Abstract: A bendable circuit board includes a first rigid wiring board, a first flexible film, a circuit substrate, a second rigid wiring board, a second flexible film, and a third rigid wiring board which are stacked in said order. The circuit substrate is a rigid double-sided circuit board. The first rigid wiring board defines a first window area in which the first flexible film is exposed, and the third rigid wiring board defines a second window area in which the second flexible film is exposed. The present disclosure further provides a method for manufacturing the bendable circuit board.

Abstract: According to various aspects of the present invention, a positive electrode composition for a lithium-ion secondary battery includes an active material capable of inserting and extracting lithium ions, and a conductor, wherein the active material is a lithium-nickel-cobalt-manganese complex oxide; the conductor is a carbon black and carbon nanotubes; the carbon black has a BET specific surface area of 100 to 400 m2/g, and a DBP absorption of 210 to 380 ml/100 g; and the carbon nanotubes have an average diameter of 7 to 15 nm.

Abstract: A method, system and computer program product for processing data are provided. In the method, a request is received to perform an access-controlled operation in a user device. A biometric feature input from an input module of the user device is received for the request. It is determined whether the received biometric feature matching with a primary biometric feature, the primary biometric feature being identified from a plurality of biometric features stored in the user device and being used to authenticate a user for the access-controlled operation. The access-controlled operation is enabled in response to determining the received biometric feature matching with a primary biometric feature.

Abstract: A method for aligning different portions of a conduit includes adjustably holding a first portion of a conduit in a first position, adjustably holding a second portion of a conduit in a second position relative to the first position of the first portion of the conduit, and inserting a bellows installation tool between the first portion of the conduit and the second portion of the conduit.

Abstract: A massive multiple-input multiple-output (MIMO) robust precoding transmission method under imperfect channel state information (CSI), wherein the imperfect CSI obtained by the base station (BS) side of the massive MIMO system is modeled as an a posteriori statistical channel model including channel mean and channel variance information. The model considers the effects of channel estimation error, channel aging and spatial correlation. The BS performs the robust precoding transmission by using the a posteriori statistical channel model, so that the universality problem of the massive MIMO to various typical moving scenarios can be solved, and high spectral efficiency is achieved.

Abstract: The present invention provides a method of fabricating an embedded circuit board, including: providing an inner laminated structure (10) which is a double-sided circuit board; providing a third circuit board (103) and a fourth circuit board (104), and respectively laminating them on two sides of the inner laminated structure (10); two spaced through holes (30) are formed in the structure obtained in the previous step; electroplating an outer surface of the third circuit board (103) and the fourth circuit board (104) and an inner surface of the through holes (30) to form a first plating layer (50); removing a structure between the two through holes (30) to form a slot (40) having the two through holes (30) at two ends; the electronic component (200) is received and fixed in a middle portion of the slot (40) such that electrodes (201) of the electronic component (200) are directed to the two ends of the slot (40) and electrically connect to the first plating layer (50); providing a first circuit board (101) and

Abstract: A method includes etching a first oxide layer in a wafer. The etching is performed in an etcher having a top plate overlapping the wafer, and the top plate is formed of a non-oxygen-containing material. The method further includes etching a nitride layer underlying the first oxide layer in the etcher until a top surface of a second oxide layer underlying the nitride layer is exposed. The wafer is then removed from the etcher, with the top surface of the second oxide layer exposed when the wafer is removed.

Abstract: A flexible printed circuit board used in a loudspeaker as a dome and a holder supporting the dome has a top surface and a bottom surface opposite to the top surface. The flexible printed circuit board comprises a dome portion and a supporting portion surrounding the dome portion. The dome portion is formed by the top surface being depressed from the top surface to the bottom surface and the bottom surface projecting from the top surface to the bottom surface; and a supporting portion surrounds the dome portion.

Abstract: A method includes etching a first oxide layer in a wafer. The etching is performed in an etcher having a top plate overlapping the wafer, and the top plate is formed of a non-oxygen-containing material. The method further includes etching a nitride layer underlying the first oxide layer in the etcher until a top surface of a second oxide layer underlying the nitride layer is exposed. The wafer is then removed from the etcher, with the top surface of the second oxide layer exposed when the wafer is removed.

Abstract: A method for manufacturing a flexible printed circuit board comprising: providing a first flexible precursor board having a layer; adhering a first covering layer with a lower opening, a portion of the circuit layer exposed; adhering a second covering layer with an upper opening to the first covering layer, the upper opening being formed in the lower opening, and a portion of circuit layer being exposed to obtain a second flexible precursor board; providing an upper mound having a protruding portion and a lower mound having a recessed portion, moving the second flexible precursor board between the upper mound and the lower mound, the upper opening being positioned away from the protruding portion and the recessed portion, pressing the upper mound to the lower mound to press the protruding portion into the recessed portion; removing the upper mound and the lower mound to get the flexible printed circuit board.

