Patents by Inventor Wen Zhou

Wen Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HEAT DISSIPATION DEVICE
    Publication number: 20080130228
    Abstract: A heat dissipation device includes a heat sink (10) for contacting a heat-generating component and a fan (20) mounted to the heat sink. The fan includes a frame (22) and a motor (24) received in the frame. The fan has an intake. The frame has a top level and a bottom level. An airflow is generated by the fan and flows through the heat sink. An anti-backflow plate (30) is mounted between the top level and the bottom level of the fan. The anti-backflow plate extends outwardly and beyond an extremity of the heat sink to prevent the airflow flowing through the heat sink from entering the intake of the fan.
    Type: Application
    Filed: December 1, 2006
    Publication date: June 5, 2008
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Guo Chen, Peng Liu, Chun-Chi Chen
  • Heat dissipation device
    Patent number: 7382047
    Abstract: A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: June 3, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
  • HEAT DISSIPATION DEVICE
    Publication number: 20080121372
    Abstract: A heat dissipation device includes a heat sink including a base for contacting with an electronic device, a fin set having a plurality of fins, and a heat pipe having a first section thermally attached to the base and a second section extending through the fin set. Each of the fins has an airflow guiding structure in a passage formed between two neighboring fins. A fan is attached to a front of the heat sink. An airflow provided by the fan flows into the passage and is then directed by the airflow guiding structure to joints of the second section of the heat pipe with the fins where more heat from the electronic device is accumulated. The guiding structure includes two guiding sidewalls extending in a diverging manner from the fan toward a rear of the heat sink.
    Type: Application
    Filed: January 24, 2007
    Publication date: May 29, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, CHUN-CHI CHEN, BAO-CHUN CHEN
  • HEAT DISSIPATION DEVICE WITH A HEAT PIPE
    Publication number: 20080121370
    Abstract: A heat dissipation device includes a heat spreader (20), a heat sink (10) attached to the heat spreader (20), a sleeve (40) and a heat pipe (30). The heat spreader (20) is for contacting a heat-generating electronic device. The heat sink (10) includes a base (12) and a plurality of fins (14, 15) extending from the base (12). The sleeve (40) is inserted into a through hole (16) defined in the fins (14, 15). The heat pipe (30) includes an evaporating portion (31) sandwiched between the heat spreader (20) and the base (12), and a condensing portion (33) received in the sleeve (40).
    Type: Application
    Filed: November 28, 2006
    Publication date: May 29, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Wen-Li Luo, Shi-Wen Zhou, Chun-Chi Chen
  • HEAT DISSIPATION DEVICE WITH HEAT PIPES
    Publication number: 20080105411
    Abstract: A heat dissipation device includes a first base plate (10), a fin group (30) arranged on the first base plate, a first heat pipe (50) attached on the first base plate and the fin group and a second heat pipe (60) attached on the first base plate and extending across the fin group. Each of the first and second heat pipes includes an absorbing section and a dissipating section. The absorbing sections of the first and second heat pipes are L-shaped and oriented in opposite directions and dissipating sections of the first and second heat pipes are oriented perpendicular to each other, whereby heat from the first base plate attached with an electronic component can take more different dissipating-paths from the first base plate to the fin group.
    Type: Application
    Filed: November 8, 2006
    Publication date: May 8, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Jun Cao, Zhan Wu, Shi-Wen Zhou
  • HEAT DISSIPATION DEVICE WITH HEAT PIPES
    Publication number: 20080105409
    Abstract: A heat dissipation device includes a base for absorbing heat from a heat generating device and a first fin set disposed on the base. Two second fin sets are located on two sides of the first fin set and extend beyond the base. At least a heat pipe includes a first section thermally sandwiched between the base and the first fin set and extending totally within and thermally contacting with the two second fin sets, and a second section extending away from the base and thermally contacting the first fin set and the second fin set.
    Type: Application
    Filed: November 3, 2006
    Publication date: May 8, 2008
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: WEN-LI LUO, SHI-WEN ZHOU, CHUN-CHI CHEN
  • Heat dissipating device
    Patent number: 7365978
    Abstract: A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.
    Type: Grant
    Filed: May 23, 2005
    Date of Patent: April 29, 2008
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxcomm Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Meng Fu, Chi Liang
  • HEAT DISSIPATION DEVICE WITH HEAT PIPES
    Publication number: 20080093052
    Abstract: A heat dissipation device is used for removing heat from an electronic device. The heat dissipation device includes a base adapted for thermally engaging with the electronic device, the base having a top face and defining two juxtaposed, sinuous grooves in the same side as the top face, two flat heat pipes fittingly received in the grooves of the base, and a plurality of fins arranged on the top surface of the base and the flat heat pipes, wherein each of the grooves encloses a first U-shaped region and a second U-shaped region which is smaller than the first U-shaped region. The first and second U-shaped regions have opposite orientations, and the second U-shaped region of one of the grooves is located in the first U-shaped region of another one of the grooves.
