Abstract: An isolation mount assembly comprises a resilient member defining a central aperture that defines a load axis and an annular depression about the load axis, and an adapter plate including an outer mechanical attachment structure that defines a first thickness and an inner attachment structure that is closer to the load axis than the outer attachment structure along a direction that is perpendicular to the load axis and that defines a second thickness. The inner attachment structure is disposed in the annular depression and the second thickness is at least twice the first thickness.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin structure over the base. The fin structure has sidewalls. The semiconductor device structure includes a passivation layer over the sidewalls. The passivation layer includes dopants. The dopants include at least one element selected from group 4A elements, and the dopants and the substrate are made of different materials. The semiconductor device structure includes an isolation layer over the base and surrounding the fin structure and the passivation layer. A first upper portion of the fin structure and a second upper portion of the passivation layer protrude from the isolation layer. The semiconductor device structure includes a gate electrode over the first upper portion of the fin structure and the second upper portion of the passivation layer.

Abstract: An isolation mount assembly comprises a resilient member defining a central aperture that defines a load axis and an annular depression about the load axis, and an adapter plate including an outer mechanical attachment structure that defines a first thickness and an inner attachment structure that is closer to the load axis than the outer attachment structure along a direction that is perpendicular to the load axis and that defines a second thickness. The inner attachment structure is disposed in the annular depression and the second thickness is at least twice the first thickness.

Abstract: One embodiment provides an electroplating apparatus, which includes a tank filled with an electrolyte solution, a number of anodes situated around edges of the tank, a cathode situated above the tank, and a plurality of wafer-holding jigs attached to the cathode. A respective wafer-holding jig includes a common connector electrically coupled to the cathode and a pair of wafer-mounting frames electrically coupled to the common connector. Each wafer-mounting frame includes a plurality of openings, and a respective opening provides a mounting space for a to-be-plated solar cell, thereby facilitating simultaneous plating of front and back surfaces of the plurality of the solar cells.

Abstract: A wireless communication method utilizes a large-scale antenna array, which is deployed at the base station and can be a one-dimensional or two-dimensional array and can form tens of beams over the area covered by the base station. The communications method utilizes beam domain division of spatial resources at the base station side utilizing an analog multi-beam forming network or a digital domain multi-beam forming method. The base station carries out wireless communication with multiple users with the same time frequency resource and with the communications process implemented in the beam domain. Scheduling is accomplished through the utilization of a deterministic unitary matrix to form beams. The unitary matrix is a correlation matrix of interference that includes a channel characteristics mode energy coupling matrix, the beam allocation providing beam sets of different users that are non-overlapping to distinguish users in the beam domain.

Abstract: The present invention provides a wireless communication method that utilizes large-scale antenna array.

Abstract: In a method for protecting private information stored in a mobile device, a first instruction is received to activate a private protection function of the mobile device. A second instruction is received to select a private information stored in the mobile device. The mobile device is connected to a pair of glasses and the selected private information is transmitted to the pair of glasses. The selected private information is displayed on a visual screen of the pair of glasses, and not displayed on a screen of the mobile device.

Abstract: One embodiment provides an electroplating apparatus, which includes a tank filled with an electrolyte solution, a number of anodes situated around edges of the tank, a cathode situated above the tank, and a plurality of wafer-holding jigs attached to the cathode. A respective wafer-holding jig includes a common connector electrically coupled to the cathode and a pair of wafer-mounting frames electrically coupled to the common connector. Each wafer-mounting frame includes a plurality of openings, and a respective opening provides a mounting space for a to-be-plated solar cell, thereby facilitating simultaneous plating of front and back surfaces of the plurality of the solar cells.

