A safety belt structure of racing cars that can be quickly put on and taken off is disclosed. The safety belt structure includes a buckle socket, a buckle clip, and two elastic buckle locks. One end of the buckle socket and the buckle clip are mutually buckled and have a socket part and a clip part. The other ends of the buckle socket and the buckle clip both have a strap-through part and are respectively pivoted with a transverse safety belt. The buckle socket and the buckle clip both have a quick-release buckle clip protruding on one side. One end of the elastic buckle lock has a slot formed to allow the quick-release buckle clip to be inserted into, and the elastic buckle lock can be quickly released by pressing. The other ends of the two elastic buckle locks are formed with a long slot for installing a shoulder safety belt. Accordingly, the two elastic buckle locks can be used to achieve the effect of quickly putting on and taking off the shoulder safety belts.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Applicant: TAIWAN RACING PRODUCTS CO., LTD.Inventor: Wen-Yuan Wu
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Patent number: 12265774Abstract: Boundary cells may be provided. A boundary of a first functional cell of a circuit is determined. A first plurality of a first type of dummy cells are placed along a first portion of the determined boundary. The first portion extends in a first direction. Each of the first type of dummy cells comprises first pre-defined dimensions. A second plurality of a second type of dummy cells are placed along a second portion of the determined boundary. The second portion extends in a second direction. Each of the second type of dummy cells comprises second pre-defined dimensions. The second pre-defined dimensions is different than the first pre-defined dimensions.Type: GrantFiled: June 8, 2023Date of Patent: April 1, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Jung Chang, Min-Yuan Tsai, Wen-Ju Yang
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Publication number: 20250100501Abstract: A seat belt locking buckle may include a fastener which is bent to form a first connecting end, and a round first connecting hole penetrating through the first connecting end is connected to a shoulder safety belt. An anti-scratch washer is coupled and connected with the inner periphery of the first connecting hole. The anti-scratch washer is outwardly folded at top and bottom ends to form an upper periphery and a lower periphery, and the anti-scratch washer is secured in the first connecting hole through the upper periphery and the lower periphery, and two round inner fillets are respectively formed at the junctions between the upper periphery and the inner periphery of the anti-scratch washer and between the lower periphery and the inner periphery of the anti-scratch washer.Type: ApplicationFiled: September 27, 2023Publication date: March 27, 2025Applicant: TAIWAN RACING PRODUCTS CO., LTD.Inventor: Wen-Yuan Wu
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Publication number: 20250092258Abstract: A ultra-high molecular weight siloxane polymer modified membrane for use in closed system transfer device membranes.Type: ApplicationFiled: August 9, 2022Publication date: March 20, 2025Inventors: Wen Yuan, Xianhong Feng
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Publication number: 20250085502Abstract: The anti-twist structure includes a base, a lens housing, an elastic sheet and a yoke member. The lens housing has a margin wall with a first protrusion, a second protrusion and a contact portion. The contact portion is extended outwardly the first protrusion, and the second protrusion is protruded from the contact portion. The first protrusion and the second protrusion are protruded along an axial direction substantially perpendicular to the margin wall. The elastic sheet is disposed on the contact portion. When the lens housing deflects from the horizontal reference line to a maximum value of the deflectable angle, the first protrusion abuts against an upper wall of the yoke member, the second protrusion abuts against the elastic sheet, and the contact portion abuts against the elastic sheet or the upper wall at the same time, whereby the lens housing and the yoke member interfere with each other.Type: ApplicationFiled: November 25, 2024Publication date: March 13, 2025Applicant: Lanto Electronic LimitedInventors: Wen-Yen Huang, Meng-Ting Lin, Fu-Yuan Wu, Shang-Yu Hsu, Bing-Bing Ma, Jie Du
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Publication number: 20250089281Abstract: Provided are a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a substrate including a fin portion, first and second doped regions having a first conductive type, first and second contacts, and first and second metal silicide layers. The fin portion protrudes from a surface of the substrate. The first doped region is disposed in the fin portion. The second doped region is disposed in the fin portion and connected to the first doped region. A doping concentration of the second doped region is greater than that of the first doped region. The first contact is disposed on the first doped region. The second contact is disposed on the second doped region. The first metal silicide layer is disposed between the first contact and the first doped region. The second metal silicide layer is disposed between the second contact and the second doped region.Type: ApplicationFiled: October 15, 2023Publication date: March 13, 2025Applicant: United Microelectronics Corp.Inventors: Wen-Kai Lin, Sheng-Yuan Hsueh, Kuo-Hsing Lee, Chih-Kai Kang
