Abstract: The microacoustic component has a substrate that has at least one layer (composed of a dielectric or piezoelectric material, and a metallic strip structure. The layer is composed of a dielectric or piezoelectric material and/or the metallic strip structure have/has been produced or can be produced by the atomic layer deposition method.

Abstract: A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.

Abstract: A component has a substrate and a compensation layer. A lower face of the substrate is mechanically firmly connected to the compensation layer. The lower face of the substrate and the upper face of the compensation layer have a topography.

Abstract: A component that operates with acoustic waves includes a substrate including a piezoelectric material, a first electrode plane in which bottom electrode structures including an acoustically active bottom electrode are arranged directly on the substrate, and a top electrode arranged above the bottom electrode plane and which is electrically conductively connected to the bottom electrode structures, wherein excitation of the acoustic waves during operation of the component is effected exclusively or predominantly through the bottom electrode structures.

Abstract: Guided bulk acoustic wave devices and method for manufacturing guided bulk acoustic wave devices are provided. A guided bulk acoustic wave device includes a resonator structure with a piezoelectric layer, an electrode layer for exciting guided bulk acoustic waves and a wave guide layer. The thickness of the piezoelectric layer is less than or equal to 50 ?m.

Abstract: An electroacoustic component that includes a substrate made of monocrystalline LiNbO3 is disclosed. In the component, a first Euler angle ? of the monocrystalline LiNbO3 is: ??0°, a second Euler angle ? of the monocrystalline LiNbO3 is: ?74°????52° or 23°???36°, and a third Euler angle ? of the monocrystalline LiNbO3 is: ??0°.

Abstract: An electrical component has electrically conducting structures placed on an electrically isolating or semiconductive substrate and component structures sensitive to a voltage or an electrical arcing and galvanically separated from one another. To prevent an arcing between the galvanically separated component structures, the component structures are short-circuited with a shunt line having a smaller cross-section than the remaining electrical conductor tracks. The shunt lines can be burnt through by application of an electrical current at any given time, whereby a galvanic separation of the component structures is effected, if necessary, for the function of the component.

Abstract: A transversal filter operates using surface acoustic waves and has a piezoelectric substrate and an acoustic track that is arranged on the substrate and in which a first transducer and a second transducer are arranged. Each transducer has electrode fingers. A function, which characterizes the weighting of the overlap length of electrode fingers of different polarity in the second transducer, has a half main lobe and at least one side lobe. The amplitude of the lobes decreases monotonally in a direction that points to the first transducer.

Abstract: The invention relates to a circuit operating with bulk acoustic waves with at least electroacoustic systems, each arranged in a branch (Z1, Z2, Z3, Z4), wherein each electroacoustic system comprises at least two series-connected resonators (R11, R12; R21, R22; R31, R32; R41, R42) in the respective branch, which are galvanically separated from one another and acoustically coupled to one another by means of a coupling system (K1, K2, K3, K4) arranged therebetween. The electroacoustic systems are acoustically coupled via their coupling system (K1, K2) and/or electrically coupled to one another.

Abstract: A component working with guided acoustic waves includes a layer system configured to guide waves in a lateral plane. The layer system includes a piezoelectric layer, electrodes on the piezoelectric layer for exciting the wave, a dielectric layer with an acoustic impedance, and an adjustment layer with an acoustic impedance. A ratio of the acoustic impedance of the adjustment layer to the acoustic impedance of the dielectric layer is greater than 1.5.

Abstract: A method for producing an electric component including a dielectric layer on a substrate, includes the method steps of applying a metallic layer to the substrate and oxidizing the metallic layer to form a dielectric layer, wherein at least one partial region of the metallic layer is fully oxidized through the entire thickness of the layer.

Abstract: A component working with guided bulk acoustic waves includes a first substrate, a second substrate, and a layer system between the first and second substrates. The layer system includes a metal layer and a dielectric layer. A ratio of the acoustic impedance of the metal layer to the acoustic impedance of the dielectric layer is greater than or equal to 4.5.

Abstract: A component working with guided bulk acoustic waves is disclosed with at least one substrate and a layer system that is connected to this substrate and suitable for wave propagation. The layer system includes a metallization layer, a first dielectric layer, and a second dielectric layer. The velocity of the acoustic wave is greater in the second dielectric layer than in the first dielectric layer. At least one of the dielectric layers contains TeO2.

Abstract: An electroacoustic component that includes a substrate made of monocrystalline LiNbO3 is disclosed. In the component, a first Euler angle ? of the monocrystalline LiNbO3 is: ??0°, a second Euler angle ? of the monocrystalline LiNbO3 is: ?74°????52° or 23°???36°, and a third Euler angle ? of the monocrystalline LiNbO3 is: ??0°.

Abstract: A component has a substrate and a compensation layer. A lower face of the substrate is mechanically firmly connected to the compensation layer. The lower face of the substrate and the upper face of the compensation layer have a topography.

Abstract: A MEMS component includes a chip that has a rear side having a low roughness of less than one tenth of the wavelength at the center frequency of an acoustic wave propagating in the component. Metallic structures for scattering bulk acoustic waves are provided on the rear side of the chip and a material of the metallic structures is acoustically matched to a material of the chip.

Abstract: A transversal filter operates using surface acoustic waves and has a piezoelectric substrate and an acoustic track that is arranged on the substrate and in which a first transducer and a second transducer are arranged. Each transducer has electrode fingers. A function, which characterizes the weighting of the overlap length of electrode fingers of different polarity in the second transducer, has a half main lobe and at least one side lobe. The amplitude of the lobes decreases monotonally in a direction that points to the first transducer.

Abstract: An electroacoustic component includes a substrate that includes a quartz single crystal. The quartz single crystal has a first Euler angle ?: ?5°???5°, a second Euler angle ?, and a third Euler angle ?. A contiguous region of the quartz single crystal has the following vertices Pi(?i, ?i): (23°, 20°), (60°, 17°), (110°, 30°), (105°, 42°), (60°, 30°), (23°, 25°).

Abstract: An electroacoustic component operates with guided acoustic waves and includes a first substrate, a second substrate, a metallic layer and an intermediate layer. The first substrate (S1) is made from a monocrystalline LiTaO3. The metallic layer is arranged between the first substrate and the intermediate layer. The intermediate layer is arranged between the metallic layer and the second substrate. The crystal section of monocrystalline LiTaO3 is chosen such that for the second Euler angle ?: ?100°????40° or ?160°????130°. For the first Euler angle ?, preferably ?=0° and for the third Euler angle ?, ?10°???10°.

Abstract: A component includes a filter having a first structure and a second structure. The component also includes a substrate on which the first and second structures are arranged. The first structure has an approximately uniform layer thickness and an approximately uniform composition. The second structure has an approximately uniform layer thickness and an approximately uniform composition. At least one of the layer thickness or composition of the first structure differs from the layer thickness or composition of the second structure.