Abstract: A multi-antenna channel estimation method based on polyphase decomposition includes: receiving frequency domain received signals transformed using discrete fourier transformation (DFT) in pilot symbols; performing phase correction on the frequency domain received signals; performing polyphase decomposition on the frequency domain received signals which are corrected using phase correction and acquiring polyphase signals; performing interpolation on the polyphase signals and acquiring the estimation values of the multi-antenna channel parameters with various linear combinations on each frequency; acquiring decorrelation array based on the pilot structure of the transmission antenna and decorrelating the estimation values of the multi-antenna channel parameters with various linear combination on each frequency using the decorrelation array and acquiring channel parameters of the pilot symbols on each frequency; acquiring channel parameters of data symbols based on the channel parameters of the pilot symbols.

Abstract: A platinum plating solution for immersion plating a continuous film of platinum on a metal structure. The immersion platinum plating solution is free of a reducing agent. The plating process does not require electricity (e.g., electrical current) and does not require electrodes (e.g., anode and/or cathode). The solution includes a platinum source and a complexing agent including Oxalic Acid. The solution enables immersion plating of platinum onto a metal surface, a metal substrate, or a structure of which at least a portion is a metal. The resulting platinum plating comprises a continuous thin film layer of platinum having a thickness not exceeding 300 ?. The solution can be used for plating articles including but not limited to jewelry, medical devices, electronic structures, microelectronics structures, MEMS structures, nano-sized or smaller structures, structures used for chemical and/or catalytic reactions (e.g., catalytic converters), and irregularly shaped metal surfaces.

Abstract: A platinum plating solution for immersion plating a continuous film of platinum on a metal structure. The immersion platinum plating solution is free of a reducing agent. The plating process does not require electricity (e.g., electrical current) and does not require electrodes (e.g., anode and/or cathode). The solution includes a platinum source and a complexing agent including Oxalic Acid. The solution enables immersion plating of platinum onto a metal surface, a metal substrate, or a structure of which at least a portion is a metal. The resulting platinum plating comprises a continuous thin film layer of platinum having a thickness not exceeding 300 ?. The solution can be used for plating articles including but not limited to jewelry, medical devices, electronic structures, microelectronics structures, MEMS structures, nano-sized or smaller structures, structures used for chemical and/or catalytic reactions (e.g., catalytic converters), and irregularly shaped metal surfaces.

Abstract: A platinum plating solution for immersion plating a continuous film of platinum on a metal structure. The immersion platinum plating solution is free of a reducing agent. The plating process does not require electricity (e.g., electrical current) and does not require electrodes (e.g., anode and/or cathode). The solution includes a platinum source and a complexing agent including Oxalic Acid. The solution enables immersion plating of platinum onto a metal surface, a metal substrate, or a structure of which at least a portion is a metal. The resulting platinum plating comprises a continuous thin film layer of platinum having a thickness not exceeding 300 ?. The solution can be used for plating articles including but not limited to jewelry, medical devices, electronic structures, microelectronics structures, MEMS structures, nano-sized or smaller structures, structures used for chemical and/or catalytic reactions (e.g., catalytic converters), and irregularly shaped metal surfaces.

Abstract: A multi-antenna channel estimation method based on polyphase decomposition includes: receiving frequency domain received signals transformed using discrete fourier transformation (DFT) in pilot symbols; performing phase correction on the frequency domain received signals; performing polyphase decomposition on the frequency domain received signals which are corrected using phase correction and acquiring polyphase signals; performing interpolation on the polyphase signals and acquiring the estimation values of the multi-antenna channel parameters with various linear combinations on each frequency; acquiring decorrelation array based on the pilot structure of the transmission antenna and decorrelating the estimation values of the multi-antenna channel parameters with various linear combination on each frequency using the decorrelation array and acquiring channel parameters of the pilot symbols on each frequency; acquiring channel parameters of data symbols based on the channel parameters of the pilot symbols.

Abstract: A meter receives a new communication frame from a power line, and determines whether the new communication frame is used to read power consumption of the meter. If the new communication frame is used to read power consumption of the meter, the meter generates a response frame of the new communication frame, and broadcasts the response frame to the concentrator via the power line to report the power consumption of the meter. If the new communication frame is not used to read power consumption of the meter, the meter broadcasts the new communication frame to the at least one other meter and the concentrator via the power line.

