Abstract: A coil component includes a magnetic substrate, an insulating layer provided on the magnetic substrate and having conductive coils formed in the insulating layer, and a reinforcing layer provided on the insulating layer and having a coefficient of thermal expansion lower than a coefficient of thermal expansion of the insulating layer. High attenuation characteristics and mountability of a coil component may be improved and the deviation of the coefficient of thermal expansion between the components may be alleviated.

Abstract: A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.

Abstract: A coil component capable of matching characteristic impedance (Zo) includes an insulating layer in which coil conductors are embedded; a first magnetic member disposed to be in contact with one surface of the insulating layer; and a second magnetic member having permeability lower than that of the first magnetic member and disposed to be in contact with the other surface of the insulating layer. An interval L1 between the second magnetic member and the coil conductors depends on an intended impedance value.

Abstract: A common mode filter includes external electrodes formed by printing and curing a conductive paste. The external electrodes of a multilayer structure having a lower electrode layer are formed by curing the conductive paste and an upper electrode layer formed of a solder.

Abstract: A common mode filter includes a coil part in which a plurality of insulating layers having coils formed on one surfaces thereof and containing fillers are stacked; a first cover part disposed beneath the coil part; and a second cover part disposed on the coil part, wherein surface reforming layers improving close adhesion between the insulating layers are formed on at least one surfaces of the insulating layers.

Abstract: A coil component includes an insulating layer in which coil conductors are embedded, and a magnetic member disposed on one surface of the insulating layer and having a magnetic core protruding therefrom. The magnetic core is inserted into the insulating layer and has a width which is increased toward a lower portion thereof.

Abstract: Disclosed herein is a coil component capable of being protected from static electricity without loss of a main magnetic flux loop. The coil component includes: a magnetic substrate; a coil layer disposed on the magnetic substrate and having conductor patterns installed therein; and an electrostatic discharge (ESD) protecting layer disposed on the coil layer and discharging static electricity introduced into the conductor patterns.

Abstract: Disclosed herein is a common mode filter in order to improve attenuation of the common mode filter, the common mode filter including: a support substrate; an insulation layer provided on the support substrate and including a coil pattern formed therein; and a non-magnetic dielectric body provided on the insulation layer.

Abstract: A common mode filter and a method of manufacturing the same are disclosed. The common mode filter in accordance with an aspect of the present invention includes: a substrate; a filter layer comprising a coil and an insulation layer and formed on the substrate to remove a signal noise; a magnetic compound layer laminated on the filter layer; an electrostatic electrode pattern formed on the magnetic compound layer to remove static electricity and having one portion thereof exposed to a lateral surface of the magnetic compound layer; a sealing layer laminated on the electrostatic electrode pattern so as to seal the electrostatic electrode pattern; and a lateral surface electrode connected with the exposed portion of the electrostatic electrode pattern and formed in a longitudinal direction between the sealing layer and the substrate.

Abstract: A common mode filter and a manufacturing method thereof are disclosed.

Abstract: Disclosed herein are a common mode filter capable of implementing high inductance without deterioration of a moisture resistance load, and a method of manufacturing the same. The common mode filter includes: a magnetic substrate; an insulating layer disposed on the magnetic substrate; and a coil electrode layer disposed in the insulating layer, wherein the magnetic substrate has a groove part formed at an edge of an upper surface thereof, and a material of the insulating layer is filled into the groove part.

Abstract: A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a coil pattern formed on the magnetic substrate; a dielectric layer formed on the magnetic substrate so as to cover an upper part, a lower part and a side surface of the coil pattern; and a first coupling agent interposed between the magnetic substrate and the dielectric layer so as to prevent the magnetic substrate and the dielectric layer from being separated.

Abstract: A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a dielectric layer laminated on the magnetic substrate; an external electrode formed on the dielectric layer in such a way that one surface thereof is exposed to an outside; a conductive pattern formed on a surface of the dielectric layer so as to be located on a same plane as the external electrode and having one end thereof connected with the external electrode; an insulator film formed on a surface of the conductive pattern; and a magnetic layer formed on the insulator film so as to cover an upper surface and a lateral surface of the conductive pattern.

Abstract: A common mode filter is disclosed. The common mode filter provided by the present invention includes: a magnetic substrate; a coil layer formed on the magnetic substrate and including a coil pattern; an external electrode formed on the coil layer so as to be electrically connected with the coil pattern; a ground electrode formed on the coil layer and configured to discharge static electricity brought in to the external electrode; a post formed on each of the external electrode and the ground electrode; and an electrostatic discharge member formed between the external electrode and the ground electrode so as to cover a side surface of the post and configured to discharge static electricity brought in to the external electrode to the ground electrode.

Abstract: The present invention discloses a filter for removing noise, which includes: a lower magnetic body; an insulating layer disposed on the lower magnetic body and including at least one conductor pattern; input and output stud terminals electrically connected to the conductor pattern for electrical input and output of the conductor pattern; and an upper magnetic body consisting of an inner upper magnetic body including ferrite powder with a size corresponding to the interval between the input and output stud terminals and an outer upper magnetic body including ferrite powder with a size corresponding to the interval between the input and output stud terminals and an outer surface of the lower magnetic body. According to the present invention, it is possible to implement a coil part with high performance and characteristics by increasing permeability and improving impedance characteristics through simple structure and process.

Abstract: An electronic component including a substrate, an insulating unit provided on the substrate, and a conductor coil provided within the insulating unit, wherein a distance from the outermost portion of the conductor coil in one axial direction to the outermost portion of the substrate in one axial direction is greater than 0.0125 times a length of the substrate in one axial direction, thus having enhanced reliability.

Abstract: Disclosed are a common mode filter and a manufacturing method thereof. The common mode filter in accordance with an aspect of the present invention includes: a substrate; a filter layer including a coil and a dielectric layer and disposed on the substrate and configured to remove a signal noise; and a magnetic layer being laminated on the filter layer, and a surface of the filter layer being joined with the magnetic layer can be formed to be flat by having the coil embedded in a surface of the filter layer being joined with the magnetic layer in such a way that one surface of the coil is exposed.

Abstract: Disclosed herein is a common mode filter including: at least four coil layers having a primary coil and a secondary coil; and discontinuous parts each connecting starting points of each of the primary coil and the secondary coil positioned on the lowest layer among the coil layer to ending points of each of the primary coil and the secondary coil positioned on the highest layer among the coil layers with each other in series. The common mode filter is able to be miniaturized and to improve impedance characteristics.

Abstract: The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.

Abstract: Disclosed herein is a common mode filter having improved insertion loss characteristics. The common mode filter includes: first and second coil electrode patterns formed at an upper layer and alternately disposed; and first and second coil electrode patterns formed at a lower layer and alternately disposed, wherein the outermost pattern of the upper layer and the outermost pattern of the lower layer are coil electrode patterns having the same order.