Abstract: A semiconductor device includes first to third semiconductor chips consecutively stacked. The first semiconductor chip comprises a first semiconductor substrate. A circuit layer is on a top surface of the first semiconductor substrate. First pads are on a top surface of the circuit layer. The first pads are electrically connected to the circuit layer. The second semiconductor chip comprises a second semiconductor substrate. Passive devices are in the second semiconductor substrate. Second pads are on a bottom surface of the second semiconductor substrate. The second pads are electrically connected to the passive devices. Third pads are on a top surface of the second semiconductor substrate. The third semiconductor chip comprises fourth pads on a bottom surface of the third semiconductor chip. The first pads and the second pads are directly connected to each other. The third pads and the fourth pads are directly connected to each other.

Abstract: Disclosed are a thermoplastic resin composition and a molded product including the same, and based on 100 parts by weight of a base resin including (A) 70 wt % to 90 wt % of a polybutylene terephthalate resin and (B) 10 wt % to 30 wt % of an acrylate-based graft copolymer, the thermoplastic resin composition includes: (C) 1 part by weight to 5 parts by weight of an epoxy group-containing methacrylate-aromatic vinyl-unsaturated nitrile copolymer; (D) 15 parts by weight to 20 parts by weight of a carbon fiber; (E) 1 part by weight to 5 parts by weight of carbon nanotubes; and (F) 18 parts by weight to 20 parts by weight of aluminum diethyl phosphinate (ADEP).

Abstract: Disclosed is a semiconductor package including a semiconductor chip that includes a chip pad on one surface of the semiconductor chip, a redistribution pattern on the one surface of the semiconductor chip and electrically connected to the chip pad, and a photosensitive dielectric layer between the semiconductor chip and the redistribution pattern. The photosensitive dielectric layer may be in physical contact with the redistribution pattern. The redistribution pattern includes a signal redistribution pattern, a ground redistribution pattern, and a power redistribution pattern. A vertical distance between the chip pad and the signal redistribution pattern may be greater than a width of the signal redistribution pattern.

Abstract: A semiconductor structure may include an interposer die, a slave die, a plurality of first connection members and a plurality of second connection members. The interposer die may include a first surface and a second surface that is an opposite surface of the first surface. The slave die may include a third surface and a fourth surface that is an opposite surface of the third surface, and a plurality of through-silicon vias. The plurality of first connection members may be disposed on the first surface. The plurality of second connection members may electrically connect the second surface and the third surface.

Abstract: Provided is a high-pressure tank wound with a hoop layer and a helical layer. According to the present invention, the high-pressure tank includes: a liner which includes a cylinder portion and two dome portions respectively formed at both ends of the cylinder portion; and a composite material layer which includes a hoop layer and a helical layer, wound on an outer circumferential surface of the liner, wherein the helical layer includes a twist portion wound on a junction portion of the cylinder portion and the dome portion, and the twist portion is twisted and wound while wrapping on an end portion of the hoop layer when the helical layer passes by the hoop layer and is then wound toward the dome portion.

Abstract: The present invention discloses a knob cap for a high-pressure tank including a first knob cap portion having a coupling groove coupled to a knob of a liner of the high-pressure tank in a lower surface, including a peripheral wing portion extending outward to be in contact with a surface of the liner to outside of a lower portion, and having a column portion in the shape of a column extending upward in a center; and a second knob cap portion integrally coupled with the first knob cap portion, having the column portion of the first knob cap portion inserted into a hollow, and including a plurality of inner grooves in the shape of a column having an upper end opened outside of the hollow and extending downward.

Abstract: The present invention relates to a knob cap for a high-pressure tank including a coupling groove portion corresponding to a knob of a liner of the high-pressure tank formed in a lower surface of a body; a peripheral wing portion extending outward in a lower end of an outer circumferential surface of the body to be in contact with a surface of the liner; and a thickness conversion portion formed in the outer circumferential surface of the body to change a thickness between a center line and the outer circumferential surface.

Abstract: A semiconductor package is provided. The semiconductor package comprises a first semiconductor chip including the first signal wiring structure disposed in an upper surface thereof, and a first power wiring structure disposed in a lower surface thereof, a second semiconductor chip disposed on the first signal wiring structure and including a second signal wiring structure, a second power wiring structure disposed on the second semiconductor chip and a first power connection pillar connecting the first power wiring structure and the second power wiring structure to each other.

Abstract: A semiconductor package includes a power delivery network, a semiconductor chip on a top surface of the power delivery network, and having first and second surfaces opposite to each other, a second semiconductor chip on the top surface horizontally spaced from the first semiconductor chip, the second semiconductor chip having third surface and fourth surfaces, opposite to each other, chip stacks on the first semiconductor chip, and on the second semiconductor chip. The first surface is an active surface. The third surface is an active surface of the second semiconductor chip. The first chip stack includes third semiconductor chips on the first surface of the first semiconductor chip. The third semiconductor chips is disposed such that an active surface thereof faces the first semiconductor chip, and the first chip stack and the second semiconductor chip may be electrically connected to each other through the power delivery network.