    Type: Application
    Filed: October 20, 2006
    Publication date: April 24, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: PING-AN YANG, SHI-WEN ZHOU, CHUN-CHI CHEN
  • HEAT DISSIPATION DEVICE HAVING MOUNTING BRACKETS
    Publication number: 20080083528
    Abstract: A heat dissipation device (100) includes a heat sink (10) having a plurality of fins (14) and a plurality of mounting brackets (20) buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate (22) mounted on a top of the heat sink and a baffle plate (26) extending from one side of the mounting plate to a bottom of the heat sink. The baffle plate terminates with a retaining plate (28). A plurality of fasteners (50) extends through the retaining plates to mount the heat dissipation device onto a printed circuit board. Self-tapping screws (40) are used to extend through the fan and the mounting plates of the mounting brackets and threadedly engage with the fins thereby mounting the fan on the heat sink.
    Type: Application
    Filed: October 10, 2006
    Publication date: April 10, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUN-CHI CHEN, SHI-WEN ZHOU, GUO CHEN, LI HE, PENG LIU
  • CLIP FOR HEAT SINK
    Publication number: 20080084670
    Abstract: A clip includes a body with opposite first and second legs, a movable fastener, an actuating member and a sliding axle. The movable fastener has a retaining hole defined therein for engaging with a retention module and an elongated slot above the retaining hole. The actuating member includes a curving slot and is pivotally coupled to the movable fastener via a pivot. The sliding axle extends through the second leg of the body and the elongated slot of the movable fastener to couple them together, and the sliding axle has one portion inserted into the curving slot of the actuating member. When the actuating member is rotated about the pivot, the movable fastener is driven to move relative to the sliding axle between a relaxed position and a locked position.
    Type: Application
    Filed: October 10, 2006
    Publication date: April 10, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Meng Fu, Shi-Wen Zhou, Chun-Chi Chen
  • Heat dissipation device
    Patent number: 7345879
    Abstract: A heat dissipation device includes a primary heat sink (10) contacting a central processing unit and a secondary heat sink (20) attached on heat-generating electronic components adjacent the central processing unit. The primary heat sink includes a base (12) and a heat-dissipation portion (14) disposed on a middle of the base. The secondary heat sink includes a substrate (22) and a plurality of fin assemblies (24) arranged on the substrate. The base is laid on the substrate with the fin assemblies arranged around the heat-dissipation portion. The primary heat sink is partly superposed on the secondary heat sink with a compact structure. The heat-dissipation portion can simultaneously dissipate heat from the central processing unit and its adjacent heat-generating electronic components.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: March 18, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Meng Fu, Dong-Bo Zheng
  • Heat sink assembly
    Patent number: 7342795
    Abstract: A heat sink assembly includes a heat spreader (10), a plurality of fins (12) extending from the spreader, fasteners (20) and securement sleeves (30) fixed to the fasteners. The fastener includes a head (200) and a shaft (204) having a threaded bottom end (208). The sleeve comprises a cylindrical wall (302), an upper open end (304) and a lower open end (306). The sleeve further has an annular pedestal (308) perpendicularly connected with the wall and extending in the lower open end. The head is received in the wall and contacts the pedestal. The shaft extends through the spreader. A compressed spring (22) is providing between the head and the spreader for urging the spreader downwardly to engage with a heat generating electronic device.
    Type: Grant
    Filed: October 5, 2005
    Date of Patent: March 11, 2008
    Assignees: Fu zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
  • HEAT DISSIPATION DEVICE
    Publication number: 20080055854
    Abstract: A heat dissipation device includes a heat-absorbing member having two arched concave walls formed at opposite sides thereof, and a plurality of fins extending outwardly and slantwise from each of the two arched concave walls of the heat-absorbing member toward a middle between a front and a rear of the heat dissipation device.
