Patents by Inventor Won-jung Kim

Won-jung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12038134
    Abstract: The present invention discloses a knob cap for a high-pressure tank including a first knob cap portion having a coupling groove coupled to a knob of a liner of the high-pressure tank in a lower surface, including a peripheral wing portion extending outward to be in contact with a surface of the liner to outside of a lower portion, and having a column portion in the shape of a column extending upward in a center; and a second knob cap portion integrally coupled with the first knob cap portion, having the column portion of the first knob cap portion inserted into a hollow, and including a plurality of inner grooves in the shape of a column having an upper end opened outside of the hollow and extending downward.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: July 16, 2024
    Assignee: Lotte Chemical Corporation
    Inventors: Dae Gun Kim, Kyo Min Lee, Young Koan Ko, You Jung Lee, Won Young Kim
  • Publication number: 20240207788
    Abstract: The present disclosure is to provide a method of mounting a membrane filter and a microfluidic device including the membrane filter, which are capable of increasing a flow pressure of a fluid. A salt matrix is attached to a region of a surface of the membrane filter that adjoins the filter support structure and is exposed toward the movement passage. A membrane filter and a microfluidic device including the membrane filter, which are capable of increasing a flow pressure of a fluid.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 27, 2024
    Applicant: 1DROP INC.
    Inventors: Kyung Hak Kim, Won Jung Kim, So Hyeon Baek, Joo Won Rhee
  • Publication number: 20240174890
    Abstract: A CMP slurry composition for polishing tungsten and a method of polishing tungsten using the same, the composition includes a polar solvent or a nonpolar solvent; an abrasive agent; and a compound represented by Formula 3 or a complex thereof:
    Type: Application
    Filed: October 24, 2023
    Publication date: May 30, 2024
    Inventors: Keun Sam JANG, Won Jung KIM, Tae Won PARK, Ji Ho LEE, Eui Rang LEE, Jin Gyo KIM, Dong Hyeon LEE, Chang Suk LEE
  • Publication number: 20240117941
    Abstract: A hydrogen storage system is disclosed and includes a storage unit including a plurality of unit storage containers, in which metal hydride materials are respectively provided in an interior thereof and which are connected to each other in parallel, and a thermal fluid line defining a thermal fluid passage, which passes via the plurality of unit storage containers continuously and through which a thermal fluid flows for heating or cooling the unit storage containers, thereby enhancing a storage performance and an efficiency of the hydrogen.
    Type: Application
    Filed: March 10, 2023
    Publication date: April 11, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Ji Hye Park, Won Jung Kim, Kyung Moon Lee, Dong Hoon Nam, Young Jin Cho, Byeong Soo Shin, Ji Hoon Lee, Suk Hoon Hong, Hoon Mo Park, Yong Doo Son
  • Publication number: 20240117930
    Abstract: A hydrogen storage device includes a storage container having an accommodation space in an interior thereof, a first metal hydride material provided in the interior of the storage container and that stores hydrogen, and a second metal hydride material provided in the interior of the storage container and that stores the hydrogen at a pressure that is different from that of the first metal hydride material. An advantageous effect of restraining an excessive rise of a pressure of the storage container and enhancing safety and reliability may be obtained.
    Type: Application
    Filed: March 10, 2023
    Publication date: April 11, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Ji Hye Park, Won Jung Kim, Kyung Moon Lee, Dong Hoon Nam, Young Jin Cho, Byeong Soo Shin, Ji Hoon Lee, Suk Hoon Hong, Hoon Mo Park, Yong Doo Son
  • Publication number: 20230402633
    Abstract: A hydrogen supply system for a fuel cell and a control method thereof includes a fuel cell, a hydrogen supply line connected to an inlet side of an anode of the fuel cell and supplying hydrogen to the fuel cell, a hydrogen supply pressure sensor configured for measuring pressure of the hydrogen supply line, and a controller electrically connected to the hydrogen supply pressure sensor and configured for deriving a correction value of the hydrogen supply pressure sensor, supplying hydrogen after air supply is cut off during an operation of the fuel cell, measuring a pressure variation of the hydrogen supply line, and determining whether to use a correction value of the hydrogen supply pressure sensor based on the measured pressure variation.
