Patents by Inventor Won-jung Kim

Won-jung Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200335673
    Abstract: A light emitting device package disclosed in an embodiment of the invention includes a substrate including first and second frames; a light emitting device including a first bonding portion facing the first frame and a second bonding portion facing the second frame; a phosphor layer on the light emitting device; a first resin disposed around the upper surface of the substrate and the light emitting device; a second resin between the first resin and side surfaces of the light emitting device; and an adhesive layer between the phosphor layer and the light emitting device, wherein the adhesive layer includes a thickness thinner than a thickness of the phosphor layer, and the first resin comprises a reflective resin material and is disposed on the side surface of the phosphor layer. The second resin may include a transparent resin material, and the second resin may include a curved surface with an outer surface facing the first resin.
    Type: Application
    Filed: October 31, 2018
    Publication date: October 22, 2020
    Inventors: Ki Seok KIM, Jung Hwa JUNG, Na Young KIM, Won Jung KIM, Suk Kyung PARK, Sang Jun LEE, Nak Hun KIM, Chang Man LIM
  • Publication number: 20200303596
    Abstract: The light-emitting device package disclosed in the embodiment includes first and second frames; a body supporting the first and second frames; and a light emitting device on the second frame, and the body may include a lower surface, a first side, and a second side facing the first side. The first frame includes a first recess that is concave in a second side direction from a first side portion adjacent to the first side, and the second frame includes a second recess that is concave in a first side direction from a second side portion adjacent to the second side. The first side portion of the first frame includes plurality of protrusions exposed to the first side of the body, the first recess is disposed between the protrusions of the first side portion, the second side portion of the second frame includes plurality of protrusions exposed to the second side of the body, and the second recess is disposed between the protrusions of the second side portion.
    Type: Application
    Filed: September 21, 2018
    Publication date: September 24, 2020
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Chang Man LIM, June O SONG, Won Jung KIM, Hyoung Jin KIM, Hwan Hee JEONG
  • Publication number: 20200287107
    Abstract: A semiconductor device package includes a light emitting device disposed on a body, and at least one resin disposed between the body and the light emitting device. The body may include first and second opening parts passing through the body from the upper surface of the body, and at least one recess concavely provided from the upper surface of the body towards the lower surface of the body. The light emitting device may include a first bonding part disposed on the first opening part, and a second bonding part disposed on the second opening part. The at least one recess may be disposed between the first and second opening parts, and along the circumferences of the first and second opening parts. The at least one resin may be provided to the at least one recess. The at least one resin may include a reflective material.
    Type: Application
    Filed: September 20, 2018
    Publication date: September 10, 2020
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Chang Man LIM, June O SONG, Won Jung KIM
  • Patent number: 10749089
    Abstract: A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: August 18, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Tae Sung Lee, Won Jung Kim, June O Song, Chang Man Lim
  • Publication number: 20200212276
    Abstract: A light emitting device package according to an embodiment has a first frame and a second frame arranged to be spaced apart from each other, a third frame arranged between the first frame and the second frame and spaced apart from the first frame and the second frame, a body supporting the first to third frames, a first light emitting device arranged on the body and electrically connected to the first frame and the third frame, and a second light emitting device arranged on the body and electrically connected to the second frame and the third frame. The body has a first recess in an upper area between the first frame and the third frame, and a second recess in an upper area between the third frame and the second frame. An embodiment may have a first resin part arranged in the first recess, and a second resin part arranged in the second recess.
    Type: Application
    Filed: August 31, 2018
    Publication date: July 2, 2020
    Inventors: Chang Man LIM, Ki Seok KIM, Won Jung KIM, June O SONG
  • Publication number: 20200194805
    Abstract: Embodiments of the present invention relate to non-noble metal-based catalysts used as electrode materials for fuel cells, and methods of manufacturing the same. In an aspect of the present inventions, provided herein is a non-noble metal-based catalyst for an electrode of a fuel cell. The non-noble metal-based catalyst comprise a porous carbon having a first pore and a second pore smaller than the first pore. The first pore has a pore size of about 5 to 100 nm and has an inner wall into which an active site of the non-noble metal-based catalyst is introduced.
