Abstract: In an embodiment, a method of forming a bonded structure is provided. The method may include forming at least one first under bump metallurgy (UBM) structure on a first substrate, forming a first gold layer on the at least one first under bump metallurgy structure; forming a tin layer on the first gold layer, forming an indium layer on the tin layer, forming an inhibition layer configured to inhibit oxygen penetration on the indium layer, and forming at least one second under bump metallurgy structure on a second substrate, forming s second gold layer on the at least one second under bump metallurgy structure; and bringing the inhibition layer into contact with the second gold layer at a predetermined temperature to form a resultant intermetallic structure between the first substrate and the second substrate thereby bonding the first substrate to the second substrate and forming the bonded structure.

Abstract: In an embodiment, a wafer level package may be provided. The wafer level package may include a device wafer including a MEMS device, a cap wafer disposed over the device wafer, at least one first interconnect disposed between the device wafer and the cap wafer and configured to provide an electrical connection between the device wafer and the cap wafer, and a conformal sealing ring disposed between the device wafer and the cap wafer and configured to surround the at least one first interconnect and the MEMS device so as to provide a conformally sealed environment for the at least one first interconnect and the MEMS device, wherein the conformal sealing ring may be configured to conform to a respective suitable surface of the device wafer and the cap wafer when the device wafer may be bonded to the cap wafer. A method of forming a wafer level package may also be provided.

Abstract: A semiconductor device has a semiconductor die with a first conductive layer formed over the semiconductor die. A first insulating layer is formed over the semiconductor die with a first opening in the first insulating layer disposed over the first conductive layer. A second conductive layer is formed over the first insulating layer and into the first opening over the first conductive layer. An interconnect structure is formed over the first and second conductive layers within openings of a second insulating layer. The second insulating layer is removed. The interconnect structure can be a conductive pillar or conductive pad. A bump material can be formed over the conductive pillar. A protective coating is formed over the conductive pillar or pad to a thickness less than one micrometer to reduce oxidation. The protective coating is formed by immersing the conductive pillar or pad into the bath containing tin or indium.

Abstract: A semiconductor device has a semiconductor die with a first conductive layer formed over the die. A first insulating layer is formed over the die with a first opening in the first insulating layer disposed over the first conductive layer. A second conductive layer is formed over the first insulating layer and into the first opening over the first conductive layer. An interconnect structure is constructed by forming a second insulating layer over the first insulating layer with a second opening having a width less than the first opening and depositing a conductive material into the second opening. The interconnect structure can be a conductive pillar or conductive pad. The interconnect structure has a width less than a width of the first opening. The second conductive layer over the first insulating layer outside the first opening is removed while leaving the second conductive layer under the interconnect structure.

Abstract: A semiconductor device comprises a carrier including an adhesive disposed over the carrier. The semiconductor device further comprises a semiconductor wafer including a plurality of semiconductor die separated by a non-active region. A plurality of bumps is formed over the semiconductor die. The semiconductor wafer is mounted to the carrier with the adhesive disposed around the plurality of bumps. Irradiated energy is applied to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die. The semiconductor wafer is singulated along the modified region by applying stress to the semiconductor wafer. The adhesive is removed from around the plurality of bumps after singulating the semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die comprising through silicon vias. The modified region optionally includes a plurality of vertically stacked modified regions.

Abstract: The present invention provides a method for compensating nonlinearity of a resolver to control a motor in hybrid and fuel cell vehicles, thereby stably controlling the motor current during high-torque and high-speed operation. In preferred aspects, the present invention provides a method for compensating nonlinearity of a resolver to control a motor in hybrid and fuel cell vehicles, the method including collecting resolver position data; determining whether to perform resolver position correction in the corresponding vehicle; and compensating nonlinearity of the resolver based on the collected resolver position data, if it is determined that the resolver position correction is not performed.

Abstract: A mobile terminal and a method for transmitting a message thereof are provided. The method for transmitting a message in a mobile terminal including at least two communication units capable of communicating with different communication networks, includes, identifying circuits connected through the at least two communication units when at least two identification information of other mobile terminals to which the message is to be transmitted is input, and simultaneously transmitting the message to the at least two other mobile terminals according to the identification information through the identified circuits. Through the method, a message can be simultaneously transmitted to a plurality of other mobile terminals using characteristics of a multi-standby mobile terminal. In addition, the message transmission method can reduce a time required to transmit a message.

Abstract: The present invention provides a motor drive system for a hybrid vehicle and a method for controlling the same in the event of a failure in a voltage converter, in which high voltage stored in a DC-link capacitor is discharged to a 12V electrical load through a DC-DC converter, of which the output voltage is increased.

Abstract: A method for controlling a cooling system for controlling a power converter of a hybrid electric vehicle includes: estimating the temperature of a power converter at the time of a CAN communication error as a current temperature of the power converter and controlling a cooling system at a cooling rate based on the estimated temperature; and controlling the cooling rate of the cooling system depending on whether an output of the power converter is greater than a reference value. According to the method, the cooling system can be more effectively controlled.

