Abstract: A heat dissipation device (1) includes a heat sink (10), a fan (20), and an air cooling member (30). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.

Abstract: An airflow-guiding device for being mounted into a computer system to periodically change airflow passing therethrough, comprises a motor, a gearing driven by the motor and a plurality of airflow-guiding plates pivoted to a frame and linked to the gearing and driven thereby to turn back and forth periodically. The gearing comprises a cam driven by the motor and a sliding board slideably mounted on a supporting member. The sliding board has a lateral side always in contact with the cam so that when the cam rotates, the sliding plate slides on the supporting member. The airflow-guiding plates each have a linking rod linked to the sliding board. The airflow-guiding plates periodically turn within a given angle following the rotation of the cam so as to change direction of airflow passing through the airflow-guiding plates.

Abstract: A fastener for a heat sink of the present invention includes a length-variable operating member (10), a piston member (20), an embracing member (30), a resilient member (40) and a post (58) extending from a printed circuit board (50). The piston member is movable in the operating member when the operating member varies between a shortest length and a longest length. The resilient member covers around the piston member. The embracing member is controllable cooperatively by the piston member and the resilient member to grasp the post or release the post.

Abstract: A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle U-shaped portion and two L-shaped portions at two sides of the U-shaped portion, respectively. The base is for contacting with a heat generating electronic device and transferring heat from the electronic device to the heat pipe and the fin set. The fin set defines a passageway in a middle of thereof. The U-shaped portion of the heat pipe is received in the passageway of the fin set and thermally engages with the fin set.

Abstract: A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base, a plurality of fins arranged on the base and at least one heat pipe thermally positioned on the base. The heat pipe includes a U-shaped first portion, a second portion and a connecting portion interconnecting the first and second portions. The first portion of the heat pipe thermally engages the base. The second portion of the heat pipe is located above the base, and thermally engages with the plurality of fins.

Abstract: A liquid cooling system includes a container (10) defining communicable first and second chambers (125a, 125b) therein, a pump (15) mounted on the container and having an entrance port (152) in flow communication with the second chamber, and an exit port (150) in flow communication with the first chamber so that the pump, the first chamber, and the second chamber together form a loop for circulation of coolant, and a heat dissipation unit (2) located at the loop for cooling the coolant.

Abstract: A liquid cooling system includes a cooling body (1) defining an hollow portion receiving a pump (3) and a number of cooling fins (18) therein, and a contact portion for contacting an electrical component. The cooling body defines a passageway therein filled with liquid coolant, and an inlet (124) and an outlet (125) both in communication with the passageway. The pump defines an exit (31) and an entrance (32) connected to the inlet and the outlet of the cooling body respectively by two tubes (5). Heat is transferred from the electrical component to the contact portion, and then conducted to the coolant, and conducted to other portions of the cooling body as the coolant flows through the passageway. The heat is then conducted to the cooling fins for dissipation.

Abstract: A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204) having a threaded bottom end (208). The sleeve comprises a cylindrical wall (302), an upper open end (304) and a lower open end (306). The sleeve further has an annular pedestal (308) perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring (22) is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.

Abstract: A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and having a plurality of fasteners extending upwardly beyond the circuit board, and a plurality of retainers. Each retainer includes an operating member resting on a heat sink, a locking member extending through the operating member, and a pushing member extending through the locking member. The locking member includes a locking structure extending through the heat sink to engage with one of the fasteners. The pushing member includes a taper bottom portion. The pushing member is downward movable to cause the taper bottom portion to disengage the locking structure from the one of the fasteners.

Abstract: A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.

Abstract: A liquid cooling system includes a tank (10) for thermally contacting a heat source (100), a cylindrical heat dissipating unit (20) mounted on the tank, and a pump (30) located within the cylindrical heat dissipating unit. The tank defines a cavity therein for containing liquid coolant for heat exchange, and an inlet (122) in communication with the cavity. The heat dissipating unit defines a chamber therein in flow communication with the cavity, and an outlet (275) in communication with the chamber. The pump has an entrance (31) in flow communication with the outlet, and an exit (32) in flow communication with the inlet, thereby the tank, the heat dissipating unit, and the pump together forming a loop for circulation the of liquid coolant.

Abstract: A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a first locking member extending the heat sink and the circuit board and having a block for pressing the heat sink, an operating member pivotably connected to the first locking member, a second locking member extending the heat sink and the circuit board and pivotably connected to the operating member, and an actuating structure formed between the first and second locking members. The first and second locking members each includes a hook located below the circuit board. The operating member is pivotable about the first locking member to drive the second locking member to move upwardly and to cause the actuating structure to simultaneously drive the first and second locking members to move away from each other, whereby the hooks engage below the circuit board.

Abstract: Transgenes encoding exogenous antibodies are stably integrated into donor cells and are present in the somatic tissue of chimeric birds. The transgenes encode exogenous antibodies and are preferably expressed in the oviduct for collection in the egg. Tissue specificity is provided by selecting the content of the transgene accordingly. Birds whose genome is comprised of trangene-derived exogenous antibody-encoding DNA express exogenous antibodies having desirable chemical properties with increased therapeutic utility compared to antibodies derived from bacterial expression systems.

Abstract: A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.

Abstract: An apparatus (1) for supporting a cooling device (30) thereon includes a bracket (10) and a saddle (20) carrying the cooling device (30) thereon. The bracket (10) defines two opposing rails (12), (13) and a washboard-like member (14) extending along a direction in which the rails (12), (13) extend. The saddle (20) includes a positioning member (26) engaged in the washboard-like member (14) to position the saddle (20) to the bracket (10) and two blocks (24) slidable on the rails (12), (13) of the bracket (10) under condition that the positioning member (26) is disengaged from the washboard-like member (14).

Abstract: A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

Abstract: A liquid cooling system includes a cooling unit (100) and a coolant driving unit (200). The cooling unit includes a first cooling body (110) defining a first cavity, a second cooling body (130) defining a second cavity in communication with the first cooling body (110), and a heat sink (150) sandwiched between the first and second cooling bodies. The coolant driving unit is in flow communication with the first and second cooling bodies respectively, so that the first and second cooling bodies and the coolant driving unit together form a loop. Circulation of the coolant in the loop causes the heat generated by the heat generating component to be capable of being transferred from the first and second cooling bodies to the heat sink for dissipation.

Abstract: A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

Abstract: A heat sink for dissipating heat of an electronic device comprises a base, a first fin group comprising a plurality of fins stacked together, a second fin group comprising a plurality of fins and overlapping the first fin group, and a sinuous heat pipe attached to the base. The first and second fin groups are respectively engaged with the heat pipe twice at different locations of the first and second fin groups.

Abstract: A heat sink for electronic component includes a base, a first heat dissipation member coupled to the base, heat pipes embedded in the base and a second heat dissipation member coupled to the base. The base is made of a first metal material and includes a heat absorbing portion having a bottom surface for contacting with the electronic component and a heat conductive portion extending from a top surface of heat absorbing portion. The first heat dissipation member is made of a second metal material and coupled to the heat absorbing portion of the base. The second heat dissipation member is made of second metal material and coupled to the heat conductive portion of the base. The first metal material differs from and has higher heat conductivity than the second metal material.