    Type: Application
    Filed: February 27, 2020
    Publication date: June 18, 2020
    Applicants: Hyundai Motor Company, Kia Motors Corporation, Postech Academy-Industry Foundation
    Inventors: Ju Hee LEE, Won Jung KIM, Seonggyu LEE, Jinwoo LEE
  • Patent number: 10672954
    Abstract: A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion disposed between the first and second frames; a light emitting device including first and second electrode pads; a first through hole in the first frame; a second through hole in the second frame; a conductive material disposed in the first and second through holes; and an intermetallic compound layer disposed between the conductive material and the first frame, and between the conductive material and the second frame, in which the first electrode pad of the light emitting device overlaps with the first through hole in the first frame, the second electrode pad of the light emitting device overlaps with the second through hole in the second frame, and the first and second electrode pads are spaced apart from each other.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: June 2, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Chang Man Lim, Ki Seok Kim, Won Jung Kim, June O Song
  • Patent number: 10636946
    Abstract: A light emitting device package is discussed. The light emitting device package includes a first frame having a first through hole; a second frame having a second through hole; a connecting frame diagonally extending in the light emitting device package from the first frame to the second frame; a first light emitting device including a first electrode pad and a second electrode pad, the second electrode pad being disposed on the first through hole of the first frame; and a second light emitting device including a third electrode pad and a fourth electrode pad, the third electrode pad being disposed on the second through hole of the second frame.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: April 28, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ki Seok Kim, Won Jung Kim, June O Song, Chang Man Lim
  • Patent number: 10615424
    Abstract: Embodiments of the present invention relate to non-noble metal-based catalysts used as electrode materials for fuel cells, and methods of manufacturing the same. In an aspect of the present inventions, provided herein is a non-noble metal-based catalyst for an electrode of a fuel cell. The non-noble metal-based catalyst comprise a porous carbon having a first pore and a second pore smaller than the first pore. The first pore has a pore size of about 5 to 100 nm and has an inner wall into which an active site of the non-noble metal-based catalyst is introduced.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: April 7, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Postech Academy-Industry Foundation
    Inventors: Ju Hee Lee, Won Jung Kim, Seonggyu Lee, Jinwoo Lee
  • Publication number: 20200058829
    Abstract: A light emitting device package disclosed to an embodiment of the invention includes a body including an upper surface and a lower surface, the body including a first recess and a second recess concaved from the lower surface toward the upper surface; a light emitting device disposed on the body and including a first bonding portion and a second bonding portion; and first and second conductive portions respectively disposed in the first recess and the second recess, wherein the body includes a first through hole and a second through hole penetrating an upper surface of each of the first recess and the second recess and the upper surface of the body, and wherein each of the first and second conductive portions extends into the first and second through holes and is electrically connected to the first bonding portion and the second bonding portion, respectively.
    Type: Application
    Filed: August 13, 2019
    Publication date: February 20, 2020
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Min Sik KIM, Won Jung KIM, Ki Seok KIM
  • Patent number: 10476095
    Abstract: A fuel cell may include a fuel supply unit for supplying hydrogen to a fuel cell stack; an air supply unit for supplying air to the fuel cell stack; and the fuel cell stack that generates energy using hydrogen and air supplied from the fuel supply unit and the air supply unit, wherein the fuel cell stack has a mesh structure and comprises a conductive polymer electrode containing about 0.1 to 1 wt % of polyethylene oxide (PEO) having a molecular weight of about 1,000 to 6,000 kg/mol.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: November 12, 2019
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Korea Advanced Institute of Science and Technology
    Inventors: Youjung Song, Won Jung Kim, Ki Ung Jeon, Yeon Sik Jung
  • Publication number: 20190334063
    Abstract: A light emitting device package is discussed. The light emitting device package includes a first frame having a first through hole; a second frame having a second through hole; a connecting frame diagonally extending in the light emitting device package from the first frame to the second frame; a first light emitting device including a first electrode pad and a second electrode pad, the second electrode pad being disposed on the first through hole of the first frame; and a second light emitting device including a third electrode pad and a fourth electrode pad, the third electrode pad being disposed on the second through hole of the second frame.
    Type: Application
    Filed: September 29, 2017
    Publication date: October 31, 2019
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Ki Seok KIM, Won Jung KIM, June O SONG, Chang Man LIM
  • Publication number: 20190207062
    Abstract: A light emitting device package according to an embodiment includes: a body including an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface, and first and second openings passing through the upper surface and the lower surface; and a light emitting device including first and second bonding portions disposed on the first and second openings, respectively, wherein the body may include a recess provided on the lower surface, the recess may be vertically overlapped with the first opening and the second opening, and the recess may be exposed at the side surface of the body.
