Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, and an interposer including an insulating body and first and second terminal electrodes. (B1+B2)/2 is greater than or equal to 10 micrometers (?m) and less than C/2, and C is greater than (B1+B2) and less than or equal to 80 ?m, in which B1 is a thickness of an upper portion, of each of the first and second terminal electrodes, disposed above the insulating body, B2 is a thickness of a lower portion, of each of the first and second terminal electrodes, disposed below the insulating body, and C is a thickness of the interposer.

Abstract: An inductor array component includes a body including a plurality of coil portions a coil included in the coil portions, external electrodes connected to both end portions of the coil and disposed on an outer surface of the body, a first blocking layer disposed between the coil portions, and a second blocking layer disposed within the first blocking layer.

Abstract: An electronic component includes a multilayer capacitor comprising a capacitor body, and an external electrode disposed on an end of the capacitor body, and an interposer comprising an interposer body, and an external terminal disposed on an end of the interposer body. The external terminal includes a connection portion disposed on a first surface of the interposer body and connected to the external electrode, a mounting portion disposed on a second surface of the interposer body opposing the first surface, and a side connection portion disposed on the first and second surfaces and a side surface of the interposer to connect the connection portion and the mounting portion. The side connection portion includes a cutting portion.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes, first and second external electrodes disposed on first and second external surfaces of the ceramic body, and an interposer including an insulating body and first and second terminal electrodes. (B1+B2)/2 is greater than or equal to 10 micrometers (?m) and less than C/2, and C is greater than (B1+B2) and less than or equal to 80 ?m, in which B1 is a thickness of an upper portion, of each of the first and second terminal electrodes, disposed above the insulating body, B2 is a thickness of a lower portion, of each of the first and second terminal electrodes, disposed below the insulating body, and C is a thickness of the interposer.

Abstract: An electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed in a width direction. The capacitor body has first to sixth surfaces, the first and second internal electrodes being exposed through the third and fourth surfaces, respectively. First and second external electrodes are disposed on the third and fourth surfaces and extend to portions of the first surface. A first connection terminal and a second connection terminal are disposed to be respectively connected to be connected to the first and second external electrodes, and each has a shape including at least one indentation in a rectangular outline within which the respective connection terminal is inscribed.

Abstract: A coil component includes a body including first, second, third and fourth coils and including a first end surface and a second end surface opposed in a first direction, a first side surface and a second side surface opposing each other in a second direction, and an upper surface and a lower surface opposing each other in a third direction and a plurality of external electrodes disposed on the body and connected to the first to fourth coils. A first group including the first and second coils is arranged in point symmetry with respect to a second group including the third and fourth coils about a center between the first and second groups.

Abstract: A multilayer common mode filter includes: a body including a coil part having a plurality of spiral coils, wherein the coil part has one lead portion connected to one of external electrodes disposed on the body and one or more dummy lead portions each connected to the other external electrodes, and the lead portion is connected to dummy lead portions of other coil layers stacked in a thickness direction in series. Therefore, even though the common mode filter is miniaturized, the common mode filter may secure predetermined levels or more of performance and reliability.

Abstract: A multilayer capacitor in which acoustic noise is reduced has an area of overlap between internal electrodes in an active region of a lower portion of a capacitor body that is smaller than an area of overlap between internal electrodes in an active region of an upper portion of the capacitor body. The multilayer capacitor can be bonded to a board by relatively small solders such that the lower portion is adjacent the board. Deviations between areas of overlap of adjacent internal electrodes in the upper and lower portions of the active region are minimized to reduce piezoelectric deformation of the capacitor body.

Abstract: An inductor according to an aspect of the present disclosure is an inductor array comprising a plurality of wire-wound type coils. The inductor array comprises a body comprising a first wire-wound type coil, a second wire-wound type coil, a fixation member, and a sealing material sealing the first wire-wound type coil, the second wire-wound type coil, and the fixation member, and comprising magnetic materials; and external electrodes arranged on an external surface of the body. The fixation member comprises a support portion and a core portion passing through the support portion. The first and second wire-wound type coils are arranged to be spaced apart from each other by the fixation member. The fixation member comprises magnetic materials.

