Patents by Inventor William Johanson

William Johanson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10648071
    Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes an adapter having an adapter body and a shield portion radially inward of the adapter body; a heat transfer channel formed in the adapter body; a shadow ring coupled to the adapter such that the shield portion of the adapter extends over a portion of the shadow ring; and a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: May 12, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Siew Kit Hoi, John Mazzocco, Kirankumar Savandaiah, Prashant Prabhu
  • Publication number: 20200090957
    Abstract: Methods and apparatus for processing substrates are provided herein. In some embodiments, a shroud for controlling gas flow in a process chamber includes a closed walled body having an upper end and a lower end, the closed walled body defining a first opening of the shroud at the lower end and a second opening of the shroud at the upper end, wherein the second opening is offset from the first opening; and a top wall disposed atop a portion of the upper end of the closed walled body in a position above the first opening to define, together with a remaining portion of the upper end of the closed walled body, the second opening, wherein the shroud is configured to divert a gas flow from the second opening through the first opening.
    Type: Application
    Filed: September 12, 2019
    Publication date: March 19, 2020
    Inventors: Jothilingam Ramalingam, Kirankumar Neelasandra Savandaiah, Fuhong Zhang, William Johanson
  • Publication number: 20190259586
    Abstract: Embodiments of improved apparatus for maintaining low non-uniformity over the life of a target are provided herein. In some embodiments, an apparatus includes a substrate support within a volume of a chamber body, opposite a target assembly of a lid atop the chamber body, with a surface; a shield disposed within the chamber body comprising one or more sidewalls surrounding the volume, the shield extending downward to below a top surface of the substrate support, radially inward, and returning upward forming an extending lip; and a first ring having (i) a first portion comprising an opening having a ceramic isolator, disposed therein, resting on top of the extending lip, and (ii) a second portion extending away from the first portion toward the surface, wherein the substrate support, over a life of the target, is configured to raise and lower, relative to the first ring, a substrate disposed on the surface.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 22, 2019
    Inventors: WILLIAM JOHANSON, FUHONG ZHANG, YU Y. LIU, ADOLPH MILLER ALLEN
  • Publication number: 20190189407
    Abstract: A movable substrate support with a top surface for holding a substrate, when present, is used in conjunction with a cover ring that is stationary to adjust for a shadow effect to control substrate edge uniformity during deposition processes. The cover ring is held stationary by an electrically isolated spacer that engages with a grounded shield in the process volume of a semiconductor process chamber. A controller adjusts the substrate support in response to deposition material on a top surface of the cover ring to maintain the shadow effect and substrate edge uniformity.
    Type: Application
    Filed: December 11, 2018
    Publication date: June 20, 2019
    Inventors: THANH X. NGUYEN, ALEXANDER JANSEN, YANA CHENG, RANDAL SCHMIEDING, YONG CAO, XIANMIN TANG, WILLIAM JOHANSON
  • Patent number: 10283334
    Abstract: Embodiments of improved methods and apparatus for maintaining low non-uniformity over the course of the life of a target are provided herein. In some embodiments, a method of processing a substrate in a physical vapor deposition chamber includes: disposing a substrate atop a substrate support having a cover ring that surrounds the substrate support such that an upper surface of the substrate is positioned at a first distance above an upper surface of the cover ring; sputtering a source material from a target disposed opposite the substrate support to deposit a film atop the substrate while maintaining the first distance; and lowering the substrate support with respect to the cover ring and sputtering the source material from the target to deposit films atop subsequent substrates over a life of the target.
