Abstract: Methods for fabricating memory devices including capacitors are disclosed. In one aspect, a method of fabricating a memory device including capacitors is described, where each capacitor includes a first electrode and a second electrode separated by an isolation layer. The method includes providing a first wafer including a sacrificial material and the first electrodes disposed in first holes and in contact with the sacrificial material, hybrid bonding the first wafer with a second wafer including a complementary metal-oxide-semiconductor (CMOS) device, removing the sacrificial material to expose the first electrodes, depositing the isolation layer on the first electrodes, and forming the second electrodes on the isolation layer.

Abstract: Embodiments of the present disclosure relates to an optical lens and a HUD using the optical lens. The optical lens includes a first lens, a second lens, and an optical waveguide. The first lens includes at least two focal parts with different powers. Since the HUD utilizes the optical lens, the user can maintain a comfortable viewing effect when wearing the HUD for a long time.

Abstract: Embodiments of the present application disclose a method and apparatus for detecting a body. A particular embodiment of the method comprises: acquiring a set of candidate body image region in a target image; for a candidate body image region in the set of candidate body image region: acquiring position information and confidences of candidate body key points in the candidate body image region; determining the candidate body key points within a body contour according to body contour information in the candidate body image region and the acquired position information; and determining a confidence score of the candidate body image region according to a sum of the confidences of the candidate body key points within the body contour; and determining a body image region from the set of candidate body image regions according to the confidence scores of the candidate body image regions in set of the candidate body image regions.

Abstract: The present disclosure provides an arctigenin liquid nano-preparation and a preparation method thereof, and relates to the technical field of pharmaceutical preparation. In the present disclosure, arctigenin is prepared into a liquid nano-preparation, having advantages of distribution of a droplet diameter on nanoscale, significantly increased specific surface area, rapid absorption, and high bioavailability. Meanwhile, nano-preparation entered the body can be captured by wandering leucocytes, and a medicament is delivered to inflammatory lesions through chemiotaxis, thereby conferring a targeted drug delivery feature on the arctigenin and making a therapy more targeted.

Abstract: An apparatus for wafer bonding includes a first bearing table configured to hold a first wafer provided with at least one first alignment mark; a second bearing table, opposite to the first bearing table, and configured to hold a second wafer provided with at least one second alignment mark; an alignment component, located on at least a side of the first or second bearing table, and configured to determine first and second position parameters of the first and second alignment marks, respectively, by using an optical beam; a mobile component, connected to the first and second bearing tables, and configured to adjust, according to the first an second position parameters, a relative position between the first and second wafers until a relative position between the first and second alignment marks satisfies a predetermined bonding condition; and a bonding component, connected to the first and second bearing tables, and configured to bond the first wafer to the second wafer.

Abstract: A method and apparatus for wafer bonding. The method includes that, a first position parameter of a first alignment mark on a first wafer is determined by using a optical beam; a second position parameter of a second alignment mark on a second wafer is determined with the optical beam, the optical beam has a property of transmitting through a wafer; a relative position between the first wafer and the second wafer is adjusted with the optical beam according to the first position parameter and the second position parameter until the relative position between the first alignment mark and the second alignment mark satisfies a predetermined bonding condition; and the first wafer is bonded to the second wafer.

Abstract: The present disclosure provides an arctigenin liquid nano-preparation and a preparation method thereof, and relates to the technical field of pharmaceutical preparation. In the present disclosure, arctigenin is prepared into a liquid nano-preparation, having advantages of distribution of a droplet diameter on nanoscale, significantly increased specific surface area, rapid absorption, and high bioavailability. Meanwhile, nano-preparation entered the body can be captured by wandering leucocytes, and a medicament is delivered to inflammatory lesions through chemiotaxis, thereby conferring a targeted drug delivery feature on the arctigenin and making a therapy more targeted. Moreover, in the present disclosure, the arctigenin is dissolved in an oil phase, and the oil phase is dissolved in water by emulsification to further make the arctigenin dissolve in the water and increase water solubility of the arctigenin.

Abstract: A time-of-flight sensor includes a substrate, a single photon avalanche detection chip, a vertical cavity surface-emitting laser, a first narrowband pass filter glass, and a second narrowband pass filter glass and a resin shell. The single photon avalanche detection chip is attached on the substrate, and the vertical cavity surface-emitting laser is also attached on the substrate. The first narrowband pass filter glass is arranged above the single photon avalanche detection chip, and the second narrowband pass filter glass is arranged above the vertical cavity surface-emitting laser. The resin shell covers the first narrowband pass filter glass and the second narrowband pass filter glass, and an upper surface of the first narrowband pass filter glass and an upper surface of the second narrowband pass filter glass are coplanar with an upper surface of the resin shell.

Abstract: A camera module of reduced size includes a baseplate, an image sensor on the baseplate, a mounting bracket with a through hole, and a circuit board. An inner wall of the through hole extends towards a central axis of the through hole to form a platform, a side of the mounting bracket adjacent to the platform extends outward to form a connecting portion. A multilayer coil, a capacitor, and a resistor are formed on the mounting bracket by laser direct structuring, the multilayer coil is of encircling coils arranged from inside to outside on the mounting bracket and surrounds the through hole. The circuit board is connected with the mounting bracket through the connecting portion. A method for manufacturing a lens module is also disclosed.

Abstract: The present disclosure provides a self-service settlement method, apparatus and storage medium, and relates to the technical field of self-service shopping, wherein the method includes: obtaining a monitoring image acquired by an image capture device and corresponding to commodities to be settled which are placed on a settlement counter; obtaining information of the commodities to be settled through image recognition; obtaining a first weight acquired by a weight detection device, obtaining a second weight based on the information of the commodities to be settled, judging whether the information of the commodities to be settled is matched with commodities to be confirmed according to a weight comparison result; and obtaining purchased commodity settlement information under the condition that the information of the commodities to be settled is matched with the commodities to be confirmed, and performing checkout processing.

