Patents by Inventor Won-Chul Sim
Won-Chul Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11948745Abstract: A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other interposing at least one dielectric layer therebetween in a first direction; and first and second external electrodes disposed on the body and spaced apart from each other to be respectively connected to the at least one first internal electrode and the at least one second internal electrode, wherein the body includes a side margin overlapping none of the at least one first internal electrode and the at least one second internal electrode in the first direction, and a center width of the side margin is greater than a minimum width of the side margin.Type: GrantFiled: April 20, 2022Date of Patent: April 2, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Chul Sim, Soo Hwan Son, Young Ghyu Ahn
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Publication number: 20230215632Abstract: A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other interposing at least one dielectric layer therebetween in a first direction; and first and second external electrodes disposed on the body and spaced apart from each other to be respectively connected to the at least one first internal electrode and the at least one second internal electrode, wherein the body includes a side margin overlapping none of the at least one first internal electrode and the at least one second internal electrode in the first direction, and a center width of the side margin is greater than a minimum width of the side margin.Type: ApplicationFiled: April 20, 2022Publication date: July 6, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Chul Sim, Soo Hwan Son, Young Ghyu Ahn
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Publication number: 20230187136Abstract: A multilayer capacitor includes a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body to be connected to the at least one first internal electrode and the at least one second internal electrode, respectively, wherein the body further includes a buffer layer disposed in the capacitance region and having a Young’s modulus of greater than 0 time and (50/135) times or less of a Young’s modulus of the at least one dielectric layer.Type: ApplicationFiled: March 10, 2022Publication date: June 15, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Chul Sim, Soo Hwan Son, Young Ghyu Ahn
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Publication number: 20230187139Abstract: A multilayer capacitor includes a body including a laminate structure in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; first and second external electrodes spaced apart from each other and disposed on the body to be connected to the at least one first internal electrode and the at least one second internal electrode, respectively; and a noise reduction insulating layer covering one surface of the body and one surfaces of the first and second external electrodes together.Type: ApplicationFiled: April 7, 2022Publication date: June 15, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su Byun, Dae Heon Jeong, Soo Hwan Son, Won Chul Sim
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Publication number: 20230091278Abstract: A multilayer capacitor includes a body including a dielectric layer and first and second internal electrodes stacked on each other and having the dielectric layer interposed therebetween; a pair of first external electrodes respectively disposed on first and second corners of the body, which are not adjacent to each other, and connected to the first internal electrode; a pair of second external electrodes respectively disposed on third and fourth corners of the body, which are not adjacent to each other, and connected to the second internal electrode; and a reinforcing portion disposed on a surface of the body, not covered by at least one of the first and second external electrodes, and including a sintered ceramic body.Type: ApplicationFiled: June 14, 2022Publication date: March 23, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hwi Dae Kim, Won Chul Sim, Taek Jung Lee, Jin O Yoo, Young Ghyu Ahn
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Publication number: 20220181084Abstract: The present disclosure provides a multilayer capacitor and a board component having the same. The multilayer capacitor includes: a capacitor body including dielectric layers, and first and second internal electrodes that are alternately disposed with the dielectric layers interposed therebetween, and having first to sixth surfaces; first and second external electrodes disposed on opposite end portions of the capacitor body in a direction perpendicular to the third and fourth surfaces, and connected to the first and second internal electrodes, respectively; an insulator disposed on the first surface of the capacitor body; a first conductive resin layer covering the first external electrode and one end portion of the insulator in the direction; and a second conductive resin layer covering the second external electrode and the other end portion of the insulator in the direction.Type: ApplicationFiled: November 23, 2021Publication date: June 9, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Man Su BYUN, Ho Yoon KIM, Min Kyoung CHEON, Soo Hwan SON, Won Chul SIM
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Patent number: 11295890Abstract: A coil component includes a body; a first substrate disposed inside of the body, and a second substrate, disposed below the first substrate; a first coil layer disposed on an upper surface of the first substrate; a second coil layer disposed between the first substrate and the second substrate; a third coil layer disposed on a lower surface of the second substrate; a conductive via passing through the first substrate and connecting the first coil layer and the second coil layer to each other; a connection electrode disposed outside of the body and connecting the second coil layer and the third coil layer to each other; a first external electrode disposed outside of the body and connected to the first coil layer; and a second external electrode disposed outside of the body and connected to the third coil layer.Type: GrantFiled: August 6, 2019Date of Patent: April 5, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jin Lee, Dong Hwan Lee, Young Ghyu Ahn, Chan Yoon, Won Chul Sim
