Abstract: A method for manufacturing an interposer to connect boards or elements with different pin or pad spacings comprises following steps. A mold with first and second plates is provided. The first plate defines a plurality of first units with a plurality of first holes, the second plate defines a plurality of second units with a plurality of second holes. Space between central lines of adjacent first holes is different from that of adjacent second holes. Conducting wires pass through the first holes and the second holes, and molding compound is injected into the mold to keep the conducting wires in place. A molded plate defining a plurality of plate units is thereby formed, and molded pieces constituting interposers are obtained by cutting the molded plate.

Abstract: A method for manufacturing an interposer to connect boards or elements with different pin or pad spacings comprises following steps. A mold with first and second plates is provided. The first plate defines a plurality of first units with a plurality of first holes, the second plate defines a plurality of second units with a plurality of second holes. Space between central lines of adjacent first holes is different from that of adjacent second holes. Conducting wires pass through the first holes and the second holes, and molding compound is injected into the mold to keep the conducting wires in place. A molded plate defining a plurality of plate units is thereby formed, and molded pieces constituting interposers are obtained by cutting the molded plate.

Abstract: A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

Abstract: Panel structure includes a substrate, a piezoelectric material layer and a thin film transistor. The piezoelectric material layer is disposed under the substrate, in which the piezoelectric material layer is configured to generate human recognizable sound waves by vibrating at a human audible frequency in a first time interval, and the piezoelectric material layer is configured to generate ultrasonic waves by vibrating at an ultrasonic frequency in a second time interval. The piezoelectric material layer is used for recognizing human fingerprints when it vibrates at the ultrasonic frequency. The thin film transistor is positioned under and electrically connected to the piezoelectric material layer.

Abstract: Embodiments of wafer bonding methods are disclosed. In an example, a first plasma activation treatment based on oxygen or an inert gas is performed on a front surface of a first wafer and a front surface of a second wafer. After the first plasma activation treatment, a second plasma activation treatment based on water molecules is performed on the front surface of the first wafer and the front surface of the second wafer. After the second plasma activation treatment, the first wafer and the second wafer are bonded such that the treated front surface of the first wafer is in physical contact with the treated front surface of the second wafer.

Abstract: A touch display module utilizing touch recognition by ultrasound includes display unit on substrate, barrier layer on other side of the substrate, and an ultrasound fingerprint sensing unit on the barrier layer. An acoustic impedance of the display unit, the barrier layer, and the ultrasonic fingerprint sensing unit are not all the same, and the differences in impedances enable recognition of touches by analysis of reflected ultrasound. The disclosure also provides an electronic device using the touch display module.

Abstract: A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

Abstract: Embodiments of wafer bonding methods are disclosed. In an example, a first plasma activation treatment based on oxygen or an inert gas is performed on a front surface of a first wafer and a front surface of a second wafer. After the first plasma activation treatment, a second plasma activation treatment based on water molecules is performed on the front surface of the first wafer and the front surface of the second wafer. After the second plasma activation treatment, the first wafer and the second wafer are bonded such that the treated front surface of the first wafer is in physical contact with the treated front surface of the second wafer.

Abstract: A method for connecting stacked circuit boards provides an insulation base as a hollowed annular plate and which has a first surface, a second surface, and a lateral surface. The insulating base defines stepped first grooves on the first surface, stepped second grooves on the second surface, and third grooves on the lateral surface. Insulating base is plated to deposit first pads in the first grooves, second pads in the second grooves, and wiring portions in the third grooves to connect first and second pads. Conductive ink layer is coated on first and second pads, and protective ink layer is coated on wiring portions and insulating base except for first and second pads. First and second circuit boards are provided for attachment to first and second pads respectively. A connecting structure is also provided.

Abstract: A facility for using a mobile device to search video content takes advantage of computing capacity on the mobile device to capture input through a camera and/or a microphone, extract an audio-video signature of the input in real time, and to perform progressive search. By extracting a joint audio-video signature from the input in real time as the input is received and sending the signature to the cloud to search similar video content through the layered audio-video indexing, the facility can provide progressive results of candidate videos for progressive signature captures.

Abstract: A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.

Abstract: Embodiments of apparatus for flipping a semiconductor device and method of using the same are disclosed. In an example, an apparatus for flipping a semiconductor device includes at least one fixture and a rotation unit connected to the at least one fixture. The at least one fixture is configured to hold the semiconductor device by simultaneously pressing a first surface and a second surface of the semiconductor device. The first surface is opposite to the second surface. The rotation unit is configured to rotate the at least one fixture to flip the semiconductor device held by the at least one fixture.