    Type: Application
    Filed: October 26, 2022
    Publication date: December 14, 2023
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Hyo Jin PARK, Won Jung Kim, Jae Young Shim, Min Taek Kim
  • Publication number: 20230290965
    Abstract: A fuel cell cooling system may include a fuel cell module including a fuel cell stack, a cooling module that includes a cooling tower in which cooling fluid is accommodated and adjusts a temperature of the fuel cell module, a heat exchanger that exchanges heat between first circulation cooling water circulating in the fuel cell module and second circulation cooling water circulating in the cooling tower, and a condensate supply line connected to the cooling tower to supply, to the cooling tower, water generated in a power generation process of the fuel cell module.
    Type: Application
    Filed: August 15, 2022
    Publication date: September 14, 2023
    Inventors: Hyun Bae Dong, Won Jung Kim, Ju Hae Jung
  • Patent number: 11735702
    Abstract: A light-emitting element package according to an embodiment comprises: a body comprising a cavity; the cavity; a first frame and a second frame arranged on the bottom surface of the cavity; a first metal layer disposed on the first frame; an ultraviolet light-emitting element disposed on the first metal layer; and a second metal layer disposed on the second frame and electrically connected to the second frame, wherein the body comprises a separation portion between the first frame and the second frame, the second metal layer extends over the sloping surface of the cavity and the separation portion of the body, and the second metal layer is spaced apart from the first metal layer in the cavity and surrounds the first metal layer.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: August 22, 2023
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Won Jung Kim, June O Song, Yeong June Lee
  • Publication number: 20230133428
    Abstract: A device for controlling a line connection type fuel cell system and a method for the same are provided. The device for controlling a line connection type fuel cell system includes a plurality of fuel cell modules, an Alternating Current (AC) voltage generator, and a controller to activate the AC voltage generator to generate an AC voltage corresponding to power supplied from a system, and to control the plurality of fuel cell modules to generate a current in synchronization with the AC voltage.
    Type: Application
    Filed: August 20, 2022
    Publication date: May 4, 2023
    Inventors: Yong Doo Son, Jung Tak Kang, Won Jung Kim, Jun Seok Seo
  • Patent number: 11560495
    Abstract: A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the composition including a solvent, the solvent including a polar solvent or a non-polar solvent; an abrasive agent; and an oxidizing agent, wherein the abrasive agent includes silica modified with an amino silane that includes three nitrogen atoms.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: January 24, 2023
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Won Jung Kim, Yoon Young Koo, Tae Won Park, Eui Rang Lee, Jong Won Lee, Youn Jin Cho
  • Patent number: 11515551
    Abstract: A fuel cell recovery control system and method are provided to supply hydrogen to the cathode of a fuel cell stack to remove an oxide film formed on a platinum surface of the cathode. The performance of the fuel cell stack is recovered in accordance with the oxide film removal. In addition, electric power generated during the performance recovery of the fuel cell stack is consumed in an inverter and, as such, overcharge of a battery is prevented.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: November 29, 2022
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Hyun Bae Dong, Won Jung Kim, Yong Doo Son
  • Publication number: 20220302363
    Abstract: A light emitting device package including first and second frames spaced apart from each other; a body disposed between the first and second frames, the body including a cavity having a side surface; and a light emitting device disposed in the cavity. Further, the side surface of the cavity includes a first side portion spaced from the light emitting device and disposed around the light emitting device, a groove portion disposed around the first side portion, and a second side portion disposed around the groove portion.