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Patent number: 11264176Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and first and second internal electrodes stacked with the dielectric layer interposed therebetween, and having first and second external electrodes disposed on the ceramic body and connected to the first and second internal electrodes, respectively. The first external electrode includes a first electrode portion and a first band portion, and the second external electrode comprises a second electrode portion and a second band portion. A length of the ceramic body in a first direction is L, a width thereof in a second direction is W, a length of the first and second electrode portions in the first direction is BW, a width of the first or second band portion in the second direction is SW, a ratio SW/W is less than 0.46, and a ratio BW/L exceeds 0.10.Type: GrantFiled: April 15, 2020Date of Patent: March 1, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hoon Kim, Won Chul Sim
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Patent number: 11183324Abstract: An inductor array includes a body including at least three coils and external electrodes arranged on external surfaces of the body. The at least three coils are arranged to be spaced apart from each other by a predetermined distance in one direction of the body, and here, the at least three coils have the same characteristic value. A minimum distance between mutually adjacent coils among the at least three coils is changed according to the number of turns of a coil pattern included in an area formed between the centers of cores of mutually adjacent coils.Type: GrantFiled: July 11, 2018Date of Patent: November 23, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Yoon, Won Chul Sim, Dong Hwan Lee, Young Ghyu Ahn
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Patent number: 11087919Abstract: A coil component includes a body including first, second, third and fourth coils and including a first end surface and a second end surface opposed in a first direction, a first side surface and a second side surface opposing each other in a second direction, and an upper surface and a lower surface opposing each other in a third direction and a plurality of external electrodes disposed on the body and connected to the first to fourth coils. A first group including the first and second coils is arranged in point symmetry with respect to a second group including the third and fourth coils about a center between the first and second groups.Type: GrantFiled: October 30, 2018Date of Patent: August 10, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jin Lee, Young Ghyu Ahn, Chan Yoon, Dong Hwan Lee, Won Chul Sim
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Patent number: 11075030Abstract: An inductor according to an aspect of the present disclosure is an inductor array comprising a plurality of wire-wound type coils. The inductor array comprises a body comprising a first wire-wound type coil, a second wire-wound type coil, a fixation member, and a sealing material sealing the first wire-wound type coil, the second wire-wound type coil, and the fixation member, and comprising magnetic materials; and external electrodes arranged on an external surface of the body. The fixation member comprises a support portion and a core portion passing through the support portion. The first and second wire-wound type coils are arranged to be spaced apart from each other by the fixation member. The fixation member comprises magnetic materials.Type: GrantFiled: August 22, 2018Date of Patent: July 27, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Yoon, Dong Hwan Lee, Young Ghyu Ahn, Won Chul Sim
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Publication number: 20210210287Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and first and second internal electrodes stacked with the dielectric layer interposed therebetween, and having first and second external electrodes disposed on the ceramic body and connected to the first and second internal electrodes, respectively. The first external electrode includes a first electrode portion and a first band portion, and the second external electrode comprises a second electrode portion and a second band portion. A length of the ceramic body in a first direction is L, a width thereof in a second direction is W, a length of the first and second electrode portions in the first direction is BW, a width of the first or second band portion in the second direction is SW, a ratio SW/W is less than 0.46, and a ratio BW/L exceeds 0.10.Type: ApplicationFiled: April 15, 2020Publication date: July 8, 2021Inventors: Tae Hoon Kim, Won Chul Sim
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Patent number: 10957477Abstract: An inductor includes a body including a support member having a first through-hole, a second through-hole, a first via-hole and a second via-hole, the first and second via-holes being spaced apart from the first and second through-holes, a first coil unit and a second coil unit disposed on one surface of the support member, a third coil unit and a fourth coil unit facing the one surface of the support member, and an encapsulant encapsulating the support member and the first to fourth coil units and including a magnetic material, and a first external electrode to a fourth external electrode respectively connected to the first to fourth coil units on an external surface of the body. The encapsulant includes a first encapsulant and a second encapsulant having magnetic permeability different from each other.Type: GrantFiled: August 9, 2018Date of Patent: March 23, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Yoon, Dong Hwan Lee, Young Ghyu Ahn, Won Chul Sim