    Type: Grant
    Filed: October 23, 2014
    Date of Patent: May 7, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Fuhong Zhang, Adolph Miller Allen, Yu Liu
  • Patent number: 10103012
    Abstract: Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments, a one-piece process kit shield configured for use in a processing chamber for processing a substrate having a given diameter includes: a cylindrical body having an upper portion and a lower portion; an annular heat transfer channel disposed within the upper portion; and a cover ring section extending radially inward from the lower portion and having an annular leg extending from a bottom surface of the cover ring section, wherein the annular leg is configured to interface with a deposition ring to form a tortuous path between the bottom surface and the deposition ring.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: October 16, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Kirankumar Savandaiah
  • Patent number: 9991101
    Abstract: Methods and apparatus for a magnetron assembly are provided herein. In some embodiments, a magnetron assembly includes a shunt plate having a central axis and rotatable about the central axis, a closed loop magnetic pole coupled to a first surface of the shunt plate and disposed 360 degrees along a peripheral edge of the shunt plate, and an open loop magnetic pole coupled at a the first surface of the shunt plate wherein the open loop magnetic pole comprises two rows of magnets disposed about the central axis.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: June 5, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Brij Datta, Fuhong Zhang, Adolph Miller Allen, Yu Y. Liu, Prashanth Kothnur
  • Publication number: 20180151325
    Abstract: Apparatus and methods for reducing and eliminating accumulation of excessive charged particles from substrate processing systems are provided herein. In some embodiments a process kit for a substrate process chamber includes: a cover ring having a body and a lip extending radially inward from the body, wherein the body has a bottom, a first wall, and a second wall, and wherein a first channel is formed between the second wall and the lip; a grounded shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first channel of the cover ring; and a bias power receiver coupled to the body and extending through an opening in the grounded shield.
    Type: Application
    Filed: November 27, 2017
    Publication date: May 31, 2018
    Inventors: ADOLPH MILLER ALLEN, WILLIAM JOHANSON, VIACHSLAV BABAYAN, ZHONG QIANG HUA, CARL R. JOHNSON, VANESSA FAUNE, JINGJING LIU, VAIBHAV SONI, KIRANKUMAR SAVANDAIAH, SUNDARAPANDIAN RAMALINGA VIJAYALAKS REDDY
  • Publication number: 20180142340
    Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes an adapter having an adapter body and a shield portion radially inward of the adapter body; a heat transfer channel formed in the adapter body; a shadow ring coupled to the adapter such that the shield portion of the adapter extends over a portion of the shadow ring; and a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter.
    Type: Application
    Filed: November 16, 2017
    Publication date: May 24, 2018
    Inventors: WILLIAM JOHANSON, SIEW KIT HOI, JOHN MAZZOCCO, KIRANKUMAR SAVANDAIAH, PRASHANT PRABHU
  • Patent number: 9953812
    Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes: a one-piece process kit shield having a cylindrical body having an upper portion and a lower portion; an adapter section extending radially outward and having a resting surface to support the one-piece process kit shield on walls of a chamber and a sealing surface on which a chamber lid rests to seal off an inner volume of the chamber when the one-piece process kit shield is placed in the chamber; a heat transfer channel extending through the adapter section; and a protruding section extending radially inward from the lower portion; a resting bracket having an upper portion coupled to the adapter section and a lower portion extending radially inward; a cover ring disposed beneath the protruding section; and a deposition ring disposed beneath the cover ring.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: April 24, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Kirankumar Savandaiah, Xin Wang, Prashant Prabhu
  • Patent number: 9909206
    Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes a deposition ring configured to be disposed on a substrate support designed to support a substrate having a given width, including: an annular band configured to rest on a lower ledge of the substrate support; an inner lip extending upwardly from an inner edge of the annular band, wherein an inner surface of the inner lip and an inner surface of the annular band together form a central opening having a width that is less than the given width, and wherein a depth between an upper surface of the annular band and an upper surface of the inner lip is between about 24 mm and about 38 mm; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: March 6, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Kirankumar Savandaiah, Adolph Miller Allen, Xin Wang, Prashant Prabhu
  • Publication number: 20170098530
    Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes: a one-piece process kit shield having a cylindrical body having an upper portion and a lower portion; an adapter section extending radially outward and having a resting surface to support the one-piece process kit shield on walls of a chamber and a sealing surface on which a chamber lid rests to seal off an inner volume of the chamber when the one-piece process kit shield is placed in the chamber; a heat transfer channel extending through the adapter section; and a protruding section extending radially inward from the lower portion; a resting bracket having an upper portion coupled to the adapter section and a lower portion extending radially inward; a cover ring disposed beneath the protruding section; and a deposition ring disposed beneath the cover ring.