Abstract: A non-Flash non-volatile cross-trench memory array formed using an array of trenches formed back-end-of-the-line (BEOL) over a front-end-of-the-line (FEOL) substrate includes two-terminal memory elements operative to store at least one bit of data that are formed at a cross-point of a first trench and a second trench. The first and second trenches are arranged orthogonally to each other. At least one layer of memory comprises a plurality of the first and second trenches to form a plurality of memory elements. The non-volatile memory can be used to replace or emulate other memory types including but not limited to embedded memory, DRAM, SRAM, ROM, and FLASH. The memory is randomly addressable down to the bit level and erase or block erase operation prior to a write operation are not required.

Abstract: A platinum plating solution for immersion plating a continuous film of platinum on a metal structure. The immersion platinum plating solution is free of a reducing agent. The plating process does not require electricity (e.g., electrical current) and does not require electrodes (e.g., anode and/or cathode). The solution includes a platinum source and a complexing agent including Oxalic Acid. The solution enables immersion plating of platinum onto a metal surface, a metal substrate, or a structure of which at least a portion is a metal. The resulting platinum plating comprises a continuous thin film layer of platinum having a thickness not exceeding 300 ?. The solution can be used for plating articles including but not limited to jewelry, medical devices, electronic structures, microelectronics structures, MEMS structures, nano-sized or smaller structures, structures used for chemical and/or catalytic reactions (e.g., catalytic converters), and irregularly shaped metal surfaces.

Abstract: A housing assembly (10) for use in a portable electronic device, includes base (14) and a decorative element (12). The base (14) has a securing portion (144) protruding therefrom; The decorative element (12) has a securing groove (126) corresponding to the securing portion (144) and the cross-sectional area of the securing groove (126) being smaller than the cross-sectional area of the securing portion (144); When the decorative element (12) is pressed toward the base (14), the decorative element (12) may be elastically deformed due to the pressing force, and the cross-sectional area of the securing groove (126) is enlarged so the securing portion (144) can be pushed in the securing groove (126); and when the pressing force is removed, the securing groove (126) begins trying to shrink to its original state so that the securing portion (144) is press-fit within the securing groove (126) to mount the decorative element (12) on the base (14).

Abstract: A housing assembly (10) for use in a portable electronic device, comprises a base (14) and a decorative element (12). The base (14) has a securing portion (144) protruding therefrom; The decorative element (12) has a securing groove (126) corresponding to the securing portion (144) and the cross-sectional area of the securing groove (126) being smaller than the cross-sectional area of the securing portion (144); When the decorative element (12) is pressed toward the base (14), the decorative element (12) may be elastically deformed due to the pressing force, and the cross-sectional area of the securing groove (126) is enlarged so the securing portion (144) can be pushed in the securing groove (126); and when the pressing force is removed, the securing groove (126) begins trying to shrink to its original state so that the securing portion (144) is press-fit within the securing groove (126) to mount the decorative element (12) on the base (14).

Abstract: The invention provides natural ligands of TGR183 receptors and methods of identifying modulators of various TGR183 receptors using the ligands. Methods of using the modulators to treat diseases or disorders associated with dysfunction of the TGR183 receptor are also provided.

Abstract: An optical drop structure comprising a multi-port optical circulator (MOC), a first reflection filter unit optically connected in series between a first port and a second port of the MOC, a second reflection filter unit optically connected in series between a third port and a fourth port of the MOC, and the optical drop structure is arranged, in use, in a manner such that, a first optical signal entering through a fifth port of the MOC is subjected to the first reflection filter unit and exits at a sixth port of the MOC and a reflected portion of the first optical signal exits at a seventh port of the MOC, and a second optical signal entering through the sixth port of the MOC is subjected to the second reflection filter unit and exits at the fifth port of the MOC and a reflected portion of the second optical signal exits at an eights port of the MOC.