Patents by Inventor William Wu Shen

William Wu Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10148378
    Abstract: A phase locked loop (PLL) for a carrier generator includes a front-end circuit that receives a frequency reference signal and generates a control signal based on the frequency reference signal and a feedback signal. A demultiplexer selectively outputs the control signal to a plurality of tuning arrangements. The plurality of tuning arrangements includes a first tuning arrangement that generates a first carrier signal based on the control signal and a second tuning arrangement that generates a second carrier signal based on the control signal. A multiplexer outputs the feedback signal based on the first carrier signal and the second carrier signal.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: December 4, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Feng Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen
  • Publication number: 20180287775
    Abstract: A device, a circuit and a method are disclosed herein. The device includes a data receiving circuit and an oscillating signal generator. The data receiving circuit is configured to output a first output signal, a second output signal, and a phase error signal according to an oscillating signal and a modulated signal, in which the phase error signal indicates a phase difference between the oscillating signal and the modulated signal. The oscillating signal generator is configured to delay a phase of a first reference signal according to the phase error signal, to generate the oscillating signal.
    Type: Application
    Filed: June 7, 2018
    Publication date: October 4, 2018
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Huan-Neng CHEN, William Wu SHEN, Lan-Chou CHO, Feng-Wei KUO, Chewn-Pu JOU
  • Patent number: 10090883
    Abstract: A radio frequency interconnect includes a transmitter coupled with an input end of a transmission line, and a receiver coupled with an output end of the transmission line. The transmitter includes a first carrier generator configured to generate a clock recovery signal based on a carrier signal, to output a reference clock signal, and to transmit the clock recovery signal to the receiver. The transmitter also includes a modulator configured to modulate a data packet based on the carrier signal. The transmitter also includes a preamble generator configured to generate and add a preamble to data to generate the data packet. The preamble includes a data sequence associated with the reference clock signal. The transmitter further includes a transmitter output configured to transmit the modulated data packet to the receiver by the transmission line.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: October 2, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Feng Wei Kuo, William Wu Shen, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho
  • Publication number: 20180278281
    Abstract: A communication system includes a first amplifier configured to output an amplified modulated signal, and a demodulator coupled to the first amplifier. The demodulator is configured to demodulate the amplified modulated signal responsive to a first carrier signal. The demodulator includes a filter and a bandwidth adjusting circuit. The filter is configured to generate a filtered first signal based on a first signal and a set of control signals. The filter has a bandwidth adjusted based on the set of control signals. The bandwidth adjusting circuit is coupled to the filter, and is configured to generate the set of control signals based on a frequency of the filtered first signal and a frequency of the first signal. The bandwidth adjusting circuit includes a frequency detector configured to generate a second signal based on the frequency of the filtered first signal and the frequency of the first signal.
    Type: Application
    Filed: June 4, 2018
    Publication date: September 27, 2018
    Inventors: Feng Wei KUO, William Wu SHEN, Chewn-Pu JOU, Huan-Neng CHEN, Lan-Chou CHO
  • Patent number: 10056939
    Abstract: A communication system includes a demodulator configured to demodulate a modulated signal responsive to a first carrier signal. The demodulator includes a filter and a gain adjusting circuit. The filter is configured to generate a filtered first signal based on a first signal. The first signal is a product of the first carrier signal and the modulated signal. The filter has a gain adjusted based on a set of control signals. The gain adjusting circuit is coupled to the filter, and is configured to generate the set of control signals based on at least a voltage of the filtered first signal. The gain adjusting circuit includes a first peak detector coupled to the filter. The first peak detector is configured to output a peak value of the voltage of the filtered first signal.
