Patents by Inventor Won-Chul Sim
Won-Chul Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140062633Abstract: Disclosed herein is a coil component including: an electrode structure made of an insulating material and including at least two internal electrodes vertically disposed therein in a height direction and having a coil shape; and external electrode terminals provided on an upper surface of the electrode structure, wherein a vertical distance (d3) between the internal electrodes is larger than a horizontal distance (d1) between the internal electrodes, in order to secure impedance capacity of a predetermined level and increase a cut-off frequency.Type: ApplicationFiled: March 11, 2013Publication date: March 6, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Chul Sim, Sung Kwon Wi, Young Ghyu Ahn, Young Seuck Yoo
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Publication number: 20140043129Abstract: Disclosed herein are an inductor element and a manufacturing method thereof. The inductor element includes: an electrode body formed of insulating material and having an internal electrode having a coil shape disposed therein; and external terminals formed on a part of the electrode body and each connected with both ends of the internal electrode, wherein electrode body is formed and separated on a base substrate, whereby a size of the inductor element is reduced.Type: ApplicationFiled: March 14, 2013Publication date: February 13, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Kwon WI, Won Chul SIM, Young Do KWEON, Young Seuck YOO
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Patent number: 8622520Abstract: Disclosed herein is an ejecting apparatus including: an upper body which includes an inlet through which ejectable fluid flows in from an external source, a channel which fluidly communicates with the inlet and through which the ejectable fluid flows, and an upper mounting portion which fluidly communicates with the channel and is opened downwardly; a lower body which includes a lower mounting portion which is opened upwardly to correspond to the upper mounting portion, and a nozzle slit which fluidly communicates with the lower mounting portion to eject the ejectable fluid to an outside, the lower body being fastened to the upper body, and a nozzle chip which is interposed between the upper mounting portion and the lower mounting portion to receive the ejectable fluid from the channel and discharge the ejectable fluid into the nozzle slit by being driven by an actuator.Type: GrantFiled: June 25, 2012Date of Patent: January 7, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyun Ho Shin, Byung Hun Kim, Jong Beom Kim, Jae Chang Lee, Won Chul Sim
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Publication number: 20130335871Abstract: Disclosed herein are an electrostatic discharge protection device including: a substrate; a pair of electrodes formed on the substrate so as to be spaced apart from each other; and an insulating layer formed on the electrodes, wherein each of the electrodes has a shape in which it protrudes from a cross section thereof toward a surface thereof, and a manufacturing method thereof, and a composite electronic component including the same.Type: ApplicationFiled: March 15, 2013Publication date: December 19, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Moon LEE, Sung Kwon WI, Ju Hwan YANG, Won Chul SIM, Young Do KWEON
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Publication number: 20130300527Abstract: The present invention relates to a method of manufacturing a coil element and a coil element, which include a process of forming, aligning, and coupling a first auxiliary layer and a second auxiliary layer of which coil portions formed of a plating pattern are disposed on a substrate or an insulating layer, and it is possible to overcome limitations due to collapse or deformation of a photoresist pattern even when forming a fine-pitch fine conductor coil with a high aspect ratio by applying a plating method using a photoresist pattern.Type: ApplicationFiled: March 13, 2013Publication date: November 14, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Suk KIM, Sung Kwon WI, Ju Hwan YANG, Won Chul SIM, Jeong Bok KWAK, Jeong Min CHO, Young Seuck YOO, Sang Moon LEE
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Publication number: 20130241684Abstract: Disclosed herein are a method for manufacturing common mode filter and a common mode filter. The method includes: performing electroplating on first coil patterns made of a conductive material to form second coil patterns having a cross-sectional area increased as compared to the first coil patterns. Therefore, the common mode filter fulfilling a miniaturization demand and having the improved characteristics such as the inductance, the DC resistance, and the like, may be implemented.Type: ApplicationFiled: March 4, 2013Publication date: September 19, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Hwan YANG, Won Chul SIM, Young Seuck YOO, Sung Kwon WI
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Publication number: 20130234819Abstract: The present invention relates to a common mode filter and a method of manufacturing the same and provides a thin film type common mode filter including: a first magnetic substrate; a first laminate disposed on the first magnetic substrate and including a primary coil pattern electrode; a core magnetic layer disposed on the first laminate; a second laminate disposed on the core magnetic layer and including a secondary coil pattern electrode; and a second magnetic substrate disposed on the second laminate.Type: ApplicationFiled: February 13, 2013Publication date: September 12, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Seuck YOO, Sung Kwon WI, Jong Yun LEE, Sang Moon LEE, Won Chul SIM, Jeong Bok KWAK, Kang Heon HUR, Yong Suk KIM
