Abstract: A bill acceptor is constructed to include a housing, the housing having a base for holding a banknote for examination, a first light emitter adapted to emit infrared light onto the banknote carried on the base of the housing for examination, a second light emitter adapted to emit ultraviolet light onto the banknote for visual examination, an image sensor adapted to pick up infrared light reflected from the banknote carried on the base of the housing and to convert received light signal into image signal, and a display adapted to display image signal obtained from the image sensor for verifying the authenticity of the banknote.

Abstract: A frame including a first edge and a second edge, wherein on outer surfaces of the first edge, first hooks are formed to protrude outwardly, and on outer surfaces of the second edge, first holes are formed. A bezel has a first sidewall and a second sidewall, wherein on the first sidewall, second holes are formed, and on outer surfaces of the second sidewall, second hooks are formed to protrude outwardly. When the frame is mounted onto the bezel, the first edge is disposed onto inside surfaces of the first sidewall, and the first hooks are inserted and engaged in the second holes for fastening the frame and bezel, simultaneously the second edge is disposed onto the outside surfaces of the second sidewall, and the second hooks are inserted and engaged in the first holes for fastening the frame and the bezel.

Abstract: A method of dynamically determining a maximum polyphony number is used in an electronic device, which has S tone generators. First, an operation mode of the electronic device is detected. Next, a residual computing power of the electronic device is obtained according to the operation mode. Then, a maximum polyphony number is determined according to a constant computing power, which is required to synthesize a polyphony, and the residual computing power. Next, the states of T tone generators of the S tone generators are set to be an ON state according to the maximum polyphony number, wherein T is a positive integer and is smaller than or equal to S.

Abstract: A chip embedded package structure is provided. A stiffener is disposed on a tape. The tape has at least an alignment mark and the stiffener has at least a chip opening. A chip having a plurality of bonding pads thereon is disposed on the tape within the chip opening such that the bonding pads face the tape. A plurality of through holes is formed in the tape to expose the bonding pads respectively. After that, an electrically conductive material is deposited to fill the through holes and form a plurality of conductive vias that connects with the bonding pads respectively. A multi-layered interconnection structure is formed on the surface of the tape away from the chip. The multi-layered interconnection structure has an inner circuit that connects to the conductive vias. The inner circuit has a plurality of metallic pads disposed on the outer surface of the multi-layered interconnection structure.

Abstract: After a transmitter has encoded a flag value, the flag value is included in a block. A method for analyzing the reliability of the flag value outputted by the transmitter includes receiving the block; according to the received block, obtaining a coded flag value; according to the coded flag value, decoding the coded flag value to obtain a decoded flag result; determining whether or not the received block is or is not a dummy block; and if the received block is determined to be a dummy block, negating the reliability of the decoded flag result; otherwise, analyzing the reliability of the coded flag value to determine whether to affirm or negate the reliability of the decoded flag result.

Abstract: A semiconductor packaging substrate and a process for producing the same is disclosed. An internal circuit is formed by lamination. Then, external circuit is formed on the internal circuit by build-up technology. The substrate can be used as a flip-chip ball grid array packaging substrate with high density and small pitch. Furthermore, the substrate of the invention has a plurality of bonding pads thereon. The bump pads are divided into power/ground bump pads, first signal bump pads, and second signal bump pads. The first signal bump pads surround the power/ground bump pads and are surrounded by the second signal bump pads.

Abstract: An air cleaner for engines includes a fender provided on the side of the air inlet and the air passage, and a hollow tube adapted to the air inlet to prevent weeds, dust, and pebbles from entering into the air cleaner for enabling clean air to be delivered to the engine continuously and protecting the carburetor from being contaminated by foreign matter.

Abstract: An air cleaner for engines includes a fender provided on the side of the air inlet and the air passage, and a hollow tube adapted to the air inlet to prevent weeds, dust, and pebbles from entering into the air cleaner for enabling clean air to be delivered to the engine continuously and protecting the carburetor from being contaminated by foreign matter.

Abstract: A semiconductor packaging substrate and a process for producing the same is disclosed. An internal circuit is formed by lamination. Then, external circuit is formed on the internal circuit by build-up technology. The substrate can be used as a flip-chip ball grid array packaging substrate with high density and small pitch. Furthermore, the substrate of the invention has a plurality of bonding pads thereon. The bump pads are divided into power/ground bump pads, first signal bump pads, and second signal bump pads. The first signal bump pads surround the power/ground bump pads and are surrounded by the second signal bump pads.

Abstract: A carrier device for a contact image sense optical scanner. The carrier device incorporates a pair of magnets with identical poles facing each other or a fluid filled sealed chamber for exerting an equal pressure on a scanning module within the scanner and maintaining close contact with a document platform throughout a scanning operation.

