Patents by Inventor Won-jung Kim
Won-jung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11342487Abstract: A light emitting device package according to an embodiment may comprise: a first package body including a first and a second opening; a light emitting device disposed on the first package body and including a first and a second bonding part; and a first resin disposed between the first package body and the light emitting device. The light emitting device may comprise one surface on which the first and second bonding parts are disposed, the first bonding part may comprise a first side surface and a lower surface facing the first package body, and the second bonding part may comprise a second side surface opposite to the first side surface, and a lower surface facing the first package body.Type: GrantFiled: September 14, 2018Date of Patent: May 24, 2022Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.Inventors: Won Jung Kim, Ki Seok Kim, June O Song, Chang Man Lim
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Patent number: 11342486Abstract: A light emitting device package disclosed in an embodiment of the invention includes a substrate including first and second frames; a light emitting device including a first bonding portion facing the first frame and a second bonding portion facing the second frame; a phosphor layer on the light emitting device; a first resin disposed around the upper surface of the substrate and the light emitting device; a second resin between the first resin and side surfaces of the light emitting device; and an adhesive layer between the phosphor layer and the light emitting device, wherein the adhesive layer includes a thickness thinner than a thickness of the phosphor layer, and the first resin comprises a reflective resin material and is disposed on the side surface of the phosphor layer. The second resin may include a transparent resin material, and the second resin may include a curved surface with an outer surface facing the first resin.Type: GrantFiled: October 31, 2018Date of Patent: May 24, 2022Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.Inventors: Ki Seok Kim, Jung Hwa Jung, Na Young Kim, Won Jung Kim, Suk Kyung Park, Sang Jun Lee, Nak Hun Kim, Chang Man Lim
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Patent number: 11322667Abstract: A semiconductor device package includes a light emitting device disposed on a body, and at least one resin disposed between the body and the light emitting device. The body may include first and second opening parts passing through the body from the upper surface of the body, and at least one recess concavely provided from the upper surface of the body towards the lower surface of the body. The light emitting device may include a first bonding part disposed on the first opening part, and a second bonding part disposed on the second opening part. The at least one recess may be disposed between the first and second opening parts, and along the circumferences of the first and second opening parts. The at least one resin may be provided to the at least one recess. The at least one resin may include a reflective material.Type: GrantFiled: September 20, 2018Date of Patent: May 3, 2022Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.Inventors: Chang Man Lim, June O Song, Won Jung Kim
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Patent number: 11309560Abstract: A method of predicting a life of a membrane electrode assembly (MEA) of a fuel cell for electric power generation includes: deriving an operating condition for accelerated degradation, which is applicable to the fuel cell; operating the fuel cell for a specific time under the derived operating condition for accelerated degradation and under a normal operating condition, and identifying the degree of degradation of the fuel cell under each of the operating conditions; calculating an acceleration multiple based on the degree of degradation identified under the operating condition for accelerated degradation and under the normal operating condition; and predicting the life of the membrane electrode assembly based on the acceleration multiple.Type: GrantFiled: March 20, 2020Date of Patent: April 19, 2022Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Hyun Bae Dong, Min Kyung Cho, Won Jung Kim, Ju Hae Jung, Jong Hyun Jang, Hyun Seo Park, Myung Su Lim, Jun Young Kim
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Publication number: 20220112401Abstract: A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the composition including a solvent; and an abrasive agent, wherein the abrasive agent includes silica modified with polyethyleneimine-derived aminosilane, and the composition has a pH of about 4 to about 7.Type: ApplicationFiled: September 20, 2021Publication date: April 14, 2022Inventors: Won Jung KIM, Yoon Young KOO, Hyeong Mook KIM, Tae Won PARK, Eui Rang LEE, Jong Won LEE, Youn Jin CHO
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Patent number: 11302846Abstract: A light emitting device package disclosed to an embodiment of the invention includes a body including an upper surface and a lower surface, the body including a first recess and a second recess concaved from the lower surface toward the upper surface; a light emitting device disposed on the body and including a first bonding portion and a second bonding portion; and first and second conductive portions respectively disposed in the first recess and the second recess, wherein the body includes a first through hole and a second through hole penetrating an upper surface of each of the first recess and the second recess and the upper surface of the body, and wherein each of the first and second conductive portions extends into the first and second through holes and is electrically connected to the first bonding portion and the second bonding portion, respectively.Type: GrantFiled: August 13, 2019Date of Patent: April 12, 2022Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.Inventors: Min Sik Kim, Won Jung Kim, Ki Seok Kim
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Publication number: 20220025214Abstract: A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the CMP slurry composition including a solvent, the solvent being a polar solvent or a non-polar solvent; an abrasive agent; and a biocide, wherein the abrasive agent includes silica modified with a silane containing two nitrogen atoms or silica modified with a silane containing three nitrogen atoms, the biocide includes a compound of Formula 3:Type: ApplicationFiled: July 19, 2021Publication date: January 27, 2022Inventors: Eui Rang LEE, Yoon Young KOO, Won Jung KIM, Hyeong Mook KIM, Tae Won PARK, Jong Won LEE, Youn Jin CHO