    Type: Application
    Filed: January 2, 2019
    Publication date: July 4, 2019
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Won Jung KIM, June O SONG, Ki Seok KIM, Chang Man LIM
  • Patent number: 10297725
    Abstract: The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus. According to another embodiment, there is provided a light emitting device package which includes a package body (110) including a frame (111, 112) and a body (113); a light emitting device (120) including first and second bonding parts (121, 122) and disposed on the body (113); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: May 21, 2019
    Assignee: LG Innotek Co., Ltd.
    Inventors: Ki Seok Kim, Won Jung Kim, June O Song, Chang Man Lim
  • Publication number: 20190088824
    Abstract: The embodiment relates to a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source apparatus. According to another embodiment, there is provided a light emitting device package which includes a package body (110) including a frame (111, 112) and a body (113); a light emitting device (120) including first and second bonding parts (121, 122) and disposed on the body (113); a reflective resin layer disposed between the light emitting device and a side surface of a cavity (C) formed in the body; a transparent resin layer on the light emitting device; and a phosphor layer disposed on the transparent resin layer while being spaced apart from the light emitting device.
    Type: Application
    Filed: September 29, 2017
    Publication date: March 21, 2019
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Ki Seok KIM, Won Jung KIM, June O SONG, Chang Man LIM
  • Publication number: 20190074410
    Abstract: A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion disposed between the first and second frames; a light emitting device including first and second electrode pads; a first through hole in the first frame; a second through hole in the second frame; a conductive material disposed in the first and second through holes; and an intermetallic compound layer disposed between the conductive material and the first frame, and between the conductive material and the second frame, in which the first electrode pad of the light emitting device overlaps with the first through hole in the first frame, the second electrode pad of the light emitting device overlaps with the second through hole in the second frame, and the first and second electrode pads are spaced apart from each other.
    Type: Application
    Filed: September 29, 2017
    Publication date: March 7, 2019
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Chang Man LIM, Ki Seok KIM, Won Jung KIM, June O SONG
  • Publication number: 20190044154
    Abstract: A method of manufacturing a nanocatalyst for a fuel cell electrode, capable of carrying metal catalyst nanoparticles on a polymer carrier without using a carbon carrier, includes steps of impregnating a conductive polymer carrier with a metal catalyst precursor solution; vacuum-drying the conductive polymer carrier; and heat-treating the conductive polymer carrier at a temperature of 160 to 300° C.
    Type: Application
    Filed: December 4, 2017
    Publication date: February 7, 2019
    Inventors: Youjung SONG, Won Jung KIM, Min Joong KIM, Jeong Hoon LIM, Sangjae LEE, Yeon Sik JUNG, Eun Ae CHO
  • Publication number: 20190044039
    Abstract: A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 7, 2019
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Tae Sung LEE, Won Jung KIM, June O SONG, Chang Man LIM
  • Publication number: 20190013537
    Abstract: A fuel cell may include a fuel supply unit for supplying hydrogen to a fuel cell stack; an air supply unit for supplying air to the fuel cell stack; and the fuel cell stack that generates energy using hydrogen and air supplied from the fuel supply unit and the air supply unit, wherein the fuel cell stack has a mesh structure and comprises a conductive polymer electrode containing about 0.1 to 1 wt % of polyethylene oxide (PEO) having a molecular weight of about 1,000 to 6,000 kg/mol.
    Type: Application
    Filed: October 30, 2017
    Publication date: January 10, 2019
    Applicants: Hyundai Motor Company, Kia Motors Corporation, Korea Advanced Institute of Science and Technology
    Inventors: Youjung Song, Won Jung KIM, Ki Ung JEON, Yeon Sik JUNG
  • Patent number: 10170676
    Abstract: An embodiment relates to a light emitting device package and a lighting apparatus having the same. According to the embodiment, a light emitting device package includes a first lead frame; a second lead frame spaced apart from the first lead frame; a body coupled to the first lead frame and the second lead frame and includes a first cavity which exposes a portion of the upper surface of the first lead frame, a second cavity which exposes a portion of the upper surface of the second lead frame, and a spacer which is disposed between the first lead frame and the second frame; at least one light emitting device disposed in the first cavity; and a protection device disposed in the second cavity. The second cavity is disposed on a first inside surface of the first cavity and the first inside surface is connected to an upper surface of the spacer, and an area of a bottom surface of the first cavity is equal to or less than 40% of entire area of the body.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: January 1, 2019
    Assignee: LG Innotek Co., Ltd.
    Inventors: Chang Man Lim, Won Jung Kim, Hyoung jin Kim, Bong Kul Min, Ho Young Chung