Abstract: An image drum for selectively adsorbing toner in a printing apparatus is provided. A method and a configuration of ring electrodes formed on an outside of a drum body is also provided. That is, a control board is mounted inside the drum body, of which a plurality of terminals is externally exposed in the cylindrical drum body, and a photocurable resin is coated on the circumferential surface. Ring electrodes are then formed on circumferential surface of the drum body, by rotating the drum body and allowing an ultraviolet ray through the mask pattern onto the drum body to harden the liquid photocurable resin after contacting a mask-patterned mold mask to the circumferential surface of the drum body.

Abstract: An image drum manufacturing method including: providing a hollow cylindrical mold having a plurality of mold grooves circumferentially cut in its inner circumferential surface and a core portion having a smaller diameter than a hollow of the mold and having a slit-shaped combination groove; filling a conductive material into the mold grooves of the mold; inserting a control unit for individually applying a voltage to each terminal in the combination groove of the core portion, so that a conductive pattern corresponding to the conductive material is partially exposed; inserting the core portion into the mold so that the conductive pattern corresponds to the conductive material filled into each mold groove; and forming a drum body to be integrally formed with the control unit and the conductive material by filling a molten plastic into a space between the mold and the core portion.

Abstract: A mirror package is provided which can reflect a laser to an external screen according to a video signal when the laser enters from outside, and a method of manufacturing the mirror package. The mirror is packaged with a glass to protect from external contamination, an inlet and an outlet are formed by, for example, an anisotropic etching on the glass and blocks a reflected light reflected from the glass. The mirror package is formed as a set, combined on a wafer using a wafer level package and diced to individual chips. Subsequently, a productivity is improved and a ghost image or phenomenon is removed.

Abstract: An image forming apparatus that may be easily and inexpensively manufactured is provided. The image forming apparatus includes: a toner supply unit; an image forming element to which toner is adsorbed from the toner supply unit; an image developing unit disposed on an outer side of the image forming element, wherein said image developing unit selectively separates from the image forming element at least a part of the toner adsorbed to the image forming element in order to develop an image on the image forming element; and a toner return unit which returns the toner separated from the image forming element by the image developing unit to the toner supply unit.

Abstract: A soldering structure using Zn includes a bonding layer which contains Zn; and a lead-free solder which bonds and reacts to the bonding layer. The bonding layer can be a Zn alloy layer or a multilayer including a Zn layer. Accordingly, the characteristics of the soldering structure can be improved by involving the high reactive Zn to the interfacial reaction of the soldering.

Abstract: The optical scanner package having: an optical scanner device scanning an incident beam and including a scanning mirror and a comb-electrode structure operating the scanning mirror; a package container containing the optical scanner device; and a package window that is formed on the package container to hermetically seal the package container, and includes a reflection mirror which reflects the scanned beam from the optical scanner device to a screen unit on one side, thus separating the path of the scanned beam from the path of a noise beam derived from the incident beam.

Abstract: An optical scanner package having a heating dam is provided. The optical scanner package having a heating dam includes: an optical scanner on which a mirror surface is formed; a ceramic package in which the optical scanner is installed at the bottom of a cavity thereof; a glass lid covering a sidewall of the ceramic package; a heating dam formed on the sidewall of the ceramic package; and solder on the heating dam sealing between the glass lid and the sidewall of the ceramic package. The heating dam locally heats the solder to form hermetic sealing.

Abstract: A micro-electro mechanical system (MEMS) device that uses an SOI wafer, and a method of manufacturing the same. The MEMS device includes an SOI wafer including a first silicon layer, a second silicon layer, and an insulating layer formed between the first and second silicon layers, and a protective substrate that is bonded to the first silicon layer, wherein grounding via holes are formed through the first silicon layer, the insulating layer and the protective substrate, and filled with a conductive material, and ventilation holes to be connected to the grounding via holes are formed in the second silicon layer.

Abstract: An image drum for selectively adsorbing toner in a printing apparatus is provided. A method and a configuration of ring electrodes formed on an outside of a drum body is also provided. That is, a control board is mounted inside the drum body, of which a plurality of terminals is externally exposed in the cylindrical drum body, and a photocurable resin is coated on the circumferential surface. Ring electrodes are then formed on circumferential surface of the drum body, by rotating the drum body and allowing an ultraviolet ray through the mask pattern onto the drum body to harden the liquid photocurable resin after contacting a mask-patterned mold mask to the circumferential surface of the drum body.

Abstract: An image drum manufacturing method including: providing a hollow cylindrical mold having a plurality of mold grooves circumferentially cut in its inner circumferential surface and a core portion having a smaller diameter than a hollow of the mold and having a slit-shaped combination groove; filling a conductive material into the mold grooves of the mold; inserting a control unit for individually applying a voltage to each terminal in the combination groove of the core portion, so that a conductive pattern corresponding to the conductive material is partially exposed; inserting the core portion into the mold so that the conductive pattern corresponds to the conductive material filled into each mold groove; and forming a drum body to be integrally formed with the control unit and the conductive material by filling a molten plastic into a space between the mold and the core portion.

Abstract: Provided are a solder bump, a method of manufacturing the same, and a method of bonding a light emitting device using the method of manufacturing the solder bump. In particular, the solder bump is formed of a compound including a first element through a third element, in which the first and third elements together form a compound having a plurality of intermediate phases and solidus lines.