Patents by Inventor Wen Zhou

Wen Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated Circuit With Crosslinked Interconnect Networks
    Publication number: 20090289661
    Abstract: The present invention provides in a first aspect a programmable interconnect network for an array of logic blocks, which comprises a plurality of switch boxes being connected in a tree-based hierarchical architecture and providing selection and connection for the logic blocks, switch boxes located at the lowest level of the tree structure are connected to the logic blocks; wherein said network comprises a crosslink established between two of said plurality of switch boxes. The present invention helps implement functions with more area and timing efficiency and/or placement-friendliness.
    Type: Application
    Filed: May 8, 2009
    Publication date: November 26, 2009
    Applicant: AGATE LOGIC (BEIJING), INC.
    Inventors: Fung Fung Lee, Wen Zhou
  • HEAT SINK AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20090284927
    Abstract: A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.
    Type: Application
    Filed: October 16, 2008
    Publication date: November 19, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: YI-JIUN LI, PENG LIU, SHI-WEN ZHOU, CHUN-CHI CHEN
  • Heat dissipation device with heat pipes
    Patent number: 7610950
    Abstract: A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: November 3, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jun Cao, Zhan Wu, Shi-Wen Zhou
  • HEAT DISSIPATION DEVICE
    Publication number: 20090266521
    Abstract: A heat dissipation device includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing and an impeller comprising a driving member received in the housing, an annular magnet accommodated in the hub and an axle coaxially connecting the driving member and the annular magnet together. The fan includes a plurality of windings fixed on an inner side thereof. When the working fluid is heated and vaporized to move through the driving member, the driving member is driven by the vaporized working fluid to rotate, whereby the annular magnet rotates within the windings to cause the windings to generate a current.
    Type: Application
    Filed: September 29, 2008
    Publication date: October 29, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, CHUN-CHI CHEN
  • Heat sink assembly
    Patent number: 7609522
    Abstract: A heat sink assembly (10) compatible with an ATX motherboard (20) and a BTX motherboard (30), includes a heat sink and a plurality of fasteners (15) extending through the heat sink. The heat sink includes a base (12) defining a slot (1220) therein. The fastener is capable of sliding along the slot between a first position to a second position to make the heat sink assembly in accordance with the preferred embodiment of the present invention to be adapted for use with the ATX motherboard or the BTX motherboard.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: October 27, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Zhao Jin, Jun Cao, Shi-wen Zhou, Chun-Chi Chen
  • HEAT DISSIPATION DEVICE HAVING AN IMPROVED FIN STRUCTURE
    Publication number: 20090260779
    Abstract: A heat dissipation device for dissipating heat from an electronic element, includes a base plate for absorbing heat from the heat-generating component, a fin unit located above the base plate and having a plurality of fins stacked together, and at least a heat pipe having an evaporating section thermally engaging with the base plate and a pair of condensing sections extending through the fins. Each of the fins has a plurality of parallel and protruding flanges on a top face thereof. The protruding flanges of the fins are of equal height and parallel to short sides of the fins. Each protruding flange has a length equal to that of the short sides of the fins. A distance between two neighboring ones of the protruding flanges located between the condensing sections is the same. The protruding flanges are provided for increasing a heat dissipation area of the fin.
    Type: Application
    Filed: April 21, 2008
    Publication date: October 22, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, CHUN-CHI CHEN
  • PROGRAMMABLE INTERCONNECT NETWORK FOR LOGIC ARRAY
    Publication number: 20090261858
    Abstract: A programmable interconnect network for an array of logic cells. Said interconnect network has a plurality of switch boxes being connected in a tree structure and providing connections to its logic cells, switch boxes located at the lowest level of the tree structure are connected to logic cells; said interconnect network also has peripheral switch boxes, of which at least one is connected to an external logic. Also, an integrated circuit comprising an FP array of logic cells connected by the said programmable interconnect network and a mask programmable (MP) logic array.
    Type: Application
    Filed: August 31, 2006
    Publication date: October 22, 2009
    Applicant: BEIJING XIZHENG MICROELECTRONICS CO., LTD.
