Patents by Inventor Wen Yuan
Wen Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250242851Abstract: A steering wheel is provided, wherein the steering wheel includes: a main frame including a central base and a plurality of spoke arms extending radially outward from the central base; an annular core surrounding the central base and directly connected to distal ends of the plurality of spoke arms; at least one heating element in contact with the annular core; and an outer coat structure encompassing the annular core and the at least one heating element.Type: ApplicationFiled: January 25, 2024Publication date: July 31, 2025Inventor: Wen-Yuan WU
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Publication number: 20250234965Abstract: A multi-point buckle has a buckle, at least two latches and a plurality of dust jackets. The dust jacket is employed between the latch and the tongue slot of the buckle to achieve a close fit and seal effects, which not only increases the structural engagement stability between the tongue slot and the tongue but also prevent sand, dust and dirt from falling into the tongue slot not causing the latch from shaking loose and the friction and interference of foreign objects in the buckle.Type: ApplicationFiled: January 24, 2024Publication date: July 24, 2025Inventor: Wen-Yuan Wu
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Patent number: 12368445Abstract: An integrated circuit device includes a digitally controlled oscillator (DCO), two charge-sharing capacitors, two charge-sharing switches, two pre-charge switches, and two DACs. The DCO has a first inverter and a second inverter. A first charge-sharing capacitor has a first terminal coupled to an input terminal of the first inverter through a first charge-sharing switch. A first DAC has an output terminal coupled to the first terminal of the first charge-sharing capacitor through a first pre-charge switch. A second charge-sharing capacitor has a first terminal coupled to an input terminal or an output terminal of the second inverter through a second charge-sharing switch. A second DAC has an output terminal coupled to the first terminal of the second charge-sharing capacitor through a second pre-charge switch.Type: GrantFiled: July 25, 2023Date of Patent: July 22, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Min-Shueh Yuan, Chao-Chieh Li, Chia-Chun Liao, Yu-Tso Lin, Wen-Yuan Tsai, Chih-Hsien Chang
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Publication number: 20250218989Abstract: An electronic component includes an integrated circuit die, having an upper surface including a plurality of bonding pads, wherein the plurality of bonding pads are electrically connected to a circuit of the integrated circuit die; and at least one passive component, electrically connected to the plurality of bonding pads by soldering.Type: ApplicationFiled: December 27, 2024Publication date: July 3, 2025Applicant: INTELPRO INC.Inventors: Lung-Kun Yu, Huai-Yi Hsu, Yu-Kuang Lien, Shang-Ta Tsai, Wen-Yuan Hsiao, Yen-Chih Chen
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Patent number: 12345584Abstract: A pressure sensor includes a substrate, a pressure sensing element, a first signal line, a second signal line, an elastomer, and an opposite substrate. The pressure sensing element includes first and second resistors connected in series, a third and fourth resistors connected in series, a first switch component, and a second switch component. The first and second resistors are connected in parallel to the third and fourth resistors. The first switch component is electrically connected between the first and second resistors. The second switch component is electrically connected between the third and fourth resistors. The first to fourth resistors at least partially overlap with a cavity of the elastomer, which can increase the stress on the first to fourth resistors when the pressure sensor is under pressure, thereby improving the sensitivity of the pressure sensor.Type: GrantFiled: December 28, 2022Date of Patent: July 1, 2025Assignee: AUO CorporationInventors: Yi-Han Chang, Chung-Chin Huang, Wen-Yuan Li, Wen-Chung Huang
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Patent number: 12336233Abstract: A semiconductor device having improved leakage current characteristics includes a semiconductor substrate with first and second nitride-based semiconductor layers so as to form a heterojunction therebetween with a two-dimensional electron gas (2DEG) region. A doped III-V nitride-based semiconductor layer is disposed over the second nitride-based semiconductor layer. The doped layer has a substantially inverted trapezoidal cross-sectional shape with a longer inverted trapezoid base as an upper surface of the doped III-V nitride-based semiconductor layer and a width of the cross-sectional shape decreasing as the distance away from the upper surface increases. A gate electrode is disposed on or above the doped III-V semiconductor layer and positioned on or above the longer inverted trapezoid base. At least two source/drain (S/D) electrodes are disposed over the second nitride-based semiconductor layer.Type: GrantFiled: January 25, 2022Date of Patent: June 17, 2025Assignee: INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.Inventors: Xiao Zhang, Lijie Zhang, Jue Ouyang, Wen-Yuan Hsieh
