Abstract: A camera module of reduced size includes a baseplate, an image sensor on the baseplate, a mounting bracket with a through hole, and a circuit board. An inner wall of the through hole extends towards a central axis of the through hole to form a platform, a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion. A multilayer coil, a capacitor, and a resistor are formed on the mounting bracket by laser direct structuring, the multilayer coil is of encircling coils arranged from inside to outside on the mounting bracket and surrounds the through hole. The circuit board is connected with the mounting bracket through the connecting portion. A method for manufacturing a lens module is also disclosed.

Abstract: The present disclosure provides a self-service settlement method, apparatus and storage medium, and relates to the technical field of self-service shopping, wherein the method includes: obtaining a monitoring image acquired by an image capture device and corresponding to commodities to be settled which are placed on a settlement counter; obtaining information of the commodities to be settled through image recognition; obtaining a first weight acquired by a weight detection device, obtaining a second weight based on the information of the commodities to be settled, judging whether the information of the commodities to be settled is matched with commodities to be confirmed according to a weight comparison result; and obtaining purchased commodity settlement information under the condition that the information of the commodities to be settled is matched with the commodities to be confirmed, and performing checkout processing.

Abstract: A touch pad including a touch sensor, a force sensor, a printed circuit board, and a touch controller is provided. The touch sensor includes first and second touch electrode layers, and a first substrate. The first touch electrode layer is arranged above the second touch electrode layer through the first substrate. The force sensor is arranged below the touch sensor, and includes a support structure and at least one pressure electrode layer. The support structure is a deformable structure, and is configured to deform under the action of a pressure applied by a finger when pressing the touch pad to change a pressure sensing capacitance of a finger pressing region, and output a corresponding pressure sensing signal through the at least one pressure electrode layer. The printed circuit board is arranged below the force sensor. The touch controller is mounted and fixed to the printed circuit board.

Abstract: A touch pad including a touch sensor, a force sensor, a printed circuit board, and a touch controller is provided. The touch sensor includes first and second touch electrode layers, and a first substrate. The first touch electrode layer is arranged above the second touch electrode layer through the first substrate. The force sensor is arranged below the touch sensor, and includes a support structure and at least one pressure electrode layer. The support structure is a deformable structure, and is configured to deform under the action of a pressure applied by a finger when pressing the touch pad to change a pressure sensing capacitance of a finger pressing region, and output a corresponding pressure sensing signal through the at least one pressure electrode layer. The printed circuit board is arranged below the force sensor. The touch controller is mounted and fixed to the printed circuit board.

Abstract: A method and an electronic device for pedestrian re-identification are provided. The method may include: collecting a target image set including at least two target images, where each target image includes at least one person; extracting a global feature and a head-shoulder feature of each person in each target image in the target image set, where the global feature is an overall appearance feature, and the head-shoulder feature is a feature of a head part and a shoulder part determining a representation feature of each person in each target image based on the global feature and the head-shoulder feature of each person in each target image; and determining a given person in different target images based on the representation feature of each person in each target image.

Abstract: A coffin is provided, and the coffin includes a coffin body with a top opening and a coffin lid for closing the coffin body. The coffin lid is provided with an air intake hole and an exhaust air hole, the air intake hole and the exhaust air hole are respectively connected to an air intake device and an exhaust air device through pipelines to supply the oxygen required for decomposition of a body and exhaust waste gases. The coffin lid is further provided with an exhaust liquid pipe connected to a peristaltic pump. An oxygen or carbon dioxide sensor, and a hydrogen sulfide or ammonia concentration sensor are installed in an exhaust channel. The coffin body includes a plastic waterproof bag, and the coffin lid is pasted with adhesive plastic film. The function of the plastic waterproof bag is to prevent waste liquids from polluting the coffin body.

Abstract: Approaches for rendering of hypertext transfer protocol (HTTP) headers are disclosed. A method may include receiving a partial HTTP response message generated in response to an HTTP request message. The partial HTTP response message may include an indication of an HTTP header configuration based on one or more security parameters. The method may include retrieving the HTTP header configuration based on the indication of the HTTP header configuration. The HTTP header configuration may indicate one or more HTTP header parameters and one or more header rendering actions associated with the one or more HTTP header parameters. The method may include generating a complete HTTP response message that may include the partial HTTP response message modified by the one or more HTTP header parameters based on the one or more header rendering actions. The method may include transmitting the complete HTTP response message.

Abstract: A stacked semiconductor package has a substrate, a first chip, at least one spacer, a second chip and an encapsulation. The first chip and the second chip are intersecting stacked on the substrate. The at least one spacer is stacked on the substrate to support the second chip. The encapsulation is formed to encapsulate the substrate, the first chip, the at least one spacer and the second chip. The at least one spacer is made of the material of the encapsulation. Therefore, the adhesion between the at least one spacer and the encapsulation is enhanced to avoid the delamination during the reliability test and enhances the reliability of the stacked semiconductor package.