    Type: Application
    Filed: May 16, 2022
    Publication date: September 22, 2022
    Applicant: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Young Shin KIM, June O. SONG, Chang Man LIM, Won Jung KIM, Ki Seok KIM
  • Patent number: 11404618
    Abstract: A light-emitting device package according to one embodiment comprises: a body including a through-hole formed in an upper surface and a lower surface; a light-emitting device arranged on the upper surface of the body and including first and second bonding units spaced apart from each other; and first and second metal units arranged so as to be spaced apart from each other on the rear surface of the body, wherein a partial area of each of the first and second bonding units overlaps with the through-hole in a vertical direction, the first and second metal units respectively includes first and second extension portions extending to the through-hole; the first and second extension portions is electrically connected to the first and second bonding units, respectively; and the first and second extension portions face each other within the through-hole.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: August 2, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Ki Seok Kim, Chang Man Lim, Won Jung Kim
  • Patent number: 11398589
    Abstract: The light emitting device package disclosed in the embodiment includes a first frame having a first through hole; a second frame having a second through hole; a body disposed between the first and second frames; and light emitting devices disposed on the first and second frames, wherein the first and second through holes have an area of a lower surface larger than an area of the upper surface, and centers of the upper and lower surfaces of the first through hole may be offset from each other in the vertical direction, and centers of the upper and lower surfaces of the second through hole may be offset from each other in the vertical direction.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: July 26, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Won Jung Kim, June O Song, Chang Man Lim, Ki Seok Kim
  • Patent number: 11374153
    Abstract: A light emitting device package according to an embodiment may include: a first frame including a first opening passing through upper and lower surfaces, and a second frame spaced apart from the first frame and including a second opening; first and second conductive layers disposed in the first and second openings, respectively; a body disposed between the first and second frames; a first resin disposed on the body; and a light emitting device disposed on the first resin. According to an embodiment, the light emitting device may include a first bonding part electrically connected with the first frame and a second bonding part spaced apart from the first bonding part and electrically connected with the second frame, and the first and second bonding parts may be disposed on the first and second openings, respectively.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: June 28, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: June O Song, Ki Seok Kim, Won Jung Kim
  • Patent number: 11367820
    Abstract: The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device including a first bonding portion and a second bonding portion on a lower portion thereof; and a first resin disposed between the body and the light emitting device, wherein the first frame includes a first protruding portion facing the first bonding portion of the light emitting device, and the second frame includes a second protruding portion facing the second bonding portion of the light emitting device, and including a first conductive layer between the first bonding portion and the first protruding portion and a second conductive layer between the second bonding portion and the second protruding portion.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: June 21, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Young Shin Kim, June O Song, Chang Man Lim, Won Jung Kim, Ki Seok Kim
  • Patent number: 11367809
    Abstract: Embodiments relate to a light emitting device package and a light source device. A light emitting device package according to the embodiment may include a first package body; a second package body disposed on the first package body, and comprising an opening passing through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and comprising a first bonding part and a second bonding part. The first package body may include a first opening and a second opening that pass through an upper surface and a lower surface of the first package body. The upper surface of the first package body may be coupled with the lower surface of the second package body, the first bonding part may be disposed on the first opening, and the second bonding part may be disposed on the second opening.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: June 21, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Ki Seok Kim, Won Jung Kim, June O Song, Chang Man Lim
  • Patent number: 11355679
    Abstract: The light emitting device package disclosed in the embodiment includes a package body including first and second frames, and a first body disposed between the first and second frames; a second body disposed on the package body and including a cavity and a sub-cavity spaced apart from the cavity; a light emitting device disposed in the cavity and including first and second bonding portions; and a protection device disposed in the sub-cavity, wherein the package body and the second body may be coupled to an adhesive member.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: June 7, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Won Jung Kim, Ki Seok Kim, June O Song, Chang Man Lim
  • Patent number: 11342486
    Abstract: A light emitting device package disclosed in an embodiment of the invention includes a substrate including first and second frames; a light emitting device including a first bonding portion facing the first frame and a second bonding portion facing the second frame; a phosphor layer on the light emitting device; a first resin disposed around the upper surface of the substrate and the light emitting device; a second resin between the first resin and side surfaces of the light emitting device; and an adhesive layer between the phosphor layer and the light emitting device, wherein the adhesive layer includes a thickness thinner than a thickness of the phosphor layer, and the first resin comprises a reflective resin material and is disposed on the side surface of the phosphor layer. The second resin may include a transparent resin material, and the second resin may include a curved surface with an outer surface facing the first resin.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: May 24, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Ki Seok Kim, Jung Hwa Jung, Na Young Kim, Won Jung Kim, Suk Kyung Park, Sang Jun Lee, Nak Hun Kim, Chang Man Lim
  • Patent number: RE49146
    Abstract: An embodiment relates to a light emitting device package and a lighting apparatus having the same. According to the embodiment, a light emitting device package includes a first lead frame; a second lead frame spaced apart from the first lead frame; a body coupled to the first lead frame and the second lead frame and includes a first cavity which exposes a portion of the upper surface of the first lead frame, a second cavity which exposes a portion of the upper surface of the second lead frame, and a spacer which is disposed between the first lead frame and the second frame; at least one light emitting device disposed in the first cavity; and a protection device disposed in the second cavity. The second cavity is disposed on a first inside surface of the first cavity and the first inside surface is connected to an upper surface of the spacer, and an area of a bottom surface of the first cavity is equal to or less than 40% of entire area of the body.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: July 19, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Chang Man Lim, Won Jung Kim, Hyoung Jin Kim, Bong Kul Min, Ho Young Chung