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Publication number: 20250085503Abstract: The anti-twist structure includes a base, a lens housing, an elastic sheet and a yoke member. The lens housing has a margin wall with a first protrusion, a second protrusion and a contact portion. The contact portion is extended outwardly the first protrusion, and the second protrusion is protruded from the contact portion. The first protrusion and the second protrusion are protruded along an axial direction substantially perpendicular to the margin wall. The elastic sheet is disposed on the contact portion. When the lens housing deflects from the horizontal reference line to a maximum value of the deflectable angle, the first protrusion abuts against an upper wall of the yoke member, the second protrusion abuts against the elastic sheet, and the contact portion abuts against the elastic sheet or the upper wall at the same time, whereby the lens housing and the yoke member interfere with each other.Type: ApplicationFiled: November 25, 2024Publication date: March 13, 2025Applicant: Lanto Electronic LimitedInventors: Wen-Yen Huang, Meng-Ting Lin, Fu-Yuan Wu, Shang-Yu Hsu, Bing-Bing Ma, Jie Du
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Publication number: 20250076607Abstract: A camera structure, including a lens holder, a lens frame and a plurality of balls. The lens holder has a holder body, one end of which has a first rolling groove. The first groove wall part and the second groove wall part are disposed on two sides of the first rolling groove, and the groove bottom is disposed between the first groove wall part and the second groove wall part. The lens frame is mounted on an outer side of the holder body. The plurality of balls are located inside the first rolling groove, wherein the first groove wall part and the second groove wall part support the plurality of balls, there is a gap between each of the plurality of balls and the groove bottom, and the plurality of balls lay between the lens holder and the lens frame.Type: ApplicationFiled: May 29, 2024Publication date: March 6, 2025Applicant: Lanto Electronic LimitedInventors: Ngoc-Luong NGUYEN, Wei-Han HSIA, Po-Ying TSENG, Wen-Yen HUANG, Shang-Yu HSU, Fu-Yuan WU
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Publication number: 20250075076Abstract: A self-healing membrane includes a material having a molecular weight greater than 35 k Da, at least 50% by weight of mineral oil, at least 40% styrenic block copolymer, and 0-10% polypropylene. The membrane may be utilized in any component of a closed system transfer device or system, such as a syringe adapter, patient connector, vial adapter, IV bag spike, etc. The membrane may also be utilized in other medical device components and, more specifically, medical device components where the membrane is punctured by a needle.Type: ApplicationFiled: July 29, 2022Publication date: March 6, 2025Inventors: Wen Yuan, Xianhong Feng
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Publication number: 20250071983Abstract: A method for fabricating a semiconductor device includes the steps of first providing a substrate having a transistor region and an one time programmable (OTP) capacitor region, forming a first fin-shaped structure on the transistor region and a second fin-shaped structure on the OTP capacitor region, and then performing an oxidation process to form a gate oxide layer on the first fin-shaped structure and the second fin-shaped structure. Preferably, the first fin-shaped structure and the second fin-shaped structure have different shapes under a cross-section perspective.Type: ApplicationFiled: September 24, 2023Publication date: February 27, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Kuo-Hsing Lee, Sheng-Yuan Hsueh, Yung-Chen Chiu, Chih-Kai Kang, Wen-Kai Lin
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Publication number: 20250071949Abstract: An electrical connector assembly includes an electrical connector having a card slot and plural terminals extending into the card slot; and a heat dissipation module having a fixing plate at one end thereof, the fixing plate having a notch; wherein the electrical connector has a supporting surface for supporting the fixing plate and a fixing member for mating with the notch, the fixing member includes a spherical or hemispherical head portion for guiding the fixing plate at multiple angles.Type: ApplicationFiled: August 19, 2024Publication date: February 27, 2025Inventors: MING-XIANG CHEN, KUO-CHUN HSU, WEN-NAN HSU, YU-YUAN SHEN, TSANG-HO YANG
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Publication number: 20250066854Abstract: A method of early detection of Type 1 diabetes uses a quantitative assay to measure biomarkers of autoimmune diseases at specific short regions of a gene sequence. The assay uses amplicon deep sequencing to quantify individual variants of the ERV Group Antigen (Gag) gene associated with an overactive immune response.Type: ApplicationFiled: August 1, 2024Publication date: February 27, 2025Inventors: Yang Dai, Wen-Yuan Hu