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Patent number: 11205740Abstract: A light emitting device package according to an embodiment has a first frame and a second frame arranged to be spaced apart from each other, a third frame arranged between the first frame and the second frame and spaced apart from the first frame and the second frame, a body supporting the first to third frames, a first light emitting device arranged on the body and electrically connected to the first frame and the third frame, and a second light emitting device arranged on the body and electrically connected to the second frame and the third frame. The body has a first recess in an upper area between the first frame and the third frame, and a second recess in an upper area between the third frame and the second frame. An embodiment may have a first resin part arranged in the first recess, and a second resin part arranged in the second recess.Type: GrantFiled: August 31, 2018Date of Patent: December 21, 2021Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.Inventors: Chang Man Lim, Ki Seok Kim, Won Jung Kim, June O Song
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Patent number: 11145872Abstract: Embodiments of the present invention relate to non-noble metal-based catalysts used as electrode materials for fuel cells, and methods of manufacturing the same. In an aspect of the present inventions, provided herein is a non-noble metal-based catalyst for an electrode of a fuel cell. The non-noble metal-based catalyst comprise a porous carbon having a first pore and a second pore smaller than the first pore. The first pore has a pore size of about 5 to 100 nm and has an inner wall into which an active site of the non-noble metal-based catalyst is introduced.Type: GrantFiled: February 27, 2020Date of Patent: October 12, 2021Assignees: Hyundai Motor Company, Kia Motors Corporation, Postech Academy-Industry FoundationInventors: Ju Hee Lee, Won Jung Kim, Seonggyu Lee, Jinwoo Lee
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Publication number: 20210257529Abstract: A light-emitting element package according to an embodiment comprises: a body comprising a cavity; the cavity; a first frame and a second frame arranged on the bottom surface of the cavity; a first metal layer disposed on the first frame; an ultraviolet light-emitting element disposed on the first metal layer; and a second metal layer disposed on the second frame and electrically connected to the second frame, wherein the body comprises a separation portion between the first frame and the second frame, the second metal layer extends over the sloping surface of the cavity and the separation portion of the body, and the second metal layer is spaced apart from the first metal layer in the cavity and surrounds the first metal layer.Type: ApplicationFiled: July 19, 2019Publication date: August 19, 2021Applicant: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.Inventors: Won Jung KIM, June O SONG, Yeong June LEE
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Publication number: 20210230451Abstract: A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the composition including a solvent, the solvent including a polar solvent or a non-polar solvent; an abrasive agent; and an oxidizing agent, wherein the abrasive agent includes silica modified with an amino silane that includes three nitrogen atoms.Type: ApplicationFiled: January 22, 2021Publication date: July 29, 2021Inventors: Won Jung KIM, Yoon Young KOO, Tae Won PARK, Eui Rang LEE, Jong Won LEE, Youn Jin CHO
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Publication number: 20210210665Abstract: A light-emitting device package according to one embodiment comprises: a body including a through-hole formed in an upper surface and a lower surface; a light-emitting device arranged on the upper surface of the body and including first and second bonding units spaced apart from each other; and first and second metal units arranged so as to be spaced apart from each other on the rear surface of the body, wherein a partial area of each of the first and second bonding units overlaps with the through-hole in a vertical direction, the first and second metal units respectively includes first and second extension portions extending to the through-hole; the first and second extension portions is electrically connected to the first and second bonding units, respectively; and the first and second extension portions face each other within the through-hole.Type: ApplicationFiled: May 29, 2019Publication date: July 8, 2021Applicant: LG INNOTEK CO., LTD.Inventors: Ki Seok KIM, Chang Man LIM, Won Jung KIM
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Publication number: 20210193877Abstract: A light emitting device package according to an embodiment may include: a first frame including a first opening passing through upper and lower surfaces, and a second frame spaced apart from the first frame and including a second opening; first and second conductive layers disposed in the first and second openings, respectively; a body disposed between the first and second frames; a first resin disposed on the body; and a light emitting device disposed on the first resin. According to an embodiment, the light emitting device may include a first bonding part electrically connected with the first frame and a second bonding part spaced apart from the first bonding part and electrically connected with the second frame, and the first and second bonding parts may be disposed on the first and second openings, respectively.Type: ApplicationFiled: October 16, 2018Publication date: June 24, 2021Applicant: LG INNOTEK CO., LTD.Inventors: June O SONG, Ki Seok KIM, Won Jung KIM
