Abstract: An apparatus is disclosed for a surface-acoustic-wave filter that suppresses intermodulation distortion. In an example aspect, the apparatus includes a surface-acoustic-wave filter including an electrode structure and at least one layer of quartz material with a thickness having a range approximately from 100 to 300 micrometers. The apparatus also includes at least one layer of lithium niobate (LiNbO3) material disposed between the electrode structure and the quartz material. A thickness of the lithium niobate material has a range approximately from 0.2 to 0.4 micrometers.

Abstract: An apparatus is disclosed for suspending an electrode structure using a dielectric. In an example aspect, the apparatus includes a surface-acoustic-wave filter with a piezoelectric layer and an electrode structure. The electrode structure has a first surface facing the piezoelectric layer and separated from the piezoelectric layer by a distance. The surface-acoustic-wave filter also includes a dielectric disposed on at least one other surface of the electrode structure and configured to extend past a plane defined by the first surface of the electrode structure and toward the piezoelectric layer to define a cavity between at least a portion of the first surface of the electrode structure and the piezoelectric layer.

Abstract: The present invention relates to a filter circuit (100) comprising a first and a second bulk acoustic wave resonator (2, 3), the first resonator (2) having a first piezoelectric layer (4) structured such that the first resonator (2) has a lower resonant frequency than the second resonator (3), wherein the first piezoelectric layer (4) is structured by recesses (14) passing through the first piezoelectric layer (4), the first resonator (2) and the second resonator (3) as series resonators (102, 105) connected in series with a signal path of the filter circuit (100) or wherein the first resonator (2) and the second resonator (3) as parallel resonators (103, 106) are connected to the signal path of the filter circuit (100) in such a way that in each case one electrode of the resonators is connected to the signal path.

Abstract: A micro-acoustic wave device is proposed for application in ultrahigh frequency range. The device uses a thin film piezoelectric material stacked on a carrier substrate. Additionally, a material is embedded between carrier substrate and piezoelectric thin film that decouples the acoustic of these layers. With this approach it is possible to achieve very high Q factor even for longitudinal waves, which are required for high frequency applications.

Abstract: The invention relates to an RF filter with reduced insertion loss. The filter (F) includes a first bandpass filter (BPF1) having a passband, a circuit unit (SE) having an undesired excitation at a critical frequency (fs) and a reflector (R) that reflects RF signals of this frequency before the circuit unit is undesirably excited and the power is lost as a result.

Abstract: For a component operating with acoustic waves, it is proposed to provide a compensation layer on the component for compensating for a negative temperature coefficient of the frequency, which includes a material based on a chemical compound made up of at least two elements, which has a negative thermal expansion coefficient.

Abstract: The present invention relates to a filter chip (1), comprising an interconnection of at least one first and one second resonator (2, 3) operating with bulk acoustic waves, wherein the first resonator (2) operating with bulk acoustic waves comprises a first piezoelectric layer (4) that is structured in such a way that the first resonator (2) has a lower resonant frequency than the second resonator (3).

Abstract: The present invention relates to a filter circuit (100) comprising a first and a second bulk acoustic wave resonator (2, 3), the first resonator (2) having a first piezoelectric layer (4) structured such that the first resonator (2) has a lower resonant frequency than the second resonator (3), wherein the first piezoelectric layer (4) is structured by recesses (14) passing through the first piezoelectric layer (4), the first resonator (2) and the second resonator (3) as series resonators (102, 105) connected in series with a signal path of the filter circuit (100) or wherein the first resonator (2) and the second resonator (3) as parallel resonators (103, 106) are connected to the signal path of the filter circuit (100) in such a way that in each case one electrode of the resonators is connected to the signal path.

Abstract: An improved electroacoustic transducer with an improved mode profile is provided. The transducer comprises a velocity profile with a periodic structure and an edge structure flanking the periodic structure. The velocity profile also allows to suppress the SH wave mode.

Abstract: A transducer with reduced second-order nonlinearities is disclosed. In order to reduce the nonlinearities, the transducer comprises an isolation region between the electrode fingers and the corresponding opposite busbar and a dielectric material for reducing the electric field strength in the isolation region.