Abstract: Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

Abstract: A method and apparatus for wafer bonding are provided. The method includes: determining a first position parameter of a first alignment mark on a first wafer and a second position parameter of a second alignment mark on a second wafer by using a first type of optical beam; moving the first wafer and the second wafer to be opposite to each other by changing a relative position between the first wafer and the second wafer according to the first position parameter and the second position parameter, to achieve a first alignment of the first alignment mark and the second alignment mark; adjusting the relative position between the first wafer and the second wafer by using a second type of optical beam, to achieve a second alignment of the first alignment mark and the second alignment mark; and bonding the first wafer to the second wafer.

Abstract: A method and apparatus for wafer bonding. The method includes that, a first position parameter of a first alignment mark on a first wafer is determined by using a optical beam; a second position parameter of a second alignment mark on a second wafer is determined with the optical beam, the optical beam has a property of transmitting through a wafer; a relative position between the first wafer and the second wafer is adjusted with the optical beam according to the first position parameter and the second position parameter until the relative position between the first alignment mark and the second alignment mark satisfies a predetermined bonding condition; and the first wafer is bonded to the second wafer.

Abstract: An optical image recognition device and a method for fabricating the same are disclosed. The device includes a flexible printed circuit board, an image sensor, a glue, an optical collimator, a supporting ring, a sealant, and an optical filter. The top of the flexible printed circuit board is provided with a recess, the image sensor is located in the recess, the sidewalls of the image sensor and the recess are separated from each other, and the image sensor is coupled to the flexible printed circuit board through conductive wires. The glue adheres to the flexible printed circuit board and the image sensor and covers the conductive wires. The optical collimator is disposed on the image sensor. The supporting ring, disposed on the flexible printed circuit board, surrounds the glue and the optical collimator. The optical filter, disposed on the sealant, shields the optical collimator and the image sensor.

Abstract: A method and an apparatus for retrieving a target are provided. The method may include: obtaining at least one image and a description text of a designated object; extracting image features of the image and text features of the description text by using a pre-trained cross-media feature extraction network; and matching the image features with the text features to determine an image that contains the designated object.

Abstract: A tent assembly includes two tents spaced from each other in a longitudinal direction. Each tent includes a tent body supported by a tent frame to form a tent space. Each tent body includes two first tent canvases at front and rear ends thereof and spaced from each other in the longitudinal direction. Each tent body further includes two second tent canvases spaced from each other in a transverse direction. Each first tent canvas includes a first access opening. A connecting tent is connected between the two tents and includes a connecting tent body having two connecting tent canvases extending in the longitudinal direction and spaced from each other in the transverse direction. The connecting tent body is connected between two adjacent first tent canvases respectively of the two tents. The connecting tent includes a passageway connected between two adjacent first access openings respectively of the two tents.

Abstract: A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.

Abstract: A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.

Abstract: An interposer, which is used to connect two circuit boards, includes an inner structure (10), an outer structure (20), and a protective layer (50). The inner structure (10) includes a first base layer (11) and a first wiring layer (131) formed on the first base layer (11). The outer structure (20) includes a second base layer (21) and a second wiring layer (231) formed on the second base layer (21). An end portion of at least wiring line of the first wiring layer (131) and the second wiring layer (231) extends to a sidewall of the interposer (100). An end of another wiring line extends to the other sidewall of the interposer (100). The first wiring layer (131) is electrically connected to the second wiring layer (231) by a conductive blind hole (41).

Abstract: A camera module of reduced size includes a baseplate, an image sensor on the baseplate, a mounting bracket with a through hole, and a circuit board. An inner wall of the through hole extends towards a central axis of the through hole to form a platform, a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion. A multilayer coil, a capacitor, and a resistor are formed on the mounting bracket by laser direct structuring, the multilayer coil is of encircling coils arranged from inside to outside on the mounting bracket and surrounds the through hole. The circuit board is connected with the mounting bracket through the connecting portion. A method for manufacturing a lens module is also disclosed.

Abstract: Embodiments of the present application disclose a method and apparatus for detecting a body. A particular embodiment of the method comprises: acquiring a set of candidate body image region in a target image; for a candidate body image region in the set of candidate body image region: acquiring position information and confidences of candidate body key points in the candidate body image region; determining the candidate body key points within a body contour according to body contour information in the candidate body image region and the acquired position information; and determining a confidence score of the candidate body image region according to a sum of the confidences of the candidate body key points within the body contour; and determining a body image region from the set of candidate body image regions according to the confidence scores of the candidate body image regions in set of the candidate body image regions.

Abstract: An optical image recognition device and a method for fabricating the same are disclosed. The device includes a flexible printed circuit board, an image sensor, a glue, an optical collimator, a supporting ring, a sealant, and an optical filter. The top of the flexible printed circuit board is provided with a recess, the image sensor is located in the recess, the sidewalls of the image sensor and the recess are separated from each other, and the image sensor is coupled to the flexible printed circuit board through conductive wires. The glue adheres to the flexible printed circuit board and the image sensor and covers the conductive wires. The optical collimator is disposed on the image sensor. The supporting ring, disposed on the flexible printed circuit board, surrounds the glue and the optical collimator. The optical filter, disposed on the sealant, shields the optical collimator and the image sensor.