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Patent number: 12238396Abstract: An anti-twist structure of a voice coil motor includes a base, a lens housing, a first elastic sheet, a second elastic sheet, a magnet, and a yoke member. The lens housing has first margin wall and a second margin wall, and a first protrusion extends from the first margin wall. The yoke member has a first wall, a connection wall, a second wall, and a side wall. The first wall is disposed above the first protrusion, and the second wall is above the first margin wall. The lens housing has a deflectable angle relative to a horizontal reference line. When the lens housing deflects to a maximum value of the deflectable angle, the first margin wall abuts against the second wall and/or the first protrusion abuts against the first wall.Type: GrantFiled: May 21, 2021Date of Patent: February 25, 2025Assignee: LANTO ELECTRONIC LIMITEDInventors: Wen-Yen Huang, Meng-Ting Lin, Fu-Yuan Wu, Shang-Yu Hsu, Bing-Bing Ma, Jie Du
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Patent number: 12237414Abstract: A method includes receiving a semiconductor substrate. The semiconductor substrate has a top surface and includes a semiconductor element. Moreover, the semiconductor substrate has a fin structure formed thereon. The method also includes recessing the fin structure to form source/drain trenches, forming a first dielectric layer over the recessed fin structure in the source/drain trenches, implanting a dopant element into a portion of the fin structure beneath a bottom surface of the source/drain trenches to form an amorphous semiconductor layer, forming a second dielectric layer over the recessed fin structure in the source/drain trenches, annealing the semiconductor substrate, and removing the first and second dielectric layers. After the annealing and the removing steps, the method further includes further recessing the recessed fin structure to provide a top surface. Additionally, the method includes forming an epitaxial layer from and on the top surface.Type: GrantFiled: May 7, 2021Date of Patent: February 25, 2025Assignee: TAIWAN SEMICONDCUTOR MANUFACTURING CO., LTD.Inventors: Chih-Ching Wang, Wen-Yuan Chen, Wen-Hsing Hsieh, Kuan-Lun Cheng, Chung-Wei Wu, Zhiqiang Wu
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Patent number: 12227865Abstract: A plating apparatus for electroplating a wafer includes a housing defining a plating chamber for housing a plating solution. A voltage source of the apparatus has a first terminal having a first polarity and a second terminal having a second polarity different than the first polarity. The first terminal is electrically coupled to the wafer. An anode is within the plating chamber, and the second terminal is electrically coupled to the anode. A membrane support is within the plating chamber and over the anode. The membrane support defines apertures, wherein in a first zone of the membrane support a first aperture-area to surface-area ratio is a first ratio, and in a second zone of the membrane support a second aperture-area to surface-area ratio is a second ratio, different than the first ratio.Type: GrantFiled: July 25, 2022Date of Patent: February 18, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDInventors: Che-Min Lin, Hung-San Lu, Chao-Lung Chen, Chao Yuan Chang, Chun-An Kung, Chin-Hsin Hsiao, Wen-Chun Hou, Szu-Hung Yang, Ping-Ching Jiang
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Patent number: 12230242Abstract: Provided are a sound gathering device for voiceprint monitoring and a preparation method. The sound gathering device is a cone structure and includes a front end portion (1) and a rear end portion (2), the front end portion (1) is trumpet-shaped, an inner wall surface of the front end portion (1) is present a pattern array of a microstructure (3), and the microstructure (3) presenting the pattern array is formed through laser etching. A sound wave frequency monitored by the sound gathering device is 50 Hz˜10 kHz, and a sound wave enters the sound gathering device from an entrance of the front end portion (1), is reflected through the pattern array of the microstructure (3) on the inner wall surface of the front end portion (1), and is transmitted from an exit of the rear end portion (2), and a sound pressure of the exit of the rear end portion (2) is 4 times˜8 times a sound pressure of the entrance of the front end portion (1).Type: GrantFiled: July 20, 2023Date of Patent: February 18, 2025Assignee: State Grid Jiangsu Taizhou Power Supply CompanyInventors: Yong Li, Ting Chen, Ling Ju, Jijing Yin, Ze Zhang, Xingchun Xu, Beibei Weng, Zhenguo Chuai, Yan Wu, Li Chen, Yang Cheng, Tianyu He, Le Yuan, Jie Qian, Debao Tang, Yanquan Zhu, Anqi Ding, Kaiming Bian, Wen Chen, Wanjian Hu, Hongbo Dai, Weijun Shi
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Publication number: 20250054857Abstract: An integrated circuit (IC) device includes an interlayer dielectric (ILD), first and second tower structures embedded in the ILD, and first and second ring regions including portions of the ILD that correspondingly extend around the first and second tower structures. Each of the first and second tower structures includes a plurality of conductive patterns in a plurality of metal layers, and a plurality of vias between the plurality of metal layers along a thickness direction of the IC device. The plurality of conductive patterns and the plurality of vias are coupled to each other to form the corresponding first or second tower structure. The first ring region extends around the first tower structure, without extending around the second tower structure.Type: ApplicationFiled: October 29, 2024Publication date: February 13, 2025Inventors: Yu-Jung CHANG, Nien-Yu TSAI, Min-Yuan TSAI, Wen-Ju YANG