Patents by Inventor Wen Zhou

Wen Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMAL MODULE
    Publication number: 20100243207
    Abstract: A thermal module comprises a flat heat spreader, a fin unit arranged above the heat spreader and a plurality of solid poles interconnecting the heat spreader with the fin unit. The heat spreader defines a chamber therein. A working fluid is filled in the chamber. A wick structure is received in the chamber and attached to an inner wall of the heat spreader surrounding the chamber. The fin unit comprises a plurality of fins stacked together.
    Type: Application
    Filed: July 17, 2009
    Publication date: September 30, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: PENG LIU, SHI-WEN ZHOU, CHUN-CHI CHEN
  • HEAT DISSIPATION DEVICE
    Publication number: 20100238630
    Abstract: A heat dissipation device includes a heat sink and a pair of heat pipes fixed to the heat sink. The heat sink includes a rectangular post, four branches extending outwardly from four corners of the post, respectively, and a plurality of fins extending between the branches. Each heat pipe includes an evaporating section attached to a bottom of the post, a condensing section parallel to the evaporation section and attached to a top of the post, and an adiabatic section interconnecting the evaporating section and the condensing section. A block is secured to bottoms of the condensing sections of the heat pipes.
    Type: Application
    Filed: July 24, 2009
    Publication date: September 23, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHOU-BIAO XU, GUO CHEN, SHI-WEN ZHOU
  • Integrated Circuit with Improved Logic Cells
    Publication number: 20100219861
    Abstract: The present invention provides integrated circuits with improved logic cells. In one embodiment, an integrated circuit having a plurality of logic cells (LC) is provided, each LC comprising: a lookup table having a LUT output terminal; and, a first multiplexer; wherein, a first multiplexer input terminal is connected to of a first input terminal of the LC, a second multiplexer input terminal is connected to the LUT output terminal, a multiplexer output terminal is connected to a first output terminal of the LC, and a multiplexer select terminal is connected to a second input terminal of the LC so as to select which of the signals appearing at the first and second multiplexer input terminal to pass through; wherein, by coupling in chain the first input terminal of one LC to the first output terminal of another LC, a WLUT chain is formed.
    Type: Application
    Filed: April 2, 2010
    Publication date: September 2, 2010
    Inventors: Fung Fung Lee, Wen Zhou
  • Integrated Circuit with Improved Logic Cells
    Publication number: 20100219860
    Abstract: The present invention provides integrated circuits with improved logic cells. In one embodiment, an integrated circuit having a plurality of logic cells (LC) is provided, each LC comprising: a lookup table having a LUT output terminal; and, a first multiplexer; wherein, a first multiplexer input terminal is connected to of a first input terminal of the LC, a second multiplexer input terminal is connected to the LUT output terminal, a multiplexer output terminal is connected to a first output terminal of the LC, and a multiplexer select terminal is connected to a second input terminal of the LC so as to select which of the signals appearing at the first and second multiplexer input terminal to pass through;wherein, by coupling in chain the first input terminal of one LC to the first output terminal of another LC, a WLUT chain is formed.
    Type: Application
    Filed: April 2, 2010
    Publication date: September 2, 2010
    Applicant: AGATE LOGIC (BEIJING), INC.
    Inventors: Fung Fung Lee, Wen Zhou
  • Protective device for protecting thermal interface material and fasteners of heat dissipation device
    Patent number: 7779895
    Abstract: A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: August 24, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Jun Cao, Qing-Song Xu
  • Heat dissipation device
    Patent number: 7755894
    Abstract: A heat dissipation device includes a first base plate having a flat top surface, a plurality of flattened heat pipes, a fin assembly located above the heat pipes and a thermally conductive layer formed between the heat pipes and the fin assembly. The thermally conductive layer has a flat surface contacting with the heat pipes. The heat pipes are supported on the top surface of the first base plate. The first base plate has a flat bottom surface for engaging with an electronic package. Each heat pipe comprises an evaporating section and a condensing section bent from the evaporating section, and the evaporating sections of the heat pipes abut side by side against each other.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: July 13, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ping-An Yang, Meng Fu, Shi-Wen Zhou, Chun-Chi Chen
  • PROGRAMMABLE INTERCONNECT NETWORK FOR LOGIC ARRAY
    Publication number: 20100171524
    Abstract: The present invention provides an integrated circuit, comprising an array of components and programmable interconnect network for the array of components, said programmable interconnect network comprising a plurality of switch boxes being connected in a tree-based hierarchical architecture and providing selection and connection for the components responsive to configuration bits, switch boxes located at the lowest level of hierarchy are connected to the components; switch boxes in at least one level of hierarchy have different number of children from those in other levels of hierarchy. The present invention provides a hierarchical architecture with a vast variety of cell numbers, which facilitates circuit implementation. The present invention also offers greater layout flexibility.