Abstract: A semiconductor package includes a substrate, a master chip on the substrate, a first slave chip on a top surface of the master chip and partially exposing the top surface of the master chip, the first slave chip having a same size as the master chip and having a same storage capacity as the master chip, and a first chip connector on the exposed top surface of the master chip and coupled to the master chip and the first slave chip.

Abstract: The present disclosure relates to an electrical contact material that is a contact element that plays a role of blocking or allowing the flow of an electric circuit to pass through, and relates to an electrical contact composite material that satisfies the physical properties required to use as an electrical contact while reducing Ag content, and a method for manufacturing the same.

Abstract: A semiconductor package includes a substrate, a master chip on the substrate, a first slave chip on a top surface of the master chip and partially exposing the top surface of the master chip, the first slave chip having a same size as the master chip and having a same storage capacity as the master chip, and a first chip connector on the exposed top surface of the master chip and coupled to the master chip and the first slave chip.

Abstract: A verification apparatus is provided. The verification apparatus includes: an acquisition unit configured to acquire a photographed image of an optical line for which a splicing operation is completed; an analysis unit configured to extract a defect of a spliced portion of the optical line through analysis of the image; and a determination unit configured to determine the presence or absence of an abnormality in the spliced portion based on the extracted defect.

Abstract: A semiconductor package including a buffer structure including a first redistribution layer, a first buffer chip on the first redistribution layer, a second redistribution layer on the first buffer chip, and a first molding layer filling between the first redistribution layer and the second redistribution layer, and a first chip stack and a first semiconductor chip on the buffer structure and spaced apart from each other, wherein the first buffer chip overlaps at least a portion of the first semiconductor chip in a first direction from the buffer structure toward the first semiconductor chip, may be provided.

Abstract: A cable comprises: a cable core; and a cable sheath layer formed on the outside of the cable core, wherein the cable sheath layer has, on the outer surface thereof, a pattern corresponding to a binary code. A recognition rate is improved, and a problem of the productivity of the cable being reduced may be prevented by adjusting the widths of the pattern, corresponding to the binary code printed on the cable, in the vertical direction and the horizontal direction, and a plurality of patterns corresponding to the binary code printed on the cable are provided to prevent, even when the cable is buried in the ground or contacts a facility and a pattern corresponding to some binary patterns is not exposed, a pattern corresponding to the other binary patterns from being exposed and unrecognizable.

Abstract: Provided is a high-pressure tank wound with a hoop layer and a helical layer. According to the present invention, the high-pressure tank includes: a liner which includes a cylinder portion and two dome portions respectively formed at both ends of the cylinder portion; and a composite material layer which includes a hoop layer and a helical layer, wound on an outer circumferential surface of the liner, wherein the helical layer includes a twist portion wound on a junction portion of the cylinder portion and the dome portion, and the twist portion is twisted and wound while wrapping on an end portion of the hoop layer when the helical layer passes by the hoop layer and is then wound toward the dome portion.

Abstract: A rail inspection device is provided. The rail inspection device includes: a drive part configured to drive on a lower rail; side wheels configured to rotate such that the drive part moves in a first direction on the lower rail, wherein the side wheels are provided on two side surfaces of the drive part opposite to each other in a second direction that intersects the first direction; upper wheels provided on an upper surface of the drive part and configured to rotate in contact with a branch guide rail provided above an upper portion of the drive part; a body connected to a lower surface of the drive part in a third direction that is perpendicular to the first direction and the second direction; and an inclination sensor provided on the upper surface of the drive part and configured to measure an inclination of the body.

Abstract: Disclosed is an article transfer apparatus. The article transfer apparatus includes a vehicle that travels along a driving rail installed on a ceiling, a hoist module that picks up an article-to-be-transferred, a vehicle body, on which the hoist module is mounted and which is connected to the vehicle, a drop preventing member provided in the vehicle body, and that prevents the article-to-be-transferred from dropping while the vehicle travels, and a controller that receives loading/unloading information of the article-to-be transferred to determine a size of the article-to-be-transferred, and to drive the drop preventing member according to a size of the article-to-be transferred.

Abstract: The virtual machine (VM) image management method of providing high-performance virtual desktop services includes receiving a request for a VM execution from a client corresponding to a user, building a logical VM image from the user VM disk image in response to the request, and providing a VM driven on the basis of the logical VM image to the client.

Abstract: The present invention relates to a sealing apparatus for a high-pressure tank and a high-pressure tank comprising same, wherein the sealing apparatus comprises: a liner configured to accommodate a high-pressure fluid; a connection boss which is a metallic connector provided at an inlet of the liner and includes a first connection boss part coupled to an inner surface of the inlet and a second connection boss part coupled to an outer surface of the inlet and having a tapered shape with a relatively narrow upper side and a relatively wide lower side; and a coupling member configured to come into surface contact with an outer surface of the second connection boss part and having a tilted surface corresponding to a shape of the second connection boss part so that an inner diameter of a lower side is larger than that of an upper side.