    Inventors: John Jun Yu, Fungfung Lee, Wen Zhou
  • Heat dissipation device
    Patent number: 7606030
    Abstract: A heat dissipation device includes a spreader, a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate, a heat pipe thermally connecting the heat sink and the spreader together, a plurality of fasteners each including a fixture having a head at a top thereof, a spring encircling the fixture and a gasket wired on the fixtures. The fixtures extend through the base plate of the heat sink and the spreader, the gaskets are respectively compressed between the heads and the base plate, edge of the base plate of the heat sink is joined with the housing of the computer, and cooperates with the housing to form a hermetic encapsulation which encloses the heat-generating electronic component.
    Type: Grant
    Filed: December 12, 2007
    Date of Patent: October 20, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Chun-Chi Chen, Guo Chen
  • PROTECTIVE DEVICE FOR PROTECTING THERMAL INTERFACE MATERIAL AND FASTENERS OF HEAT DISSIPATION DEVICE
    Publication number: 20090255648
    Abstract: A heat dissipation device assembly includes a heat dissipation device for dissipating heat from an electronic element and a protective device assembly. The heat dissipation device includes a base with fasteners extending therethrough, a plurality of fins arranged on a top of the base, and a heat conducting plate attached on a bottom of the base. A thermal interface material is spread on a bottom surface of the heat conducting plate. The protective device assembly includes a first cover attached to a bottom of the heat conducting plate and a second cover separated from the first cover and attached to a lateral side of the base. The first cover protects the thermal interface material from being contaminated and the second cover protects the fasteners from dropping from the base, when the heat dissipation device is transported.
    Type: Application
    Filed: April 14, 2008
    Publication date: October 15, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, JUN CAO, QING-SONG XU
  • HEAT SINK ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20090242168
    Abstract: A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 1, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: JUN CAO, SHI-WEN ZHOU, CHUN-CHI CHEN
  • HEAT DISSIPATION DEVICE WITH HEAT PIPE
    Publication number: 20090242176
    Abstract: A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 1, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: PENG LIU, SHI-WEN ZHOU, CHUN-CHI CHEN, YI-JIUN LI
  • Heat dissipation device
    Patent number: 7589967
    Abstract: A heat dissipation device includes a heat sink (10) for contacting a heat-generating component and a fan (20) mounted to the heat sink. The fan includes a frame (22) and a motor (24) received in the frame. The fan has an intake. The frame has a top level and a bottom level. An airflow is generated by the fan and flows through the heat sink. An anti-backflow plate (30) is mounted between the top level and the bottom level of the fan. The anti-backflow plate extends outwardly and beyond an extremity of the heat sink to prevent the airflow flowing through the heat sink from entering the intake of the fan.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: September 15, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Guo Chen, Peng Liu, Chun-Chi Chen
  • HEAT DISSIPATION DEVICE HAVING A BRACKET
    Publication number: 20090211730
    Abstract: A heat dissipation device includes a first heat sink, a second heat sink far away from the first heat sink, a heat pipe transferring heat from the first heat sink to the second heat sink and a bracket for reinforcing the heat dissipation device. The bracket includes a first end attached to the first heat sink and a second end attached to the second heat sink. The second end defines a through hole receiving the heat pipe therethrough. The second end has a supporting portion and a clasping portion from an edge of the through hole. The supporting portion and the clasping portion are spaced from each other and firmly clasp the heat pipe. The clasping portion is bent to abut against the heat pipe and urge the heat pipe toward the supporting portion.
    Type: Application
    Filed: June 23, 2008
    Publication date: August 27, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, SHOU-BIAO XU, CHUN-CHI CHEN
  • HEAT DISSIPATION DEVICE
    Publication number: 20090154102
    Abstract: A heat dissipation device includes a spreader, a heat sink comprising a base plate and a plurality of outer fins extending upwardly from a top surface of the base plate, a heat pipe thermally connecting the heat sink and the spreader together, a plurality of fasteners each including a fixture having a head at a top thereof, a spring encircling the fixture and a gasket wired on the fixtures. The fixtures extend through the base plate of the heat sink and the spreader, the gaskets are respectively compressed between the heads and the base plate, edge of the base plate of the heat sink is joined with the housing of the computer, and cooperates with the housing to form a hermetic encapsulation which encloses the heat-generating electronic component.