    Type: Application
    Filed: June 20, 2007
    Publication date: July 8, 2010
    Applicant: AGATE LOGIC, INC.
    Inventors: Fungfung Lee, Wen Zhou
  • ACTIVE HEAT SINK FOR USE WITH ELECTRONIC DEVICE
    Publication number: 20100163213
    Abstract: A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.
    Type: Application
    Filed: July 2, 2009
    Publication date: July 1, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHOU-BIAO XU, SHI-WEN ZHOU, CHUN-CHI CHEN
  • HEAT DISSIPATION APPARATUS HAVING HEAT PIPES INSERTED THEREIN
    Publication number: 20100155023
    Abstract: A heat dissipation apparatus includes a base, a heat sink on the base, two heat pipes thermally connecting the base and the heat sink and a fan mounted in the heat sink. The heat sink comprises a first fin group placed on the base and a second fin group located on the first fin group. Each heat pipe comprises an evaporation section connected to the base, a condensation section and an adiabatic section interconnecting the evaporation section and the condensation section. The condensation sections of the heat pipes are sandwiched between the first and second fin groups and surround the fan.
    Type: Application
    Filed: April 15, 2009
    Publication date: June 24, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Shi-Wen Zhou, Jun Cao, Qing-Song Xu, Chun-Chi Chen
  • HEAT DISSIPATION DEVICE WITH HEAT PIPE
    Publication number: 20100147502
    Abstract: A heat dissipation device includes a heat pipe. The heat pipe includes an evaporating section connecting with a heat spreader, a condensing section connecting with a fin assembly, and a connecting section interconnecting the evaporating section and the condensing section. The evaporating section of the heat pipe has a diameter smaller than that of the condensing section.
    Type: Application
    Filed: April 29, 2009
    Publication date: June 17, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHOU-BIAO XU, SHI-WEN ZHOU, CHUN-CHI CHEN
  • Integrated circuit with improved logic cells
    Patent number: 7719311
    Abstract: The present invention provides integrated circuits with improved logic cells. In one embodiment, an integrated circuit having a plurality of logic cells (LC) is provided, each LC comprising: a lookup table having a LUT output terminal; and, a first multiplexer; wherein, a first multiplexer input terminal is connected to of a first input terminal of the LC, a second multiplexer input terminal is connected to the LUT output terminal, a multiplexer output terminal is connected to a first output terminal of the LC, and a multiplexer select terminal is connected to a second input terminal of the LC so as to select which of the signals appearing at the first and second multiplexer input terminal to pass through; wherein, by coupling in chain the first input terminal of one LC to the first output terminal of another LC, a WLUT chain is formed.
    Type: Grant
    Filed: May 20, 2009
    Date of Patent: May 18, 2010
    Assignee: Agate Logic (Beijing), Inc.
    Inventors: Fung Fung Lee, Wen Zhou
  • HEAT DISSIPATION DEVICE
    Publication number: 20100101757
    Abstract: A heat dissipation device removing heat from an electronic device includes a base plate, a fin set in thermal connection with the base plate, a fixing member and two fans. The fixing member includes a driving part coupled to a top of the fin set, two mounting parts located at two opposite sides of a circumference of the fin set and two connecting arms extending outwardly from the driving part and connecting with the two mounting parts. The two fans, respectively mounted on the two mounting parts of the fixing member and located at two opposite sites of the circumference of the fin set, are driven to rotate around the circumference of the fin set by the driving part and generate two streams of airflow which flow through the fin set that are non-intersecting.
    Type: Application
    Filed: March 3, 2009
    Publication date: April 29, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHOU-BIAO XU, SHI-WEN ZHOU, CHUN-CHI CHEN
  • HEAT DISSIPATION DEVICE
    Publication number: 20100097763
    Abstract: A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.
