Abstract: A common mode filter in which at least one surface of all of external electrodes and ground electrodes are exposed to a first surface, at least one side of each of two of the external electrodes and at least one side of one of the ground electrodes contact a first side of the first surface, and at least one side of each of the external electrodes and the ground electrodes of which sides do not contact the first side contact a second side of the first surface, thereby making it possible to improve sticking strength and decrease a short-circuit phenomenon occurrence rate.

Abstract: A common mode filter includes a first filter and a second filter formed by a magnetic coupling between primary coils and secondary coils, respectively, and connected in series. In the common mode filter, a resonance frequency f1 of the first filter and a resonance frequency f2 of the second filter are different from each other.

Abstract: A method of manufacturing a coil component includes preparing a coil unit including a coil surrounded by an insulating film. The coil unit further has a through hole in a center thereof and has a first surface and a second surface opposing each other. A first magnetic sheet and a second magnetic sheet containing magnetic particles are prepared, and the first magnetic sheet is pressed onto the first surface of the coil unit to cause the first magnetic sheet to fill the through hole therewith. The second magnetic sheet is pressed onto the second surface of the coil unit. The second magnetic sheet may be pressed onto a portion of the first magnetic sheet that extends through the through hole and outwardly from the second surface of the coil unit.

Abstract: A coil component includes a coil part having a through hole in a center, including a coil covered by an insulating film, and having a first surface and a second surface opposing each other, a core disposed in the through hole and including a nonmagnetic layer, and cover portions disposed on the first surface and the second surface of the coil part.

Abstract: A common mode filter includes a lower cover layer including a first magnetic particle, a filter layer disposed on an upper surface of the lower cover layer, and including a coil portion including a plurality of coils and a coil peripheral portion including a second magnetic particle, and an upper cover layer disposed on an upper surface of the filter layer and including the first magnetic particle.

Abstract: A coil component capable of matching characteristic impedance (Zo) includes an insulating layer in which coil conductors are embedded; a first magnetic member disposed to be in contact with one surface of the insulating layer; and a second magnetic member having permeability lower than that of the first magnetic member and disposed to be in contact with the other surface of the insulating layer. An interval L1 between the second magnetic member and the coil conductors depends on an intended impedance value.

Abstract: A common mode filter includes a body portion including a plurality of external electrodes disposed externally on the body portion, a first filter portion disposed within the body portion and including a plurality of coil electrode layers, and a second filter portion disposed within the body portion and including a plurality of coil electrode layers. The first filter portion and the second filter portion are connected to each other in series, and an area of the plurality of coil electrode layers of the first filter portion and an area of the plurality of coil electrode layers of the second filter portion are different from each other.

Abstract: A common mode filter includes a body portion including an external electrode disposed outwardly of the body portion, a plurality of coil electrode layers disposed within the body portion and electrically connected to the external electrode, and a shunt electrode layer disposed between portions of the plurality of coil electrode layers and having a coil shape.

Abstract: A coil component includes an insulating layer in which coil conductors are embedded, and a magnetic member disposed on one surface of the insulating layer and having a magnetic core protruding therefrom. The magnetic core is inserted into the insulating layer and has a width which is increased toward a lower portion thereof.

Abstract: A multilayer common mode filter includes: a body including a coil part having a plurality of spiral coils, wherein the coil part has one lead portion connected to one of external electrodes disposed on the body and one or more dummy lead portions each connected to the other external electrodes, and the lead portion is connected to dummy lead portions of other coil layers stacked in a thickness direction in series. Therefore, even though the common mode filter is miniaturized, the common mode filter may secure predetermined levels or more of performance and reliability.

Abstract: Disclosed are a common mode filter and a manufacturing method thereof. The common mode filter in accordance with an aspect of the present invention includes: a substrate; a filter layer including a coil and a dielectric layer and disposed on the substrate and configured to remove a signal noise; and a magnetic layer being laminated on the filter layer, and a surface of the filter layer being joined with the magnetic layer can be formed to be flat by having the coil embedded in a surface of the filter layer being joined with the magnetic layer in such a way that one surface of the coil is exposed.

Abstract: A common mode filter includes: a coil part including a plurality of coil layers, each coil layer having at least one coil and a lead terminal connected to a first end of the coil, and a conductive via connecting the lead terminals to each other; a first magnetic layer disposed on the coil part; a second magnetic layer disposed below the coil part; and external electrodes connected to the lead terminals and exposed to the surface of the common mode filter.

Abstract: Disclosed herein are a thin film common mode filter and a method of manufacturing the same. The thin film common mode filter according to the exemplary embodiment of the present invention includes a magnetic substrate made of a magnetic ceramic material; and coil patterns formed on the magnetic substrate, wherein external electrodes connected with the coil patterns are sequentially stacked and insulating layers formed on and beneath the coil pattern are made of a composite of ferrite powder and thermosetting resin.

Abstract: A coil component includes a magnetic body having a plurality of filter parts disposed on a substrate and spaced apart from each other in a thickness direction. A plurality of input terminals and output terminals are disposed on outer surfaces of the magnetic body. Each of the filter parts includes upper and lower coils disposed in the magnetic body and spaced apart from each other in the thickness direction. In one example, a number of turns of the upper and lower coils of one filter part is different from a number of turns of the upper and lower coils of another filter part adjacent thereto. In another example, the number of turns of the upper and lower coils of the one and the other filter parts are the same, but capacitances of the one and the other filter parts are different.

Abstract: A common mode filter includes a first filter and a second filter formed by a magnetic coupling between primary coils and secondary coils, respectively, and connected in series. In the common mode filter, a resonance frequency f1 of the first filter and a resonance frequency f2 of the second filter are different from each other.

Abstract: Disclosed herein is a common mode filter, including: first and second coil layers electromagnetically coupled to each other; a pair of external terminals connected to ends of the first coil layer and a pair of external terminals connected to ends of the second coil layer; a first ESD prevention member connecting between the pair of external terminals carrying electric current with the first coil layer and a second ESD prevention member connecting between the pair of external terminals carrying electric current with the second coil layer; and a ground electrode connecting the first ESD prevention member to the second ESD prevention member, wherein the ground electrode has a stepped portion formed at the center.

Abstract: The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.

Abstract: A coil component includes a magnetic substrate, an insulating layer provided on the magnetic substrate and having conductive coils formed in the insulating layer, and a reinforcing layer provided on the insulating layer and having a coefficient of thermal expansion lower than a coefficient of thermal expansion of the insulating layer. High attenuation characteristics and mountability of a coil component may be improved and the deviation of the coefficient of thermal expansion between the components may be alleviated.

Abstract: A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.

Abstract: A common mode filter includes external electrodes formed by printing and curing a conductive paste. The external electrodes of a multilayer structure having a lower electrode layer are formed by curing the conductive paste and an upper electrode layer formed of a solder.