    Type: Application
    Filed: December 12, 2007
    Publication date: June 18, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, CHUN-CHI CHEN, GUO CHEN
  • HEAT DISSIPATION DEVICE ASSEMBLY WITH A FAN DUCT HAVING GUIDING MEMBERS FOR GUIDING A SCREWDRIVER TO ASSEMBLE THE HEAT DISSIPATION DEVICE ASSEMBLY TO A PRINTED CIRCUIT BOARD
    Publication number: 20090129018
    Abstract: A heat dissipation device assembly for dissipating heat from a plurality of electronic components mounted on a printed circuit board, includes a heat sink (10) contacting one of the electronic components, a pair of fans (20) attached on a lateral side of the heat sink, and a fan duct (30) fixed on the fans. A plurality of guiding members (322, 346) are formed inwardly from the fan duct to be located in an interior of the fan duct. The guiding members are used for guiding a screwdriver (40) to accurately fit with screws (50) preassembled to the heat sink. Thus, the screws can be quickly and easily fastened by the screwdriver to mount the heat dissipation device assembly on the printed circuit board.
    Type: Application
    Filed: November 15, 2007
    Publication date: May 21, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, JUN CAO, JIE-CHENG DENG
  • METHOD AND APPARATUS FOR IMPLEMENTING THE CNAP SERVICE
    Publication number: 20090129578
    Abstract: The present invention discloses a method for realizing the CNAP service, including: receiving a service request sent by the switching system, where the service request carries the identifier of the calling party and the identifier of the called party; querying the calling information set by the calling party according to the identifier of the calling party, and querying the location information of the called party according to the identifier of the called party; after determining that the called MS already rings, sending a flash message that contains the calling information to the called MS according to the location information of the called party. The present invention also provides a calling information service apparatus accordingly. The invention correlates the judging of the status of the call connection process with the time of implementing the CNAP service.
    Type: Application
    Filed: November 14, 2008
    Publication date: May 21, 2009
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Wen ZHOU
  • Heat sink assembly
    Patent number: 7518874
    Abstract: A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink.
    Type: Grant
    Filed: August 10, 2007
    Date of Patent: April 14, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jie-Cheng Deng, Jun Cao, Shi-Wen Zhou
  • Heat dissipation device having mounting brackets
    Patent number: 7493940
    Abstract: A heat dissipation device (100) includes a heat sink (10) having a plurality of fins (14) and a plurality of mounting brackets (20) buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate (22) mounted on a top of the heat sink and a baffle plate (26) extending from one side of the mounting plate to a bottom of the heat sink. The baffle plate terminates with a retaining plate (28). A plurality of fasteners (50) extends through the retaining plates to mount the heat dissipation device onto a printed circuit board. Self-tapping screws (40) are used to extend through the fan and the mounting plates of the mounting brackets and threadedly engage with the fins thereby mounting the fan on the heat sink.
    Type: Grant
    Filed: October 10, 2006
    Date of Patent: February 24, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Guo Chen, Li He, Peng Liu
  • Heat dissipating assembly having a fan duct
    Patent number: 7495913
    Abstract: A heat dissipating assembly for dissipating heat from a CPU and a VRM simultaneously includes a base (10) contacting the CPU, a heat sink (20) mounted on the base, a pair of fans (30) attached on a front side of the heat sink, and a fan duct (40) secured to the fans. The fan duct has a first inlet (440) through which a part of airflow flows into the fan duct, a second inlet (460) through which another part of the airflow flowing into the fan duct. The another part of the airflow also flows through the VRM so it can cool the VRM. The fan duct further has an outlet (480) for allowing the airflow generated by the fans to blow to the heat sink.
    Type: Grant
    Filed: August 9, 2007
    Date of Patent: February 24, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Peng Liu, Jun Cao, Shi-Wen Zhou
  • APPARATUS AND METHOD FOR POLICY ROUTING
    Publication number: 20090046718
    Abstract: An apparatus and method for policy routing is provided. The method includes: A. configuring a policy routing to a label switching path and obtaining and saving forwarding information; and B. performing packet forwarding based on the forwarding information.
    Type: Application
    Filed: October 23, 2008
    Publication date: February 19, 2009
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Yongle SUN, Xia CHEN, Wen ZHOU