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Patent number: 12330585Abstract: A seat belt anchor is provided, wherein the seat belt anchor includes: a main body including a locking slot having an opening and an inner surface; and a locking member movably connected to the main body and movable between a lock position and a release position; wherein when the locking member is in the lock position, the locking member projects toward the locking slot to define a distance between the inner surface of the locking slot and the locking member which is larger than a diametric dimension of a shaft body of the fastener so that it allows the shaft body of the fastener to axially pass through the locking slot; wherein when the locking member is in the release position, it allows a ring body of the fastener to directly pass through the opening to be in the locking slot.Type: GrantFiled: July 12, 2024Date of Patent: June 17, 2025Assignee: TAIWAN RACING PRODUCTS CO., LTD.Inventor: Wen-Yuan Wu
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Publication number: 20250194208Abstract: The nitride-based semiconductor device includes a first nitride-based semiconductor layer, a second nitride-based semi-conductor layer, a first passivation layer, and an electrode structure. The second nitride-based semiconductor layer is disposed on the first nitride-based semiconductor layer and has a bandgap greater than a bandgap of the first nitride-based semiconductor layer. The first passivation layer is disposed on the second nitride-based semiconductor layer. The electrode structure is disposed on the second nitride-based semiconductor layer and the first passivation layer and penetrates the first passivation layer to make contact with the second nitride-based semiconductor layer, in which the electrode structure has a sidewall extending upward from the first passivation layer and oblique with respect to the first passivation layer.Type: ApplicationFiled: April 14, 2022Publication date: June 12, 2025Applicant: INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.Inventors: Xiao ZHANG, Lijie ZHANG, Jue OUYANG, Wen-Yuan HSIEH
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Publication number: 20250174507Abstract: A method of forming a semiconductor device with an embedded die is provided. The method includes forming a plurality of redistribution traces at a first major side of a package substrate. A cavity is formed in the package substrate. The plurality of redistribution traces substantially surrounding an opening of the cavity at the first major side. A semiconductor die is mounted in the cavity. A wire bond is formed between a bond pad of the semiconductor die and a wiring pad of a redistribution trace of the plurality of redistribution traces. An encapsulant encapsulates the semiconductor die and the first major side of the package substrate. A base region of the redistribution trace is exposed.Type: ApplicationFiled: November 27, 2023Publication date: May 29, 2025Inventors: Kuan-Hsiang Mao, Wen Yuan Chuang, Pey Fang Hiew, Wen Hung Huang, Yujen Tien
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Publication number: 20250153621Abstract: A composite material seat is provided, including: a main body, including a back support portion and a seat portion which are integrally formed from composite material, the back support portion extending longitudinally, the back support portion having at least two first reinforcement ribs transversely extending to each other; thus, it provides high structural strength and high support.Type: ApplicationFiled: November 9, 2023Publication date: May 15, 2025Inventor: Wen-Yuan WU
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Publication number: 20250155997Abstract: A touchpad device includes a substrate, a touch panel, a switch, a balancing assembly, and a triggering member. An inner surface of the touch panel facing the substrate has a central region. The switch is disposed between the substrate and the touch panel and corresponds to the central region. The balancing assembly is disposed between the touch panel and the substrate and includes a first balancing bar, a second balancing bar, a third balancing bar, and a fourth balancing bar. The triggering member has a top portion and a bottom portion, the bottom portion is leaned against end portions of a first swing bar of the first balancing bar, a second swing bar of the second balancing bar, a third swing bar of the third balancing bar, and a fourth swing bar of the fourth balancing bar which are adjacent to the switch, and the top portion contacts the switch.Type: ApplicationFiled: September 17, 2024Publication date: May 15, 2025Inventors: Po-Hsin Li, Min-Yuan Chen, Wen-Yuan Lin
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Patent number: 12300749Abstract: A method includes receiving a semiconductor substrate. The semiconductor substrate has a top surface and includes a semiconductor element. Moreover, the semiconductor substrate has a fin structure formed thereon. The method also includes recessing the fin structure to form source/drain trenches, forming a first dielectric layer over the recessed fin structure in the source/drain trenches, implanting a dopant element into a portion of the fin structure beneath a bottom surface of the source/drain trenches to form an amorphous semiconductor layer, forming a second dielectric layer over the recessed fin structure in the source/drain trenches, annealing the semiconductor substrate, and removing the first and second dielectric layers. After the annealing and the removing steps, the method further includes further recessing the recessed fin structure to provide a top surface. Additionally, the method includes forming an epitaxial layer from and on the top surface.Type: GrantFiled: August 10, 2023Date of Patent: May 13, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Chih-Ching Wang, Wen-Yuan Chen, Wen-Hsing Hsieh, Kuan-Lun Cheng, Chung-Wei Wu, Zhiqiang Wu