    Type: Application
    Filed: October 6, 2016
    Publication date: April 6, 2017
    Inventors: William JOHANSON, Kirankumar SAVANDAIAH, Xin WANG, Prashant PRABHU
  • Publication number: 20170076924
    Abstract: Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments, a one-piece process kit shield configured for use in a processing chamber for processing a substrate having a given diameter includes: a cylindrical body having an upper portion and a lower portion; an annular heat transfer channel disposed within the upper portion; and a cover ring section extending radially inward from the lower portion and having an annular leg extending from a bottom surface of the cover ring section, wherein the annular leg is configured to interface with a deposition ring to form a tortuous path between the bottom surface and the deposition ring.
    Type: Application
    Filed: September 8, 2016
    Publication date: March 16, 2017
    Inventors: William JOHANSON, Kirankumar SAVANDAIAH
  • Publication number: 20170002461
    Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes a deposition ring configured to be disposed on a substrate support designed to support a substrate having a given width, including: an annular band configured to rest on a lower ledge of the substrate support; an inner lip extending upwardly from an inner edge of the annular band, wherein an inner surface of the inner lip and an inner surface of the annular band together form a central opening having a width that is less than the given width, and wherein a depth between an upper surface of the annular band and an upper surface of the inner lip is between about 24 mm and about 38 mm; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.
    Type: Application
    Filed: July 1, 2016
    Publication date: January 5, 2017
    Inventors: William JOHANSON, Kirankumar SAVANDAIAH, Adolph Miller ALLEN, Xin WANG, Prashant PRABHU
  • Patent number: 9472443
    Abstract: Embodiments of a process kit for substrate process chambers are provided herein. In some embodiments, a process kit for a substrate process chamber may include a ring having a body and a lip extending radially inward from the body, wherein the body has a first annular channel formed in a bottom of the body; an annular conductive shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first annular channel of the ring; and a conductive member electrically coupling the ring to the conductive shield when the ring is disposed on the conductive shield.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: October 18, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Muhammad M. Rasheed, Kirankumar Savandaiah, William Johanson, Zhenbin Ge, Goichi Yoshidome
  • Patent number: 9315891
    Abstract: In some embodiments, a method for processing a substrate in a process chamber having a substrate support configured to move in a direction perpendicular to a top surface of a cover ring of a process kit may include positioning the substrate support in a first position such that a top surface of the substrate is positioned about 3 mm above to about 10 mm below a top surface of a cover ring of a process kit disposed about the periphery of the substrate support; performing a plasma deposition process while the substrate support is in the first position; moving the substrate support to a second position such that the top surface of the substrate is disposed about 3 mm below to about 15 mm above the top surface of the cover ring; and performing a plasma etch process while the substrate support is in the second position.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: April 19, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Joung Joo Lee, William Johanson, Keith A. Miller, Alan A. Ritchie
  • Patent number: D797067
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: September 12, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Fuhong Zhang, William Johanson, Yu Liu, Adolph Miller Allen, Brij Datta, Keith A. Miller
  • Patent number: D825504
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: August 14, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Fuhong Zhang, William Johanson, Yu Liu, Adolph Miller Allen, Brij Datta, Keith A. Miller
  • Patent number: D851613
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: June 18, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Kirankumar Savandaiah, Anthony Chih-Tang Chan, Siew Kit Hoi, Prashant Prabhakar Prabhu
  • Patent number: D894137
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: August 25, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: William Johanson, Kirankumar Savandaiah, Anthony Chih-Tang Chan, Siew Kit Hoi, Prashant Prabhakar Prabhu