    Type: Grant
    Filed: September 14, 2017
    Date of Patent: August 21, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Feng Wei Kuo, William Wu Shen, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho
  • Patent number: 10044547
    Abstract: A digital code recovery circuit includes a data transmitter that outputs either input data or a preamble code as transmitter data. A radio frequency interconnect (RFI) transmitter modulates carrier signals based on the transmitter data and transmits the modulated carrier signals over a channel to an RFI receiver that demodulates the carrier signals to obtain recovered transmitter data. A calibration storage device stores preamble data and a calibration circuit receives the recovered transmitter data. If the recovered transmitter data originated from the preamble code, the calibration circuit determines a set of digital calibration adjustments from the recovered transmitter data and the preamble data. If the recovered transmitter data originated from the input data, the calibration circuit applies the set of digital calibration adjustments to the recovered transmitter data to obtain adjusted digital code and outputs the adjusted digital code.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: August 7, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fu-Lung Hsueh, William Wu Shen, Lan-Chou Cho
  • Patent number: 10009167
    Abstract: A device, a circuit and a method are disclosed herein. The device includes a data receiving circuit and an oscillating signal generator. The data receiving circuit is configured to output a first output signal, a second output signal, and a phase error signal according to an oscillating signal and a modulated signal, in which the phase error signal indicates a phase difference between the oscillating signal and the modulated signal. The oscillating signal generator is configured to delay a phase of a first reference signal according to the phase error signal, to generate the oscillating signal.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: June 26, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Huan-Neng Chen, William Wu Shen, Lan-Chou Cho, Feng-Wei Kuo, Chewn-Pu Jou
  • Patent number: 10003455
    Abstract: A carrier generator includes a phase accumulator configured to generate a phase reference signal based on a frequency command word (FCW) signal, a time to digital converter (TDC) configured to generate a feedback signal based on a divided signal, a loop filter configured to generate a filtered command signal based on the phase reference signal and the feedback signal, and a plurality of tuning arrangements. Each tuning arrangement includes an oscillator configured to receive the filtered command signal and output an adjustment signal, and is configured to output a carrier signal of a corresponding plurality of carrier signals based on the adjustment signal. The divided signal is based on the adjustment signal of a first tuning arrangement.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: June 19, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Feng Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, William Wu Shen
  • Patent number: 9991917
    Abstract: A demodulator is configured to demodulate a modulated signal responsive to a first carrier signal. The demodulator includes a filter and a bandwidth adjusting circuit. The filter is configured to filter a first signal. The first signal is a product of the first carrier signal and the modulated signal. The filter has a bandwidth adjusted based on a set of control signals. The bandwidth adjusting circuit is coupled to the filter, and configured to generate the set of control signals based on at least a frequency of the filtered first signal and a frequency of the first signal. The bandwidth adjusting circuit includes a frequency detector configured to generate a second signal based on a frequency relationship between the frequency of the filtered first signal and the frequency of the first signal.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: June 5, 2018
    Assignee: TAIWANT SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Feng Wei Kuo, William Wu Shen, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho
  • Patent number: 9985687
    Abstract: A communication system includes a carrier generator, a first modulation circuit, a pulse generator, a first transmission line, and a second transmission line. The carrier generator is configured to generate a first carrier signal and a reference clock signal. The first modulation circuit is coupled to the carrier generator, and configured to generate a first modulated signal based on a first data signal and the first carrier signal. The pulse generator is coupled to the carrier generator, and configured to generate a pulse train signal based on the reference clock signal. The first transmission line is configured to carry the modulated signal, and configured to cause a delay to the first modulated signal. The second transmission line is coupled to the pulse generator, configured to carry the pulse train signal, and configured to cause a delay to the pulse train signal.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: May 29, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Huan-Neng Chen, Chewn-Pu Jou, Feng Wei Kuo, Lan-Chou Cho, William Wu Shen
  • Patent number: 9887863
    Abstract: A transceiver group includes a plurality of transceivers; wherein the transceiver group performs transmission and receiving through a wire, and each of the transceivers includes a transmitter and a receiver, and the transmitter includes: a carrier generator arranged to generate a plurality of carriers having different frequencies for a plurality of data streams to be transmitted; a modulator, coupled to the data streams to be transmitted and the carrier generator, to generate a plurality of modulated data streams carried on the plurality of carriers; and a summer arranged to merge the plurality of modulated data streams to an output signal to the wire; and the receiver includes: a carrier generator arranged to generate a plurality of carriers having different frequencies for an input signal received from the wire; and a demodulator, coupled to the input signal and the carrier generator, to generate a plurality of demodulated data streams.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: February 6, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Huan-Neng Chen, William Wu Shen, Lan-Chou Cho, Feng Wei Kuo, Chewn-Pu Jou, Tze-Chiang Huang, Jack Liu, Yun-Han Lee
  • Publication number: 20180012799
    Abstract: Some embodiments relate to a semiconductor module having an integrated antenna structure. The semiconductor module has an excitable element and a first ground plane disposed between a substrate and the excitable element. A second ground plane is separated from the first ground plane by the substrate. The second ground plane is coupled to the first ground plane by one or more through-substrate vias (TSVs) that extend through the substrate.