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Publication number: 20210184090Abstract: The light emitting device package disclosed in the embodiment includes a first frame having a first through hole; a second frame having a second through hole; a body disposed between the first and second frames; and light emitting devices disposed on the first and second frames, wherein the first and second through holes have an area of a lower surface larger than an area of the upper surface, and centers of the upper and lower surfaces of the first through hole may be offset from each other in the vertical direction, and centers of the upper and lower surfaces of the second through hole may be offset from each other in the vertical direction.Type: ApplicationFiled: November 30, 2018Publication date: June 17, 2021Inventors: Won Jung KIM, June O SONG, Chang Man LIM, Ki Seok KIM
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Publication number: 20210013530Abstract: A method of predicting a life of a membrane electrode assembly (MEA) of a fuel cell for electric power generation includes: deriving an operating condition for accelerated degradation, which is applicable to the fuel cell; operating the fuel cell for a specific time under the derived operating condition for accelerated degradation and under a normal operating condition, and identifying the degree of degradation of the fuel cell under each of the operating conditions; calculating an acceleration multiple based on the degree of degradation identified under the operating condition for accelerated degradation and under the normal operating condition; and predicting the life of the membrane electrode assembly based on the acceleration multiple.Type: ApplicationFiled: March 20, 2020Publication date: January 14, 2021Inventors: Hyun Bae Dong, Min Kyung Cho, Won Jung Kim, Ju Hae Jung, Jong Hyun Jang, Hyun Seo Park, Myung Su Lim, Jun Young Kim
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Publication number: 20210013376Abstract: Embodiments relate to a light emitting device package and a light source device. A light emitting device package according to the embodiment may include a first package body; a second package body disposed on the first package body, and comprising an opening passing through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and comprising a first bonding part and a second bonding part. The first package body may include a first opening and a second opening that pass through an upper surface and a lower surface of the first package body. The upper surface of the first package body may be coupled with the lower surface of the second package body, the first bonding part may be disposed on the first opening, and the second bonding part may be disposed on the second opening.Type: ApplicationFiled: September 12, 2018Publication date: January 14, 2021Applicant: LG INNOTEK CO., LTD.Inventors: Ki Seok KIM, Won Jung KIM, June O SONG, Chang Man LIM
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Publication number: 20200411738Abstract: A light emitting device package according to an embodiment may comprise: a first package body including a first and a second opening; a light emitting device disposed on the first package body and including a first and a second bonding part; and a first resin disposed between the first package body and the light emitting device. The light emitting device may comprise one surface on which the first and second bonding parts are disposed, the first bonding part may comprise a first side surface and a lower surface facing the first package body, and the second bonding part may comprise a second side surface opposite to the first side surface, and a lower surface facing the first package body.Type: ApplicationFiled: September 14, 2018Publication date: December 31, 2020Applicant: LG Innotek Co., Ltd.Inventors: Won Jung KIM, Ki Seok KIM, June O SONG, Chang Man LIM
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Publication number: 20200381756Abstract: A fuel cell recovery control system and method are provided to supply hydrogen to the cathode of a fuel cell stack to remove an oxide film formed on a platinum surface of the cathode. The performance of the fuel cell stack is recovered in accordance with the oxide film removal. In addition, electric power generated during the performance recovery of the fuel cell stack is consumed in an inverter and, as such, overcharge of a battery is prevented.Type: ApplicationFiled: October 25, 2019Publication date: December 3, 2020Inventors: Hyun Bae Dong, Won Jung Kim, Yong Doo Son
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Publication number: 20200350474Abstract: The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device including a first bonding portion and a second bonding portion on a lower portion thereof; and a first resin disposed between the body and the light emitting device, wherein the first frame includes a first protruding portion facing the first bonding portion of the light emitting device, and the second frame includes a second protruding portion facing the second bonding portion of the light emitting device, and including a first conductive layer between the first bonding portion and the first protruding portion and a second conductive layer between the second bonding portion and the second protruding portion.Type: ApplicationFiled: August 31, 2018Publication date: November 5, 2020Inventors: Young Shin KIM, June O SONG, Chang Man LIM, Won Jung KIM, Ki Seok KIM
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Patent number: RE48892Abstract: An embodiment relates to a light emitting device package and a lighting apparatus having the same. According to the embodiment, a light emitting device package includes a first lead frame; a second lead frame spaced apart from the first lead frame; a body coupled to the first lead frame and the second lead frame and includes a first cavity which exposes a portion of the upper surface of the first lead frame, a second cavity which exposes a portion of the upper surface of the second lead frame, and a spacer which is disposed between the first lead frame and the second frame; at least one light emitting device disposed in the first cavity; and a protection device disposed in the second cavity. The second cavity is disposed on a first inside surface of the first cavity and the first inside surface is connected to an upper surface of the spacer, and an area of a bottom surface of the first cavity is equal to or less than 40% of entire area of the body.Type: GrantFiled: March 15, 2019Date of Patent: January 11, 2022Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.Inventors: Chang Man Lim, Won Jung Kim, Hyoung Jin Kim, Bong Kul Min, Ho Young Chung