Abstract: A touch control panel (200), which could solve a problem of a reduction in touch control sensitivity caused by a floating state, includes: a driving module (210), a touch control chip (220), a plurality of driving channels (230) and a plurality of sensing channels (240), where the driving module (210) is connected to the touch control chip (220), the plurality of driving channels (230) and the plurality of sensing channels (240) are connected to the touch control chip (220), respectively, and the touch control chip (220) is configured to receive a first driving signal and a second driving signal transmitted by the driving module; the plurality of sensing channels (240) are configured to collect a sensing signal, and the touch control chip (220) is configured to determine coordinate information of a touch point on the touch control panel according to the sensing signal.

Abstract: A gear pump has a pump body, a pump cylinder connected with the pump body, a driving gear and a driven gear meshed with each other and disposed in the pump cylinder, and a rotor driving the driving gear through a driving shaft, and a sealing member. The pump cylinder is located between the pump body and the sealing member. The driving gear is mounted to or integrally formed with the driving shaft. The open end of the sealing member extends out of the outer housing and is sealingly connected with the pump cylinder so as to form a cavity, and the rotor and the driving gear mounted on the driving shaft are received in the cavity and have a coaxiality with the stator.

Abstract: A method for connecting stacked circuit boards includes: a connecting structure is provided, the connecting structure is a bendable and flexible circuit board; a first circuit board and a plurality of supporting posts are provided, each of the supporting posts is dispersedly fixed to a side surface of the first circuit board; a second circuit board is provided, and two peripheral portions of the connecting structure are respectively fixed to the first circuit board and the second circuit board, the peripheral portions of the connecting structure are respectively near two opposite ends of the connecting structure; the connecting structure is bent to flip the second circuit board super-positioned above the first circuit board, and the second circuit board is connected to a free end of each of the supporting posts.

Abstract: A touch display module utilizing touch recognition by ultrasound includes display unit on substrate, barrier layer on other side of the substrate, and an ultrasound fingerprint sensing unit on the barrier layer. An acoustic impedance of the display unit, the barrier layer, and the ultrasonic fingerprint sensing unit are not all the same, and the differences in impedances enable recognition of touches by analysis of reflected ultrasound. The disclosure also provides an electronic device using the touch display module.

Abstract: The disclosure provides a capacitive touch screen module and an electronic terminal. The capacitive touch screen module includes: an externally mounted touch screen, the externally mounted touch screen includes: a cover and a sensing unit matrix located below the cover, and the sensing unit matrix includes a plurality of sensing units. For the capacitive touch screen module and the capacitive touch screen provided by the disclosure, the spatial position of the finger can be accurately and effectively measured by providing the sensing unit matrix with a plurality of sensing units. The multi-finger touch situation can also effectively be identified, and the specific position touched by each finger can be identified. The accuracy and reliability of the capacitive touch screen module are guaranteed, which is beneficial to the commercially promotion and application.

Abstract: Panel structure includes a substrate, a piezoelectric material layer and a thin film transistor. The piezoelectric material layer is disposed under the substrate, in which the piezoelectric material layer is configured to generate human recognizable sound waves by vibrating at a human audible frequency in a first time interval, and the piezoelectric material layer is configured to generate ultrasonic waves by vibrating at an ultrasonic frequency in a second time interval. The piezoelectric material layer is used for recognizing human fingerprints when it vibrates at the ultrasonic frequency. The thin film transistor is positioned under and electrically connected to the piezoelectric material layer.

Abstract: A facility for using a mobile device to search video content takes advantage of computing capacity on the mobile device to capture input through a camera and/or a microphone, extract an audio-video signature of the input in real time, and to perform progressive search. By extracting a joint audio-video signature from the input in real time as the input is received and sending the signature to the cloud to search similar video content through the layered audio-video indexing, the facility can provide progressive results of candidate videos for progressive signature captures.

Abstract: A gear pump has a pump body, a pump cylinder connected with the pump body, a driving gear and a driven gear meshed with each other and disposed in the pump cylinder, and a motor driving the driving gear through a driving shaft. The pump cylinder is located between the pump body and the motor. The driving gear is mounted to or integrally formed with the driving shaft. A first bearing and a second bearing are disposed on respectively sides of the driving gear, one end of driving shaft is received in the first bearing, and the other end of the driving shaft extends through the second bearing and into the motor and forms a shaft of the motor.