Abstract: An inductor includes a body including a support member having a first through-hole, a second through-hole, a first via-hole and a second via-hole, the first and second via-holes being spaced apart from the first and second through-holes, a first coil unit and a second coil unit disposed on one surface of the support member, a third coil unit and a fourth coil unit facing the one surface of the support member, and an encapsulant encapsulating the support member and the first to fourth coil units and including a magnetic material, and a first external electrode to a fourth external electrode respectively connected to the first to fourth coil units on an external surface of the body. The encapsulant includes a first encapsulant and a second encapsulant having magnetic permeability different from each other.

Abstract: A common mode filter includes a body portion including an external electrode disposed outwardly of the body portion, a plurality of coil electrode layers disposed within the body portion and electrically connected to the external electrode, and a shunt electrode layer disposed between portions of the plurality of coil electrode layers and having a coil shape.

Abstract: An inductor array includes a body including at least three coils and external electrodes arranged on external surfaces of the body. The at least three coils are arranged to be spaced apart from each other by a predetermined distance in one direction of the body, and here, the at least three coils have the same characteristic value. A minimum distance between mutually adjacent coils among the at least three coils is changed according to the number of turns of a coil pattern included in an area formed between the centers of cores of mutually adjacent coils.

Abstract: A thin film-type inductor includes a body having a coil, and a first external electrode and a second external electrode. The first and second external electrodes are each disposed on an external surface of the body. The coil includes a coil body and a via portion. The via portion is directly connected to the first external electrode. The coil body includes a base conductor layer in a lower portion and a plating layer in an upper portion.

Abstract: A common mode filter includes a body portion including a plurality of external electrodes disposed externally on the body portion, a first filter portion disposed within the body portion and including a plurality of coil electrode layers, and a second filter portion disposed within the body portion and including a plurality of coil electrode layers. The first filter portion and the second filter portion are connected to each other in series, and an area of the plurality of coil electrode layers of the first filter portion and an area of the plurality of coil electrode layers of the second filter portion are different from each other.

Abstract: A coil component includes a magnetic body having a plurality of filter parts disposed on a substrate and spaced apart from each other in a thickness direction. A plurality of input terminals and output terminals are disposed on outer surfaces of the magnetic body. Each of the filter parts includes upper and lower coils disposed in the magnetic body and spaced apart from each other in the thickness direction. In one example, a number of turns of the upper and lower coils of one filter part is different from a number of turns of the upper and lower coils of another filter part adjacent thereto. In another example, the number of turns of the upper and lower coils of the one and the other filter parts are the same, but capacitances of the one and the other filter parts are different.

Abstract: Disclosed herein is a common mode filter including: at least four coil layers, each layer having a primary coil and a secondary coil; and discontinuous parts made of an insulating material each extending between starting points of each of the primary coil and the secondary coil positioned on the lowest layer among the coil layers to ending points of each of the primary coil and the secondary coil positioned on the highest layer among the coil layers. The primary coils are connected in series from the lowest layer to the highest layer, and the secondary coils are connected in series from the lowest layer to the highest layer. The common mode filter is able to be miniaturized and has improved impedance characteristics.

Abstract: A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.

Abstract: A coil component includes a magnetic substrate, an insulating layer provided on the magnetic substrate and having conductive coils formed in the insulating layer, and a reinforcing layer provided on the insulating layer and having a coefficient of thermal expansion lower than a coefficient of thermal expansion of the insulating layer. High attenuation characteristics and mountability of a coil component may be improved and the deviation of the coefficient of thermal expansion between the components may be alleviated.

Abstract: A common mode filter includes a coil part in which a plurality of insulating layers having coils formed on one surfaces thereof and containing fillers are stacked; a first cover part disposed beneath the coil part; and a second cover part disposed on the coil part, wherein surface reforming layers improving close adhesion between the insulating layers are formed on at least one surfaces of the insulating layers.

Abstract: An inductor array component includes a body including a plurality of coil portions a coil included in the coil portions, external electrodes connected to both end portions of the coil and disposed on an outer surface of the body, a first blocking layer disposed between the coil portions, and a second blocking layer disposed within the first blocking layer.