Abstract: An electroacoustic component includes a substrate configured to carry acoustic waves. The electroacoustic component can be a guided bulk acoustic wave (GBAW) device, for example. A structured electric conductive layer is arranged on the substrate and an electrically dielectric layer (for example, aluminum oxide) is also arranged over the substrate.

Abstract: A metallization, for carrying current in an electrical component, includes a bottom layer overlying a substrate surface and includes titanium (Ti) or a titanium compound as main constituent. An upper layer overlies the bottom layer and includes copper (Cu) as main constituent. The bottom layer and the upper layer form a base layer. A top layer is in direct contact with the upper layer and includes aluminum (Al) as main constituent. The base layer further includes a middle layer, consisting of silver, that is arranged between the bottom layer and the upper layer.

Abstract: The present invention relates to a one-port resonator (1) operating with surface acoustic waves, comprising an interdigital transducer (2) having a first busbar (6), a second busbar (7) and electrode fingers (8), wherein in an excitation region (10) of the interdigital transducer (2) the electrode fingers (8) are alternately connected to the first busbar (6) and the second busbar (7) in the longitudinal direction (L), wherein the interdigital transducer (2) comprises a first reversed region (11), in which the electrode fingers (8) are alternately connected to the first busbar (6) and the second busbar (7) in the longitudinal direction (L) and which is directly adjacent to the excitation region (10), and wherein that electrode finger (118) of the first reversed region (11) which is directly adjacent to the excitation region (10) in the longitudinal direction (L) and that electrode finger (118) of the excitation region (10) which is directly adjacent thereto are connected to the same busbar (6, 7).

Abstract: The present invention relates to a filter chip (1), comprising an interconnection of at least one first and one second resonator (2, 3) operating with bulk acoustic waves, wherein the first resonator (2) operating with bulk acoustic waves comprises a first piezoelectric layer (4) that is structured in such a way that the first resonator (2) has a lower resonant frequency than the second resonator (3).

Abstract: For a component operating with acoustic waves, it is proposed to provide a compensation layer on the component for compensating for a negative temperature coefficient of the frequency, which includes a material based on a chemical compound made up of at least two elements, which has a negative thermal expansion coefficient.

Abstract: An electroacoustic transducer has reduced loss due to acoustic waves emitted in the transverse direction. For this purpose, a transducer comprises a central excitation area, inner edge areas flanking the central excitation area, outer edge areas flanking the inner edge areas, and areas of the busbar flanking the outer edge areas. The longitudinal speed of the areas can be set so that the excitation profile of a piston mode is obtained.

Abstract: An electroacoustic filter has improved low-pass characteristics. The filter includes a first electroacoustic converter, an electroacoustic element and a grid structure between the converter and the element. The grid structure is acoustically active in one frequency range that lies above the acoustically active frequency range of the first electroacoustic converter.

Abstract: An electroacoustic transducer has a piezoelectric layer, which is structured in such a way that, in the case of an alternating electric field applied in one spatial direction, an oscillation mode with oscillations in three spatial directions is excited.

Abstract: The invention concerns a component (B) operating with acoustic waves, in which the reflection and excitation are largely decoupled. For this purpose, a component comprises a dielectric (DL) which is arranged between an electrode finger (EF) and a piezoelectric substrate (PSU) and at least partially overlaps the electrode finger.

Abstract: The present invention relates to an electroacoustic transducer which is arranged in an acoustic track (AS) and on a piezoelectric substrate (11) and which has two electrodes (1, 2) which are arranged on the substrate (11) and which have interengaging electrode fingers (3, 4) for exciting acoustic waves. The electrode fingers (3, 4) of an electrode (1, 2) are interconnected. The transducer also has means for increasing the mass occupation in a central excitation region (ZAB) which runs parallel to the acoustic track (AS), and the mass occupation in the central excitation region (ZAB) is higher than in an edge region (RB) which adjoins the central excitation region (ZAB) from both sides.