Patents by Inventor Won-kyoung Choi

Won-kyoung Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070024549
    Abstract: A micro-mirror device package including a micro-mirror device; a substrate, on which the micro-mirror device is mounted; and a window lid mounted on the substrate to cover the micro-mirror device. The window lid has a light transmitting part, which is sloped in relation to the micro-mirror device, and through which laser beams are transmitted to the micro-mirror device, and supporting parts downwardly extending from the light transmitting part. When a laser beam is inputted, the package separates the laser beam from noise beams, thereby improving the quality of image on a screen. By fabricating an array of window lids which correspond to micro-mirror devices, respectively, it is possible to fabricate the above-mentioned micro-mirror device package through a batch process performed in terms of a wafer size.
    Type: Application
    Filed: May 1, 2006
    Publication date: February 1, 2007
    Inventors: Won-kyoung Choi, Woon-bae Kim, Yong-kweun Mun, Chang-youl Moon, Sung-hee Lee
  • Publication number: 20070024691
    Abstract: An image drum and method of producing the same is provided. The drum includes a drum body having a pair of semi-cylindrical members, each being oppositely bonded and having a bonding surface having electrodes being separated from one another by insulating areas, and line electrodes formed on the periphery; a control unit including conductive parts corresponding to the line electrodes, and nonconductive parts interposed between the conductive parts, and disposed inside the drum body; and a connecting member electrically coupling the line electrodes to the control unit. The method includes cutting a cylindrical member into two semi-cylindrical members; oxidizing the surfaces of the members; forming electrodes on each of the cut surfaces; partially oxidizing a substrate; bonding the two semi-cylindrical members across the substrate such that the electrodes and the conductive parts couple together; and forming line electrodes on the periphery of the members.
    Type: Application
    Filed: April 5, 2006
    Publication date: February 1, 2007
    Inventors: Kyu-ho Shin, Won-kyoung Choi, Jong-kwang Kim, Kae-dong Back, Chang-youl Moon
  • Publication number: 20070008601
    Abstract: The optical scanner package having: an optical scanner device scanning an incident beam and including a scanning mirror and a comb-electrode structure operating the scanning mirror; a package container containing the optical scanner device; and a package window that is formed on the package container to hermetically seal the package container, and includes a reflection mirror which reflects the scanned beam from the optical scanner device to a screen unit on one side, thus separating the path of the scanned beam from the path of a noise beam derived from the incident beam.
    Type: Application
    Filed: February 21, 2006
    Publication date: January 11, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong-kweun Mun, Won-kyoung Choi
  • Patent number: 7149023
    Abstract: Provided is an optical scanner capable of hermetic sealing with a round of flip-chip bonding. The optical scanner includes an upper substrate and a lower substrate, a mirror suspended between the upper substrate and the lower substrate to seesaw, a plurality of movable comb electrodes vertically formed at predetermined intervals at both sides of the mirror, a plurality of upper static comb electrodes and lower static comb electrodes respectively vertically installed on the upper substrate and the lower substrate to alternate with the plurality of movable comb electrodes, a plurality of electrode structures respectively transmitting external voltage to the upper and lower static comb electrodes and the movable comb electrodes, and an upper outer frame and a lower outer frame respectively formed along edges of the upper and lower substrates and bonded to each other to seal the mirror from the outside.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: December 12, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-chul Ko, Yong-kweun Mun, Won-kyoung Choi
  • Publication number: 20060176539
    Abstract: Provided are a chip-scale optical scanner package with reduced noise, and a method of manufacturing the optical scanner package. The optical scanner package includes: an optical scanner device scanning an incident beam, the optical scanner device including a mirror portion, comb-electrode structures rotating the mirror portion, and a base substrate; and a cover glass protecting the mirror portion, the cover glass including support portions sealingly adhered to a top surface of the base substrate around the mirror portion and a transmission portion with first and second transmission surfaces formed on the support portions and sloped with respect to a top surface of the base substrate. Accordingly, the optical scanner package can be miniaturized, can be simply processed, and reduce packaging costs. Further, the brightness and contrast of an image can be enhanced, and background noise can be reduced by reducing a sub reflected beam that causes noise.
    Type: Application
    Filed: February 3, 2006
    Publication date: August 10, 2006
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Won-kyoung Choi, Yong-kweun Mun, Young-chul Ko
  • Publication number: 20060164631
    Abstract: An optical scanner package having a heating dam is provided. The optical scanner package having a heating dam includes: an optical scanner on which a mirror surface is formed; a ceramic package in which the optical scanner is installed at the bottom of a cavity thereof; a glass lid covering a sidewall of the ceramic package; a heating dam formed on the sidewall of the ceramic package; and solder on the heating dam sealing between the glass lid and the sidewall of the ceramic package. The heating dam locally heats the solder to form hermetic sealing.
    Type: Application
    Filed: December 23, 2005
    Publication date: July 27, 2006
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Won-kyoung Choi, Young-chul Ko
  • Publication number: 20060138652
    Abstract: A solder for device packaging including a plurality of cores, and a coating solder mixed with the cores. The cores are formed of a material having a higher thermal conductivity than the coating solder.
    Type: Application
    Filed: August 10, 2005
    Publication date: June 29, 2006
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae-hoon Jang, Won-kyoung Choi
  • Publication number: 20060098261
    Abstract: Provided is an optical scanner capable of hermetic sealing with a round of flip-chip bonding. The optical scanner includes an upper substrate and a lower substrate, a mirror suspended between the upper substrate and the lower substrate to seesaw, a plurality of movable comb electrodes vertically formed at predetermined intervals at both sides of the mirror, a plurality of upper static comb electrodes and lower static comb electrodes respectively vertically installed on the upper substrate and the lower substrate to alternate with the plurality of movable comb electrodes, a plurality of electrode structures respectively transmitting external voltage to the upper and lower static comb electrodes and the movable comb electrodes, and an upper outer frame and a lower outer frame respectively formed along edges of the upper and lower substrates and bonded to each other to seal the mirror from the outside.
    Type: Application
    Filed: August 24, 2005
    Publication date: May 11, 2006
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Young-chul Ko, Yong-kweun Mun, Won-kyoung Choi
  • Publication number: 20050072835
    Abstract: Provided are a solder bump, a method of manufacturing the same, and a method of bonding a light emitting device using the method of manufacturing the solder bump. In particular, the solder bump is formed of a compound including a first element through a third element, in which the first and third elements together form a compound having a plurality of intermediate phases and solidus lines.
    Type: Application
    Filed: September 27, 2004
    Publication date: April 7, 2005
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Won-kyoung Choi, Su-hee Chae, Joon-seop Kwak