    Type: Application
    Filed: September 20, 2017
    Publication date: January 11, 2018
    Inventors: Bo-Jr Huang, William Wu Shen, Chin-Her Chien, Chin-Chou Liu, Yun-Han Lee
  • Publication number: 20180006682
    Abstract: A communication system includes a demodulator configured to demodulate a modulated signal responsive to a first carrier signal. The demodulator includes a filter and a gain adjusting circuit. The filter is configured to generate a filtered first signal based on a first signal. The first signal is a product of the first carrier signal and the modulated signal. The filter has a gain adjusted based on a set of control signals. The gain adjusting circuit is coupled to the filter, and is configured to generate the set of control signals based on at least a voltage of the filtered first signal. The gain adjusting circuit includes a first peak detector coupled to the filter. The first peak detector is configured to output a peak value of the voltage of the filtered first signal.
    Type: Application
    Filed: September 14, 2017
    Publication date: January 4, 2018
    Inventors: Feng Wei KUO, William Wu SHEN, Chewn-Pu JOU, Huan-Neng CHEN, Lan-Chou CHO
  • Publication number: 20170373714
    Abstract: Systems and methods for die-to-die communication are provided. A first transceiver disposed on a first die includes a transmission section configured to modulate first data onto a carrier signal having a first frequency. The first transceiver includes a reception section configured to receive signals from a transmission line. The reception section includes a filter configured to pass frequencies within a first passband that includes a second frequency. The first frequency is outside of the first passband. A second transceiver is disposed on a second die and is configured to communicate with the first transceiver via the transmission line. The second transceiver includes a transmission section configured to modulate second data onto a carrier signal having the second frequency. The second transceiver includes a reception section including a filter configured to pass frequencies within a second passband that includes the first frequency. The second frequency is outside of the second passband.
    Type: Application
    Filed: June 28, 2016
    Publication date: December 28, 2017
    Inventors: Huan-Neng Chen, Chewn-Pu Jou, Feng-Wei Kuo, Lan-Chou Cho, William Wu Shen
  • Patent number: 9847320
    Abstract: A semiconductor device is disclosed. The semiconductor device includes: a first die including a signal pad region and a power pad region; a redistribution layer (RDL) over the first die; a plurality of first connectors over the RDL and at a side of the RDL opposite to the first die; a plurality of second connectors over the RDL and at the side opposite to the first die; a second die including a signal pad region and a power pad region, wherein the second die is face-to-face and electrically connected to the first die through the first connectors and the RDL, wherein a center of the second die is laterally shifted with respect to a center of the first die so as to correspond the signal pad region of the first die to the signal pad region of the second die. An associated method for fabricating the same is also disclosed.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: December 19, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chien Hsun Chen, William Wu Shen, Jiun Yi Wu, Chien Hsun Lee
  • Publication number: 20170317774
    Abstract: A phase locked loop (PLL) for a carrier generator includes a front-end circuit that receives a frequency reference signal and generates a control signal based on the frequency reference signal and a feedback signal. A demultiplexer selectively outputs the control signal to a plurality of tuning arrangements. The plurality of tuning arrangements includes a first tuning arrangement that generates a first carrier signal based on the control signal and a second tuning arrangement that generates a second carrier signal based on the control signal. A multiplexer outputs the feedback signal based on the first carrier signal and the second carrier signal.