    Type: Application
    Filed: September 1, 2006
    Publication date: March 6, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Shi-Wen Zhou, Peng Liu, Guo Chen
  • FASTENER ASSEMBLY FOR ATTACHING A HEAT DISSIPATING DEVICE TO AN ELECTRONIC DEVICE
    Publication number: 20080050196
    Abstract: A fastener assembly for securing a heat dissipation device to a CPU mounted on a printed circuit board, includes a sleeve, a bolt, and a coil spring. The sleeve includes a hollow body, a top head and a pair of lower resilient flat extensions. The resilient flat extension has a barb projecting outwards therefrom and is deformable radially. The bolt includes a shaft, a joining part at an end thereof and a threaded part formed at an opposite end thereof. The shaft is received in the hollow body of the sleeve with the joining part fastened to the hollow body, whilst the threaded part projects out of the hollow body. The coil spring surrounds the sleeve and is held between the head of the sleeve and the barbs of the sleeve; the coil spring is deformable axially along a length of the sleeve.
    Type: Application
    Filed: December 27, 2006
    Publication date: February 28, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: JUN CAO, ZHAN WU, SHI-WEN ZHOU, CHUN-CHI CHEN
  • Heat dissipation device with heat pipe
    Patent number: 7331379
    Abstract: A heat dissipation device includes a fin set, a sinuous heat pipe transferring heat to different parts of the fin set, and a base thermally contacting the heat pipe. The heat pipe has a middle U-shaped portion and two L-shaped portions at two sides of the U-shaped portion, respectively. The base is for contacting with a heat generating electronic device and transferring heat from the electronic device to the heat pipe and the fin set. The fin set defines a passageway in a middle of thereof. The U-shaped portion of the heat pipe is received in the passageway of the fin set and thermally engages with the fin set.
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: February 19, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu
  • CLIP FOR HEAT DISSIPATION DEVICE
    Publication number: 20080024986
    Abstract: A clip includes a body, an actuating member, a first hook plate and a second hook plate. The body includes a supporting portion and a pair of spaced arms extending from opposite sides of the supporting portion. The actuating member includes a cam supported on the supporting portion. The first hook plate is detachably coupled to a distal end of the arms of the body. The second hook plate extends through the supporting portion and is pivotally coupled to the cam of the actuating member. The actuating member is turnable relative to the second hook plate between a locked position and an unlocked position.
    Type: Application
    Filed: July 28, 2006
    Publication date: January 31, 2008
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shi-Wen Zhou, Guo Chen, Zhan Wu
  • HEAT DISSIPATION DEVICE WITH HEAT PIPES
    Publication number: 20080017351
    Abstract: A heat dissipation device is for contacting with a heat generating electronic device to remove heat from the electronic device. The heat dissipation device includes a base for thermally engaging with the electronic device and a plurality of fins arranged on a face of the base. A first heat pipe is located between the base and the fins, and is sinuously positioned on the face of the base. The first heat pipe has a first section located at a central portion of the base and a plurality of second sections located at lateral portions of the base. At least a second heat pipe has a first section thermally positioned to the base, and a second section extending remotely from the base and thermally engaging with the fins.
    Type: Application
    Filed: July 24, 2006
    Publication date: January 24, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Shi-Wen Zhou, Peng Liu, Chun-Chi Chen
  • CLIP FOR HEAT SINK
    Publication number: 20080010788
    Abstract: A clip includes a body having a first end and a second end. A connecting member extends through the first end of the body. A hook plate is attached to a bottom of the connecting member and an actuating member is pivotally coupled to an upper end of the connecting member. The actuating member is pivotable relative to the hook plate in a first direction so that the actuating member is turnable relative to the hook plate between a locked position and an unlocked position. Furthermore, the actuating member is turnable about an axis of the connecting member in a second direction different from the first direction.
    Type: Application
    Filed: July 13, 2006
    Publication date: January 17, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUN-CHI CHEN, Shi-Wen Zhou, Zhan Wu
  • HEAT DISSIPATION DEVICE
    Publication number: 20080000619
    Abstract: A heat dissipation device includes a fin assembly including a plurality of fins and a heat conductive member. Each individual fin includes a main body with one through hole and a sleeve installed in the through hole of the main body. The sleeve has a hole defined therethrough. The heat conductive member has higher heat conductivity than the main bodies of the fins, and is installed into the through hole of the each individual fin via extension through the hole of the sleeve. The main body and the sleeve of the each individual fin are made of different materials so that the sleeve serves as a transition component for facilitating soldering the each individual fin on the heat conductive member and heat conduction from the heat conductive member to the main body of the each individual fin.
    Type: Application
    Filed: January 15, 2007
    Publication date: January 3, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHI-WEN ZHOU, CHUN-CHI CHEN, MENG FU
  • Heat dissipation device with a heat pipe
    Patent number: 7312994
    Abstract: A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: December 25, 2007
    Assignees: Fu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Chun-Chi Chen, Shi-Wen Zhou, Zhan Wu, Bing-Wen Zhou, Hong-Wei Du