Abstract: Plasmid DNA from single yeast colonies was efficiently amplified using rolling circle amplification (RCA). The amplified DNA was directly used for restriction digestion, DNA sequencing, and yeast transformation. The RCA of plasmid DNA from single yeast colonies for direct retransformation of yeast simplifies conventional procedures for yeast two-hybrid analysis and is suitable for high-throughput analyses. In summary, we have developed several methods to manipulate plasmid DNA in yeast. It will greatly simplify a number of yeast-based molecular biology tools, particularly yeast two-hybrid analysis. The methods are very useful for high-throughput assays.

Abstract: A packaging structure for a container. The packaging structure comprises a main frame including a first portion, a second portion and a connecting plate connecting the first and second portions, and a plurality of separators inserted in first and second grooves defined at the first and second portions respectively. The glass substrate is sealed in a loading slot formed by the separators.

Abstract: An organic light emitting diode (OLED) display includes a substrate defined with a plurality of pixel areas, a heating circuit structure disposed on the substrate, and a plurality of OLEDs corresponding to each pixel area. The heating circuit structure includes two conductive lines not connected to each other, a plurality of heating lines electrically connected to the two conductive lines and covering portions of each pixel areas, and a ground electrode.

Abstract: A non-destructive contact test method for testing an electric characteristic of a test object is provided. The method includes providing an apparatus having a conductor, wherein the conductor is in a liquid state; and using the conductor to contact a surface of the test object for testing the electric characteristic of the test object. Thus, damage to the test object during the test can be effectively avoided.

Abstract: A method of manufacturing an N-channel metal-oxide-semiconductor (NMOS) transistor with a P-type gate is provided. A substrate is provided and then a gate dielectric layer is formed over the substrate. An indium doped polysilicon layer is formed over the gate dielectric layer in an in-situ deposition process. The indium doped polysilicon layer and the gate dielectric layer are patterned to form a gate structure. An N-doped source/drain region is formed in the substrate beside the gate structure to form the P-type gate NMOS transistor. Since the indium doped polysilicon layer is formed in an in-situ deposition process instead of boron implantation, lattice defects in the gate are minimized the problem of penetration for boron ions is solved.

Abstract: A leading wire arrangement in a lighting fixture with back light module provides a set of connecting wire led from the lighting fixture to a rear side of the back light module via a lateral wall of the back light module.

Abstract: In a heat dissipating assembly, a base frame is disposed underneath a circuit board and includes a bottom part with opposite first and second sides that are formed with first and second engaging units, respectively. The first and second engaging units extend upwardly through a set of through holes in the circuit board. A heat-dissipating module is mounted on the circuit board and includes a heat transfer plate to establish heat-conductive contact with an electronic component on the circuit board. An anchoring device includes a first anchoring unit that engages the first engaging unit, a second anchoring unit that engages the second engaging unit, and an abutting unit connected to the first and second anchoring units. The anchoring device biases the heat transfer plate toward the electronic component when the first and second anchoring units engage the first and second engaging units.

Abstract: An optical scanner is provided with a carrier, a casing, a driving unit and a transmission unit. The carrier has a connecting unit and an optical system mounted thereon. The casing has a guiding rail formed as integral unit on the interior wall. The guiding rail has at least a fastener for latching onto the connecting unit of the carrier. The transmission unit links up the driving unit and the carrier. The driving unit drives the transmission unit and then the transmission unit pulls the carrier along the guiding rail through the linkage between the connecting unit and the fastener.

Abstract: A bill acceptor is constructed to include a housing, the housing having a base for holding a banknote for examination, a first light emitter adapted to emit infrared light onto the banknote carried on the base of the housing for examination, a second light emitter adapted to emit ultraviolet light onto the banknote for visual examination, an image sensor adapted to pick up infrared light reflected from the banknote carried on the base of the housing and to convert received light signal into image signal, and a display adapted to display image signal obtained from the image sensor for verifying the authenticity of the banknote.

Abstract: A container structure formed with metal and plastic bonded together in the invention has an outer body made of a metal material and provided with perforated holes thereon, and an insert body made of a plastic material, whereby the insert body is first heated with high temperature, inserted into the outer body, and then fed in blow air with a blowing machine so that the insert body is expanded and attached to an inner surface of the outer body and further extended into and filled up the perforated holes so as to be tightly bonded with the outer body to form an integral one. The container will represent a three-dimensional and multi-layered aestheticism to increase its commercial value; the metal-made outer body can reinforce the rigidness of the container to be more durable in use; the plastic-made insert body is convenient for cleaning an interior of the container.