Abstract: The present invention provides a method of fabricating an embedded circuit board, including: providing an inner laminated structure (10) which is a double-sided circuit board; providing a third circuit board (103) and a fourth circuit board (104), and respectively laminating them on two sides of the inner laminated structure (10); two spaced through holes (30) are formed in the structure obtained in the previous step; electroplating an outer surface of the third circuit board (103) and the fourth circuit board (104) and an inner surface of the through holes (30) to form a first plating layer (50); removing a structure between the two through holes (30) to form a slot (40) having the two through holes (30) at two ends; the electronic component (200) is received and fixed in a middle portion of the slot (40) such that electrodes (201) of the electronic component (200) are directed to the two ends of the slot (40) and electrically connect to the first plating layer (50); providing a first circuit board (101) and

Abstract: A method includes etching a first oxide layer in a wafer. The etching is performed in an etcher having a top plate overlapping the wafer, and the top plate is formed of a non-oxygen-containing material. The method further includes etching a nitride layer underlying the first oxide layer in the etcher until a top surface of a second oxide layer underlying the nitride layer is exposed. The wafer is then removed from the etcher, with the top surface of the second oxide layer exposed when the wafer is removed.

Abstract: A flexible printed circuit board used in a loudspeaker as a dome and a holder supporting the dome has a top surface and a bottom surface opposite to the top surface. The flexible printed circuit board comprises a dome portion and a supporting portion surrounding the dome portion. The dome portion is formed by the top surface being depressed from the top surface to the bottom surface and the bottom surface projecting from the top surface to the bottom surface; and a supporting portion surrounds the dome portion.

Abstract: A method includes etching a first oxide layer in a wafer. The etching is performed in an etcher having a top plate overlapping the wafer, and the top plate is formed of a non-oxygen-containing material. The method further includes etching a nitride layer underlying the first oxide layer in the etcher until a top surface of a second oxide layer underlying the nitride layer is exposed. The wafer is then removed from the etcher, with the top surface of the second oxide layer exposed when the wafer is removed.

Abstract: A method for manufacturing a flexible printed circuit board comprising: providing a first flexible precursor board having a layer; adhering a first covering layer with a lower opening, a portion of the circuit layer exposed; adhering a second covering layer with an upper opening to the first covering layer, the upper opening being formed in the lower opening, and a portion of circuit layer being exposed to obtain a second flexible precursor board; providing an upper mound having a protruding portion and a lower mound having a recessed portion, moving the second flexible precursor board between the upper mound and the lower mound, the upper opening being positioned away from the protruding portion and the recessed portion, pressing the upper mound to the lower mound to press the protruding portion into the recessed portion; removing the upper mound and the lower mound to get the flexible printed circuit board.

Abstract: An electrical connector includes an insulating body provided with an accommodating cavity for insertion of a mating connector; and a plurality of terminals retained in the insulating body. At least one of the terminals has a retaining portion, an extending portion extending forward from the retaining portion, a contact portion bending upward from a front end of the extending portion and obliquely extending backward into the accommodating cavity, and a supporting portion bending upward and extending from one side of the extending portion. The supporting portion is located below the contact portion. When a non-matching mating connector is inserted into the accommodating cavity, the contact portion abuts the supporting portion, and the supporting portion is configured to block the contact portion from excessive downward deviation.

Abstract: The present application provides a chewable tablet containing vitamin C sodium. The chewable tablet includes the following components in parts by weight: 20-100 parts of vitamin C sodium, 100-500 parts of starch, 10-30 parts of sweetener, 5-20 parts of mannitol, 30-100 parts of microcrystalline cellulose, 5-20 parts of povidone K-30, 20-60 parts of sodium carboxymethyl starch, 5-20 parts of sodium dodecyl sulfate, 1-5 parts of magnesium stearate and 0.1-0.5 part of mint essence. The present application is easy to prepare, sweet in taste and stable in quality.

Abstract: An embedded circuit board includes a flexible printed circuit board, a component, a conductive material, two adhesive layers, and two substrates. The flexible printed circuit board defines at least one cavity passing through the flexible printed circuit board. The flexible printed circuit board includes a base layer, a first conductive circuit layer formed on at least one surface of the base layer, and a protective layer formed on both sides of the base layer. The base layer and the first conductive circuit layer protrude into the cavity. The component is received within the cavity and abuts against the first conductive circuit layer protruding into the cavity. The conductive material is applied in a gap between the component and the first conductive circuit layer. The two substrates are adhered to the flexible printed circuit board by the two adhesive layers.

Abstract: Described herein is an omni-directional transmission scheme allowing signals to transmit from a base station to multiple users in massive MIMO systems with reduced pilot overhead and system complexity. The transmission scheme uses a low-dimensional space-time coding scheme to generate a K-dimensional vector signal, and based on the K-dimensional vector signal, using an omni-directional precoding matrix W to generate an M-dimensional vector signal for transmission over a large number of transmitting antennas, wherein the matrix W comprises M rows and K columns, and K is much smaller than M.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin structure over the base. The fin structure has sidewalls. The semiconductor device structure includes a passivation layer over the sidewalls. The passivation layer includes dopants. The dopants include at least one element selected from group 4A elements, and the dopants and the substrate are made of different materials. The semiconductor device structure includes an isolation layer over the base and surrounding the fin structure and the passivation layer. A first upper portion of the fin structure and a second upper portion of the passivation layer protrude from the isolation layer. The semiconductor device structure includes a gate electrode over the first upper portion of the fin structure and the second upper portion of the passivation layer.