    Type: Application
    Filed: May 7, 2009
    Publication date: April 22, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, JUN CAO, QING-SONG XU, CHUN-CHI CHEN
  • HEAT DISSIPATION DEVICE
    Publication number: 20100078154
    Abstract: A heat dissipation device includes a base, a fin group, a plurality of heat pipes connecting the base and the fin group, a fan cover covering the fin group and a fan located at a side of the fan cover. The heat pipes are received in the base and extend through the fin group. The heat pipes are received in two opposite sides of the fin group and sandwiched between the fan cover and the fin group. The fan cover includes a body and a pair of side walls extending from the body. The side walls each include a plurality of heat-dissipating fins formed on an outer surface thereof for increasing heat dissipating surface of the heat dissipating device.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 1, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: YI-JIUN LI, SHI-WEN ZHOU, CHUN-CHI CHEN
  • GOLF PLATFORM WITH ADJUSTABLE INCLINATION
    Publication number: 20100056289
    Abstract: The present invention provides a golf practicing device having a platform with adjustable tilt on two independent axial creating a variety of inclination thus allowing a player to simulate variety of lies of the golf course in a driving range. In its first embodiment, the device comprising of a hitting surface 20 covered with artificial turf 21, mounted on a base 10 with a double-cross joint 30. On the hitting surfaces 20 are switches 70a 70b 70c 70d wired to a pair of linear actuators 50 51 affixed to a cable 80 running through a conjugated pulley cable guide 40 41 42 43 so that pressing the switches 70a 70b 70c 70d will cause one side of the hitting surface 20 to lower and the opposite side to lift up, causing the golf platform to tilt toward the direction of activated switch.
    Type: Application
    Filed: August 26, 2008
    Publication date: March 4, 2010
    Inventors: DESMOND YI ZHOU, Wen Zhou
  • Heat dissipation device having a fan mounted thereon
    Patent number: 7646604
    Abstract: A heat dissipation device for at least a heat-generating electronic component includes a heat sink, a fan for providing an airflow through the heat sink and a fan holder coupling the fan to the heat sink. The heat sink has a first locking part and a second locking part opposite to the first locking part. The fan holder has a first engaging part engaging with the first locking part at one side of the heat sink and a second engaging part engaging with the second locking part of the heat sink at an opposite side thereof. The first engaging part has a horizontally extending fixing arm and a barb extending downwardly from the fixing arm and hooking with a top side of the heat sink.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: January 12, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jun Cao, Peng Liu, Shi-Wen Zhou
  • HEAT DISSIPATION DEVICE
    Publication number: 20090310304
    Abstract: A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink.
    Type: Application
    Filed: June 13, 2008
    Publication date: December 17, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, JUN CAO, WEI-PING GONG
  • Apparatus for supporting cooling device
    Patent number: 7631850
    Abstract: An apparatus (1) for supporting a cooling device (30) thereon includes a bracket (10) and a saddle (20) carrying the cooling device (30) thereon. The bracket (10) defines two opposing rails (12), (13) and a washboard-like member (14) extending along a direction in which the rails (12), (13) extend. The saddle (20) includes a positioning member (26) engaged in the washboard-like member (14) to position the saddle (20) to the bracket (10) and two blocks (24) slidable on the rails (12), (13) of the bracket (10) under condition that the positioning member (26) is disengaged from the washboard-like member (14).
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: December 15, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Ping-An Yang, Meng Fu
  • Heat dissipation device assembly with a fan duct having guiding members for guiding a screwdriver to assemble the heat dissipation device assembly to a printed circuit board
    Patent number: 7633755
    Abstract: A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink (10) contacting one of the electronic components, a pair of fans (20) attached on a lateral side of the heat sink, and a fan duct (30) fixed on the fans. A plurality of guiding members (322, 346) are formed inwardly from the fan duct to be located in an interior of the fan duct. The guiding members are used for guiding a screwdriver (40) to accurately fit with screws (50) preassembled to the heat sink. Thus, the screws can be quickly and easily fastened by the screwdriver to mount the heat dissipation device assembly on the printed circuit board.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: December 15, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Jun Cao, Jie-Cheng Deng
  • HEAT DISSIPATION DEVICE
    Publication number: 20090301694
    Abstract: A heat dissipation device dissipating heat from a heat-generating electronic element, includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing, an impeller comprising a driving member received in the housing and an axle which extends through a centre of the driving member. The axle has a lower end extending downwardly through a bottom of the housing to a centre of the top of the canister and an upper end extending upwardly through a top of the housing to engage the fan. The working fluid is heated by the heat-generating electronic element and vaporized into the housing to engage the driving member to rotate and drive the fan to rotate synchronously.
    Type: Application
    Filed: August 28, 2008
    Publication date: December 10, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, CHUN-CHI CHEN