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Publication number: 20130234820Abstract: Disclosed herein are a common mode filter and a fabrication method thereof. The common mode filter includes: a first magnetic substrate; a laminate including insulating sheets with coil pattern electrodes printed thereon, having holes therein, and provided on the first magnetic substrate; a magnetic core inserted into the hole; and a second magnetic substrate integrally formed with the magnetic core and provided on the laminate.Type: ApplicationFiled: February 26, 2013Publication date: September 12, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Seuck YOO, Sung Kwon WI, Jong Yun LEE, Sang Moon LEE, Won Chul SIM, Jeong Bok KWAK, Kang Heon HUR, Yong Suk KIM
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Publication number: 20130169381Abstract: The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.Type: ApplicationFiled: March 23, 2012Publication date: July 4, 2013Inventors: Yong Suk KIM, Sung Kwon Wi, Jeong Bok Kwak, Sang Moon Lee, Won Chul Sim, Young Seuck Yoo
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Publication number: 20130162371Abstract: The present invention discloses a filter for removing noise, which includes: a lower magnetic body; an insulating layer provided on the lower magnetic body and including at least one conductor pattern; and an upper magnetic body including a primary ferrite composite provided on the insulating layer and a secondary ferrite composite provided on the primary ferrite composite to cover a pore formed on a surface of the primary ferrite composite, and a method of manufacturing the same. According to the present invention, it is possible to implement a filter for removing noise with high performance and characteristics by increasing magnetic permeability and improving impedance characteristics through simple structure and process.Type: ApplicationFiled: March 22, 2012Publication date: June 27, 2013Inventors: Sang Moon Lee, Sung Kwon WI, Jeong Bok KWAK, Won Chul SIM, Young Seuck YOO, Yong Suk KIM
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Patent number: 8394281Abstract: A method of manufacturing an inkjet head includes: forming an inlet and a pressure chamber in an upper substrate, the inlet penetrating the upper substrate and providing a passage for an inflow of ink, and the pressure chamber formed as a recess in one side of the upper substrate; forming a manifold and an ink channel in a middle substrate, the manifold configured to be connected with the inlet, and the ink channel penetrating the middle substrate and configured to be connected with the pressure chamber; forming a straight portion and a nozzle in a plate substrate, the straight portion configured to be connected with the ink channel, and the nozzle connected with the straight portion; forming a hydrophobic layer on one side of the plate substrate, the hydrophobic layer having a window formed therein, and the window opening the nozzle by a circumference greater than a circumference of an end of the nozzle; and stacking in order and attaching the upper substrate, the middle substrate, and the plate substrate.Type: GrantFiled: October 22, 2010Date of Patent: March 12, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Won-Chul Sim, Jae-Woo Joung, Young-Jae Kim
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Publication number: 20130027472Abstract: Disclosed herein is an ejecting apparatus including: an upper bezel which includes an inlet through which ejectable fluid flows in from an external source, a channel which fluidly communicates with the inlet and through which the ejectable fluid flows, and an upper mounting portion which fluidly communicates with the channel and is opened downwardly; a lower bezel which includes a lower mounting portion which is opened upwardly to correspond to the upper mounting portion, and a nozzle slit which fluidly communicates with the lower mounting portion to eject the ejectable fluid to an outside, the lower bezel being fastened to the upper bezel, and a nozzle chip which is interposed between the upper mounting portion and the lower mounting portion to receive the ejectable fluid from the channel and discharge the ejectable fluid into the nozzle slit by being driven by an actuator.Type: ApplicationFiled: June 25, 2012Publication date: January 31, 2013Inventors: Hyun Ho Shin, Byung Hun Kim, Jong Beom Kim, Jae Chang Lee, Won Chul Sim
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Publication number: 20120105543Abstract: There are provided an inkjet head package, an apparatus and a method for assembling the same. The inkjet head package may include a plurality of inkjet heads each having an ink channel so as to eject ink through a plurality of nozzles formed on one surface thereof, and a frame having one surface to which another surface of the plurality of inkjet heads is fixed while facing the one surface thereof, the frame including an opening for exposing a portion of the another surface disposed therein.Type: ApplicationFiled: April 29, 2011Publication date: May 3, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Won Chul Sim, Jae Woo Joung, Yong Sik Kim