Abstract: A printed circuit board comprises a base, a circuit layer, a circuit layer, a first insulating layer, and a second insulating layer. The circuit layer is on the base. The first insulating layer has a pattern, the first insulating layer is fixed on the base. The pattern of the first insulating layer matches a pattern of the circuit layer. The second insulating layer is laminated on the circuit layer and the first insulating layer. Openings are defined in the second insulating layer, the circuit layer is exposed from the openings.

Abstract: A flexible printed circuit board used in a loudspeaker as a dome and a holder supporting the dome has a top surface and a bottom surface opposite to the top surface. The flexible printed circuit board comprises a dome portion and a supporting portion surrounding the dome portion. The dome portion is formed by the top surface being depressed from the top surface to the bottom surface and the bottom surface projecting from the top surface to the bottom surface; and a supporting portion surrounds the dome portion.

Abstract: An electrical connector includes an insulating body provided with an accommodating cavity for insertion of a mating connector; and a plurality of terminals retained in the insulating body. At least one of the terminals has a retaining portion, an extending portion extending forward from the retaining portion, a contact portion bending upward from a front end of the extending portion and obliquely extending backward into the accommodating cavity, and a supporting portion bending upward and extending from one side of the extending portion. The supporting portion is located below the contact portion. When a non-matching mating connector is inserted into the accommodating cavity, the contact portion abuts the supporting portion, and the supporting portion is configured to block the contact portion from excessive downward deviation.

Abstract: A method includes etching a first oxide layer in a wafer. The etching is performed in an etcher having a top plate overlapping the wafer, and the top plate is formed of a non-oxygen-containing material. The method further includes etching a nitride layer underlying the first oxide layer in the etcher until a top surface of a second oxide layer underlying the nitride layer is exposed. The wafer is then removed from the etcher, with the top surface of the second oxide layer exposed when the wafer is removed.

Abstract: Described herein is an omni-directional transmission scheme allowing signals to transmit from a base station to multiple users in massive MIMO systems with reduced pilot overhead and system complexity. The transmission scheme uses a low-dimensional space-time coding scheme to generate a K-dimensional vector signal, and based on the K-dimensional vector signal, using an omni-directional precoding matrix W to generate an M-dimensional vector signal for transmission over a large number of transmitting antennas, wherein the matrix W comprises M rows and K columns, and K is much smaller than M.

Abstract: An isolation mount assembly comprises a resilient member defining a central aperture that defines a load axis and an annular depression about the load axis, and an adapter plate including an outer mechanical attachment structure that defines a first thickness and an inner attachment structure that is closer to the load axis than the outer attachment structure along a direction that is perpendicular to the load axis and that defines a second thickness. The inner attachment structure is disposed in the annular depression and the second thickness is at least twice the first thickness.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin structure over the base. The fin structure has sidewalls. The semiconductor device structure includes a passivation layer over the sidewalls. The passivation layer includes dopants. The dopants include at least one element selected from group 4A elements, and the dopants and the substrate are made of different materials. The semiconductor device structure includes an isolation layer over the base and surrounding the fin structure and the passivation layer. A first upper portion of the fin structure and a second upper portion of the passivation layer protrude from the isolation layer. The semiconductor device structure includes a gate electrode over the first upper portion of the fin structure and the second upper portion of the passivation layer.

Abstract: An isolation mount assembly comprises a resilient member defining a central aperture that defines a load axis and an annular depression about the load axis, and an adapter plate including an outer mechanical attachment structure that defines a first thickness and an inner attachment structure that is closer to the load axis than the outer attachment structure along a direction that is perpendicular to the load axis and that defines a second thickness. The inner attachment structure is disposed in the annular depression and the second thickness is at least twice the first thickness.

Abstract: One embodiment provides an electroplating apparatus, which includes a tank filled with an electrolyte solution, a number of anodes situated around edges of the tank, a cathode situated above the tank, and a plurality of wafer-holding jigs attached to the cathode. A respective wafer-holding jig includes a common connector electrically coupled to the cathode and a pair of wafer-mounting frames electrically coupled to the common connector. Each wafer-mounting frame includes a plurality of openings, and a respective opening provides a mounting space for a to-be-plated solar cell, thereby facilitating simultaneous plating of front and back surfaces of the plurality of the solar cells.

Abstract: A wireless communication method utilizes a large-scale antenna array, which is deployed at the base station and can be a one-dimensional or two-dimensional array and can form tens of beams over the area covered by the base station. The communications method utilizes beam domain division of spatial resources at the base station side utilizing an analog multi-beam forming network or a digital domain multi-beam forming method. The base station carries out wireless communication with multiple users with the same time frequency resource and with the communications process implemented in the beam domain. Scheduling is accomplished through the utilization of a deterministic unitary matrix to form beams. The unitary matrix is a correlation matrix of interference that includes a channel characteristics mode energy coupling matrix, the beam allocation providing beam sets of different users that are non-overlapping to distinguish users in the beam domain.