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Publication number: 20210074480Abstract: A multilayer capacitor includes a capacitor body having first and second surfaces, third and fourth surfaces connected to the first and second surfaces, and a fifth surface and a sixth surface connected to the first and second surfaces and the third and fourth surfaces, the capacitor body including a dielectric layer and internal electrodes having one ends exposed through the third and fourth sides, respectively, and first and second external electrodes including first and second connection portions disposed on the third and fourth surfacesrespectively, and first and second band portions extending from the first and second connection portions to portions of the fifth and sixth surfaces respectively. A first distance, along one of the fifth and sixth surfaces, between the first and second external electrodes, is less than a second distance, along one of the first and second surfaces, between the first and second external electrodes.Type: ApplicationFiled: May 20, 2020Publication date: March 11, 2021Inventors: Won Chul Sim, Young Ghyu Ahn
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Patent number: 10910155Abstract: An electronic component includes a multilayer capacitor comprising a capacitor body, and an external electrode disposed on an end of the capacitor body, and an interposer comprising an interposer body, and an external terminal disposed on an end of the interposer body. The external terminal includes a connection portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a side connection portion disposed on the first and second surfaces and a side surface of the interposer to connect the connection portion and the mounting portion. The side connection portion includes a cutting portion.Type: GrantFiled: November 27, 2018Date of Patent: February 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Chul Sim, Ho Yoon Kim, Sang Soo Park, Woo Chul Shin
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Patent number: 10872724Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, and an interposer including an insulating body and first and second terminal electrodes. (B1+B2)/2 is greater than or equal to 10 micrometers (?m) and less than C/2, and C is greater than (B1+B2) and less than or equal to 80 ?m, in which B1 is a thickness of an upper portion, of each of the first and second terminal electrodes, disposed above the insulating body, B2 is a thickness of a lower portion, of each of the first and second terminal electrodes, disposed below the insulating body, and C is a thickness of the interposer.Type: GrantFiled: January 2, 2020Date of Patent: December 22, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO, LTD.Inventors: Won Chul Sim, Ho Yoon Kim, Woo Chul Shin, Sang Soo Park
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Patent number: 10840022Abstract: An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed in a width direction. The capacitor body has first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively. First and second external electrodes are disposed on the third and fourth surfaces and extend to portions of the first surface. A first connection terminal and a second connection terminal are disposed to be respectively connected to be connected to the first and second external electrodes, and each has a shape including at least one indentation in a rectangular outline within which the respective connection terminal is inscribed.Type: GrantFiled: November 6, 2018Date of Patent: November 17, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Chul Sim, Gu Won Ji, Heung Kil Park, Young Ghyu Ahn, Se Hun Park
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Publication number: 20200286677Abstract: A coil component includes a body; a first substrate disposed inside of the body, and a second substrate, disposed below the first substrate; a first coil layer disposed on an upper surface of the first substrate; a second coil layer disposed between the first substrate and the second substrate; a third coil layer disposed on a lower surface of the second substrate; a conductive via passing through the first substrate and connecting the first coil layer and the second coil layer to each other; a connection electrode disposed outside of the body and connecting the second coil layer and the third coil layer to each other; a first external electrode disposed outside of the body and connected to the first coil layer; and a second external electrode disposed outside of the body and connected to the third coil layer.Type: ApplicationFiled: August 6, 2019Publication date: September 10, 2020Inventors: Dong Jin LEE, Dong Hwan LEE, Young Ghyu AHN, Chan YOON, Won Chul SIM
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Patent number: 10770235Abstract: A multilayer capacitor in which acoustic noise is reduced has an area of overlap between internal electrodes in an active region of a lower portion of a capacitor body that is smaller than an area of overlap between internal electrodes in an active region of an upper portion of the capacitor body. The multilayer capacitor can be bonded to a board by relatively small solders such that the lower portion is adjacent the board. Deviations between areas of overlap of adjacent internal electrodes in the upper and lower portions of the active region are minimized to reduce piezoelectric deformation of the capacitor body.Type: GrantFiled: October 22, 2018Date of Patent: September 8, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Chul Sim, Young Ghyu Ahn, Heung Kil Park, Soo Hwan Son
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Patent number: 10699839Abstract: A thin film-type inductor includes a body having a coil, and a first external electrode and a second external electrode. The first and second external electrodes are each disposed on an external surface of the body. The coil includes a coil body and a via portion. The via portion is directly connected to the first external electrode. The coil body includes a base conductor layer in a lower portion and a plating layer in an upper portion.Type: GrantFiled: November 20, 2017Date of Patent: June 30, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Yoon, Won Chul Sim, Dong Hwan Lee, Young Ghyu Ahn