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Patent number: 8123340Abstract: Disclosed is an inkjet printer. The inkjet printer in accordance with an embodiment of the present invention includes a supply channel coupled to a plurality of inkjet heads; a first main reservoir and a second main reservoir being coupled to either side of the supply channel; and a first press and a second press applying pressure to the inside of the first main reservoir and the second main reservoir, respectively.Type: GrantFiled: May 5, 2009Date of Patent: February 28, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yoon-Sok Park, Jae-Woo Joung, Young-Seuck Yoo, Suk-Ho Song, Won-Chul Sim
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Publication number: 20110285782Abstract: There is provided an apparatus for cleaning an inkjet print head and an inkjet printer having the same. The apparatus for cleaning the inkjet print head includes a cleaning plate spaced apart from the inkjet print head with a cleaning area interposed therebetween, the inkjet print head ejecting ink through a nozzle; an electrode part allowing residual ink remaining at an end portion of the nozzle to be moved outwardly of the cleaning plate; and a power supply part electrically connecting the inkjet print head to the electrode part.Type: ApplicationFiled: February 3, 2011Publication date: November 24, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Won Chul Sim, Sung Koo Kang, Jae Woo Joung
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Publication number: 20110234712Abstract: Provided is an inkjet head assembly capable of reducing the generation of air bubbles during ink injection by using a guide formed inside an ink tank. The inkjet head assembly includes an ink tank including an ink inlet through which ink is injected from the outside, and storing ink injected through the ink inlet, an inkjet head connected with the ink tank through an ink supply channel, receiving ink from the ink tank and discharging the received ink, and a guide disposed inside the ink tank and guiding ink, injected through the ink inlet, to an inner surface of the ink tank.Type: ApplicationFiled: December 1, 2010Publication date: September 29, 2011Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Hun Kim, Won Chul Sim, Young Seuck Yoo, Jae Woo Joung
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Publication number: 20110234657Abstract: There is provided an inkjet head assembly that can readily store ink by separating a passage for transferring ink from a passage for transferring ink between a first storage unit and a second storage unit inside an ink tank. An inkjet head assembly according to an aspect of the invention may include: an ink tank including a first storage unit receiving ink therein and a second storage unit receiving the ink from the first storage unit to maintain a full ink level within the ink, and having an ink transfer hole, through which the ink is supplied from the first storage unit to the second storage ink, and an air transfer hole, through which air from the second storage unit is transmitted to the first storage unit, between the first and second storage units; and an inkjet head connected to the second storage unit via an ink supply passage, the inkjet head receiving the ink from the second storage unit to eject the ink.Type: ApplicationFiled: December 1, 2010Publication date: September 29, 2011Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Hun Kim, Won Chul Sim, Young Seuck Yoo, Jae Woo Joung
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Publication number: 20110169895Abstract: There is provided an inkjet print head including an ink head and a chipping prevention portion. The ink head includes a nozzle for ejecting ink to the outside by a driving force of a piezoelectric actuator mounted on a surface of the ink head. The chipping prevention portion includes a cutting portion disposed at a side of the ink head and being cut so as to have a height lower than that of the nozzle.Type: ApplicationFiled: September 13, 2010Publication date: July 14, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hun Kim, Yun Sung Kang, Won Chul Sim, Ju Hwan Yang
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Patent number: 7950150Abstract: Disclosed is a method of manufacturing an inkjet head discharging ink. The method in accordance with an embodiment of the present invention can include: heating the inkjet head to a temperature over a melting point of a filler; filling the inkjet head with the filler such that a gap inside the inkjet head is filled with the filler; and discharging the filler out of the inkjet head such that the filler in the gap of the inkjet head remains.Type: GrantFiled: May 5, 2009Date of Patent: May 31, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Young-Seuck Yoo, Jae-Woo Joung, Sang-Jin Kim, Won-Chul Sim, Chang-Sung Park
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Publication number: 20110122207Abstract: An ink-jet head is disclosed. The ink-jet head in accordance with an embodiment of the present invention is equipped with a plurality of jetting cells, each of which ejects ink. Each of the plurality of jetting cells is connected to a common reservoir supplying the ink, and a pillar is formed inside the common reservoir, in which the pillar supports an upper surface of the common reservoir by being extended from a lower surface to the upper surface of the common reservoir and the pillar disperses a pressure wave transferred inside the common reservoir.Type: ApplicationFiled: April 22, 2010Publication date: May 26, 2011Inventors: Hyun-Ho SHIN, Chung-Mo Yang, Yoon-Sok Park, Suk-Ho Song, Chang-Sung Park, Won-Chul Sim