Abstract: A touch pad including a touch sensor, a force sensor, a printed circuit board, and a touch controller is provided. The touch sensor includes first and second touch electrode layers, and a first substrate. The first touch electrode layer is arranged above the second touch electrode layer through the first substrate. The force sensor is arranged below the touch sensor, and includes a support structure and at least one pressure electrode layer. The support structure is a deformable structure, and is configured to deform under the action of a pressure applied by a finger when pressing the touch pad to change a pressure sensing capacitance of a finger pressing region, and output a corresponding pressure sensing signal through the at least one pressure electrode layer. The printed circuit board is arranged below the force sensor. The touch controller is mounted and fixed to the printed circuit board.

Abstract: A touch pad including a touch sensor, a force sensor, a printed circuit board, and a touch controller is provided. The touch sensor includes first and second touch electrode layers, and a first substrate. The first touch electrode layer is arranged above the second touch electrode layer through the first substrate. The force sensor is arranged below the touch sensor, and includes a support structure and at least one pressure electrode layer. The support structure is a deformable structure, and is configured to deform under the action of a pressure applied by a finger when pressing the touch pad to change a pressure sensing capacitance of a finger pressing region, and output a corresponding pressure sensing signal through the at least one pressure electrode layer. The printed circuit board is arranged below the force sensor. The touch controller is mounted and fixed to the printed circuit board.

Abstract: A method and an electronic device for pedestrian re-identification are provided. The method may include: collecting a target image set including at least two target images, where each target image includes at least one person; extracting a global feature and a head-shoulder feature of each person in each target image in the target image set, where the global feature is an overall appearance feature, and the head-shoulder feature is a feature of a head part and a shoulder part determining a representation feature of each person in each target image based on the global feature and the head-shoulder feature of each person in each target image; and determining a given person in different target images based on the representation feature of each person in each target image.

Abstract: A coffin is provided, and the coffin includes a coffin body with a top opening and a coffin lid for closing the coffin body. The coffin lid is provided with an air intake hole and an exhaust air hole, the air intake hole and the exhaust air hole are respectively connected to an air intake device and an exhaust air device through pipelines to supply the oxygen required for decomposition of a body and exhaust waste gases. The coffin lid is further provided with an exhaust liquid pipe connected to a peristaltic pump. An oxygen or carbon dioxide sensor, and a hydrogen sulfide or ammonia concentration sensor are installed in an exhaust channel. The coffin body includes a plastic waterproof bag, and the coffin lid is pasted with adhesive plastic film. The function of the plastic waterproof bag is to prevent waste liquids from polluting the coffin body.

Abstract: Approaches for rendering of hypertext transfer protocol (HTTP) headers are disclosed. A method may include receiving a partial HTTP response message generated in response to an HTTP request message. The partial HTTP response message may include an indication of an HTTP header configuration based on one or more security parameters. The method may include retrieving the HTTP header configuration based on the indication of the HTTP header configuration. The HTTP header configuration may indicate one or more HTTP header parameters and one or more header rendering actions associated with the one or more HTTP header parameters. The method may include generating a complete HTTP response message that may include the partial HTTP response message modified by the one or more HTTP header parameters based on the one or more header rendering actions. The method may include transmitting the complete HTTP response message.

Abstract: A stacked semiconductor package has a substrate, a first chip, at least one spacer, a second chip and an encapsulation. The first chip and the second chip are intersecting stacked on the substrate. The at least one spacer is stacked on the substrate to support the second chip. The encapsulation is formed to encapsulate the substrate, the first chip, the at least one spacer and the second chip. The at least one spacer is made of the material of the encapsulation. Therefore, the adhesion between the at least one spacer and the encapsulation is enhanced to avoid the delamination during the reliability test and enhances the reliability of the stacked semiconductor package.

Abstract: Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

Abstract: A method and apparatus for wafer bonding are provided. The method includes: determining a first position parameter of a first alignment mark on a first wafer and a second position parameter of a second alignment mark on a second wafer by using a first type of optical beam; moving the first wafer and the second wafer to be opposite to each other by changing a relative position between the first wafer and the second wafer according to the first position parameter and the second position parameter, to achieve a first alignment of the first alignment mark and the second alignment mark; adjusting the relative position between the first wafer and the second wafer by using a second type of optical beam, to achieve a second alignment of the first alignment mark and the second alignment mark; and bonding the first wafer to the second wafer.

Abstract: A method and apparatus for wafer bonding. The method includes that, a first position parameter of a first alignment mark on a first wafer is determined by using a optical beam; a second position parameter of a second alignment mark on a second wafer is determined with the optical beam, the optical beam has a property of transmitting through a wafer; a relative position between the first wafer and the second wafer is adjusted with the optical beam according to the first position parameter and the second position parameter until the relative position between the first alignment mark and the second alignment mark satisfies a predetermined bonding condition; and the first wafer is bonded to the second wafer.

Abstract: An optical image recognition device and a method for fabricating the same are disclosed. The device includes a flexible printed circuit board, an image sensor, a glue, an optical collimator, a supporting ring, a sealant, and an optical filter. The top of the flexible printed circuit board is provided with a recess, the image sensor is located in the recess, the sidewalls of the image sensor and the recess are separated from each other, and the image sensor is coupled to the flexible printed circuit board through conductive wires. The glue adheres to the flexible printed circuit board and the image sensor and covers the conductive wires. The optical collimator is disposed on the image sensor. The supporting ring, disposed on the flexible printed circuit board, surrounds the glue and the optical collimator. The optical filter, disposed on the sealant, shields the optical collimator and the image sensor.