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Publication number: 20250149431Abstract: A manufacturing method of an electronic package includes the following steps. A first interfacial dielectric layer is formed to cover sides of multiple first conductive vias and multiple second conductive vias. Multiple chips are directly bonded to the first and second conductive vias. A base dielectric layer is formed to fill a gap between the adjacent chips. A bridge element is directly bonded to the first conductive vias, such that the bridge element partially overlaps the adjacent chips respectively. A second interfacial dielectric layer and multiple third conductive vias are formed on the first interfacial dielectric layer and the bridge element. A redistribution circuit structure is formed on the second interfacial dielectric layer and the third conductive vias. Multiple conductive bumps are formed on the redistribution circuit structure. An electronic package is also provided.Type: ApplicationFiled: July 8, 2024Publication date: May 8, 2025Applicant: VIA Technologies, Inc.Inventors: Wen-Yuan Chang, Wei-Cheng Chen, Chen-Yueh Kung
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Publication number: 20250132235Abstract: A method of manufacturing a semiconductor device is provided. The method includes forming a first non-conductive layer over a top side a semiconductor die and patterning the first non-conductive layer to form an opening exposing a top surface of a bond of the semiconductor die. A metal trace of a redistribution layer is formed over a portion of the first non-conductive layer and exposed top surface of the bond pad. A surrounding bump metallization (SBM) structure is formed on a portion of the metal trace. The SBM structure includes a plurality of vertical metal wall segments surrounding a central opening.Type: ApplicationFiled: October 18, 2023Publication date: April 24, 2025Inventors: Kuan-Hsiang Mao, Che Ming Fang, Wen Yuan Chuang, Wen Hung Huang
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Publication number: 20250116719Abstract: A method for determining the reference internal impedance of a battery includes the following steps: (a) during a sensing period, sensing a battery voltage, a battery current flowing through the battery, and a battery temperature to obtain a sensing result, thereby determining a depth of discharge (DOD); (b) in step (a), comparing the sensing result with a predetermined threshold to determine whether to accept the sensing result; (c) when the sensing result is accepted, calculating a corresponding battery internal impedance based on the sensing result and the depth of discharge; (d) performing regression analysis on the battery internal impedance and a plurality of previous battery internal impedances to obtain a moving average battery internal impedance corresponding to the depth of discharge; and (e) obtaining a corresponding reference battery internal impedance based on the moving average battery internal impedance.Type: ApplicationFiled: September 19, 2024Publication date: April 10, 2025Inventors: Chieh-En Chen, Fu-Chi Lin, Wen-Yuan Li
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Patent number: 12268756Abstract: A biocompatible magnetic material containing an iron oxide nanoparticle and one or more biocompatible polymers, each having formula (I) below, covalently bonded to the iron oxide nanoparticle: in which each of variables R, L, x, and y is defined herein, the biocompatible magnetic material contains 4-15% Fe(II) ions relative to the total iron ions. Also disclosed in a method of preparing the biocompatible magnetic material.Type: GrantFiled: November 24, 2021Date of Patent: April 8, 2025Assignee: MegaPro Biomedical Co. Ltd.Inventors: Wen-Yuan Hsieh, Yuan-Hung Hsu, Chia-Wen Huang, Ming-Cheng Wei, Chih-Lung Chen, Shian-Jy Wang
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Publication number: 20250108774Abstract: A safety belt structure of racing cars that can be quickly put on and taken off is disclosed. The safety belt structure includes a buckle socket, a buckle clip, and two elastic buckle locks. One end of the buckle socket and the buckle clip are mutually buckled and have a socket part and a clip part. The other ends of the buckle socket and the buckle clip both have a strap-through part and are respectively pivoted with a transverse safety belt. The buckle socket and the buckle clip both have a quick-release buckle clip protruding on one side. One end of the elastic buckle lock has a slot formed to allow the quick-release buckle clip to be inserted into, and the elastic buckle lock can be quickly released by pressing. The other ends of the two elastic buckle locks are formed with a long slot for installing a shoulder safety belt. Accordingly, the two elastic buckle locks can be used to achieve the effect of quickly putting on and taking off the shoulder safety belts.Type: ApplicationFiled: September 28, 2023Publication date: April 3, 2025Applicant: TAIWAN RACING PRODUCTS CO., LTD.Inventor: Wen-Yuan Wu
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Patent number: D1076713Type: GrantFiled: September 27, 2023Date of Patent: May 27, 2025Inventor: Wen-Yuan Wu
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Patent number: D1076714Type: GrantFiled: September 27, 2023Date of Patent: May 27, 2025Inventor: Wen-Yuan Wu
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Patent number: D1087729Type: GrantFiled: February 13, 2023Date of Patent: August 12, 2025Assignee: TAIWAN RACING PRODUCTS CO., LTD.Inventor: Wen-Yuan Wu