    Type: Application
    Filed: July 20, 2017
    Publication date: November 2, 2017
    Inventors: Feng Wei KUO, Chewn-Pu JOU, Huan-Neng CHEN, Lan-Chou CHO, William Wu SHEN
  • Patent number: 9779990
    Abstract: Some embodiments relate to a semiconductor module comprising a low-cost integrated antenna that uses a conductive backside structure in conjunction with a ground metal layer to form a large ground plane with a small silicon area. In some embodiments, the integrated antenna structure has an excitable element that radiates electromagnetic radiation. An on-chip ground plane, located on a first side of an interposer substrate, is positioned below the excitable element. A compensation ground plane, located on an opposing side of the interposer substrate, is connected to the ground plane by one or more through-silicon vias (TSVs) that extend through the interposer substrate. The on-chip ground plane and the compensation ground collectively act to reflect the electromagnetic radiation generated by the excitable element, so that the compensation ground improves the performance of the on-chip ground plane.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: October 3, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo-Jr Huang, William Wu Shen, Chin-Her Chien, Chin-Chou Liu, Yun-Han Lee
  • Publication number: 20170278806
    Abstract: A semiconductor package includes a first semiconductor device, a second semiconductor device vertically positioned above the first semiconductor device, and a ground shielded transmission path. The ground shielded transmission path couples the first semiconductor device to the second semiconductor device. The ground shielded transmission path includes a first signal path extending longitudinally between a first end and a second end. The first signal path includes a conductive material. A first insulating layer is disposed over the signal path longitudinally between the first end and the second end. The first insulating layer includes an electrically insulating material. A ground shielding layer is disposed over the insulating material longitudinally between the first end and the second end of the signal path. The ground shielding layer includes a conductive material coupled to ground.
    Type: Application
    Filed: March 22, 2016
    Publication date: September 28, 2017
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Feng Wei KUO, Wen-Shiang LIAO, Chewn-Pu JOU, Huan-Neng CHEN, Lan-Chou CHO, William Wu SHEN
  • Patent number: 9768828
    Abstract: A communication system includes a carrier generator configured to generate a first carrier signal and a demodulator configured to demodulate a modulated signal responsive to the first carrier signal. The demodulator includes a filter and a gain adjusting circuit. The filter is configured to filter a first signal. The first signal is a product of the first carrier signal and the modulated signal. The filter has a first cutoff frequency and a gain. The gain of the filter is controlled by a set of control signals. The gain adjusting circuit is configured to adjust the gain of the filter based on a voltage of the filtered first signal or a voltage of a second signal. The adjustable gain circuit is configured to generate the set of control signals.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: September 19, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Feng Wei Kuo, William Wu Shen, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho
  • Publication number: 20170263588
    Abstract: A semiconductor device is disclosed. The semiconductor device includes: a first die including a signal pad region and a power pad region; a redistribution layer (RDL) over the first die; a plurality of first connectors over the RDL and at a side of the RDL opposite to the first die; a plurality of second connectors over the RDL and at the side opposite to the first die; a second die including a signal pad region and a power pad region, wherein the second die is face-to-face and electrically connected to the first die through the first connectors and the RDL, wherein a center of the second die is laterally shifted with respect to a center of the first die so as to correspond the signal pad region of the first die to the signal pad region of the second die. An associated method for fabricating the same is also disclosed.
    Type: Application
    Filed: June 3, 2016
    Publication date: September 14, 2017
    Inventors: CHIEN HSUN CHEN, WILLIAM WU SHEN, JIUN YI WU, CHIEN HSUN LEE