Abstract: An electrical connector includes an insulating body provided with an accommodating cavity for insertion of a mating connector; and a plurality of terminals retained in the insulating body. At least one of the terminals has a retaining portion, an extending portion extending forward from the retaining portion, a contact portion bending upward from a front end of the extending portion and obliquely extending backward into the accommodating cavity, and a supporting portion bending upward and extending from one side of the extending portion. The supporting portion is located below the contact portion. When a non-matching mating connector is inserted into the accommodating cavity, the contact portion abuts the supporting portion, and the supporting portion is configured to block the contact portion from excessive downward deviation.

Abstract: The present application provides a chewable tablet containing vitamin C sodium. The chewable tablet includes the following components in parts by weight: 20-100 parts of vitamin C sodium, 100-500 parts of starch, 10-30 parts of sweetener, 5-20 parts of mannitol, 30-100 parts of microcrystalline cellulose, 5-20 parts of povidone K-30, 20-60 parts of sodium carboxymethyl starch, 5-20 parts of sodium dodecyl sulfate, 1-5 parts of magnesium stearate and 0.1-0.5 part of mint essence. The present application is easy to prepare, sweet in taste and stable in quality.

Abstract: An embedded circuit board includes a flexible printed circuit board, a component, a conductive material, two adhesive layers, and two substrates. The flexible printed circuit board defines at least one cavity passing through the flexible printed circuit board. The flexible printed circuit board includes a base layer, a first conductive circuit layer formed on at least one surface of the base layer, and a protective layer formed on both sides of the base layer. The base layer and the first conductive circuit layer protrude into the cavity. The component is received within the cavity and abuts against the first conductive circuit layer protruding into the cavity. The conductive material is applied in a gap between the component and the first conductive circuit layer. The two substrates are adhered to the flexible printed circuit board by the two adhesive layers.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a base and a fin structure over the base. The fin structure has sidewalls. The semiconductor device structure includes a passivation layer over the sidewalls. The passivation layer includes dopants. The dopants include at least one element selected from group 4A elements, and the dopants and the substrate are made of different materials. The semiconductor device structure includes an isolation layer over the base and surrounding the fin structure and the passivation layer. A first upper portion of the fin structure and a second upper portion of the passivation layer protrude from the isolation layer. The semiconductor device structure includes a gate electrode over the first upper portion of the fin structure and the second upper portion of the passivation layer.

Abstract: Described herein is an omni-directional transmission scheme allowing signals to transmit from a base station to multiple users in massive MIMO systems with reduced pilot overhead and system complexity. The transmission scheme uses a low-dimensional space-time coding scheme to generate a K-dimensional vector signal, and based on the K-dimensional vector signal, using an omni-directional precoding matrix W to generate an M-dimensional vector signal for transmission over a large number of transmitting antennas, wherein the matrix W comprises M rows and K columns, and K is much smaller than M.

Abstract: A printed circuit board comprises a base, a circuit layer, a circuit layer, a first insulating layer, and a second insulating layer. The circuit layer is on the base. The first insulating layer has a pattern, the first insulating layer is fixed on the base. The pattern of the first insulating layer matches a pattern of the circuit layer. The second insulating layer is laminated on the circuit layer and the first insulating layer. Openings are defined in the second insulating layer, the circuit layer is exposed from the openings.

Abstract: A flexible printed circuit board used in a loudspeaker as a dome and a holder supporting the dome has a top surface and a bottom surface opposite to the top surface. The flexible printed circuit board comprises a dome portion and a supporting portion surrounding the dome portion. The dome portion is formed by the top surface being depressed from the top surface to the bottom surface and the bottom surface projecting from the top surface to the bottom surface; and a supporting portion surrounds the dome portion.

Abstract: An electrical connector includes an insulating body provided with an accommodating cavity for insertion of a mating connector; and a plurality of terminals retained in the insulating body. At least one of the terminals has a retaining portion, an extending portion extending forward from the retaining portion, a contact portion bending upward from a front end of the extending portion and obliquely extending backward into the accommodating cavity, and a supporting portion bending upward and extending from one side of the extending portion. The supporting portion is located below the contact portion. When a non-matching mating connector is inserted into the accommodating cavity, the contact portion abuts the supporting portion, and the supporting portion is configured to block the contact portion from excessive downward deviation.

Abstract: A method includes etching a first oxide layer in a wafer. The etching is performed in an etcher having a top plate overlapping the wafer, and the top plate is formed of a non-oxygen-containing material. The method further includes etching a nitride layer underlying the first oxide layer in the etcher until a top surface of a second oxide layer underlying the nitride layer is exposed. The wafer is then removed from the etcher, with the top surface of the second oxide layer exposed when the wafer is removed.

Abstract: Described herein is an omni-directional transmission scheme allowing signals to transmit from a base station to multiple users in massive MIMO systems with reduced pilot overhead and system complexity. The transmission scheme uses a low-dimensional space-time coding scheme to generate a K-dimensional vector signal, and based on the K-dimensional vector signal, using an omni-directional precoding matrix W to generate an M-dimensional vector signal for transmission over a large number of transmitting antennas, wherein the matrix W comprises M rows and K columns, and K is much smaller than M.