Abstract: An integrated circuit chip having improved static discharge protection comprises a semiconductor substrate with a major surface, a plurality of transistors that are integrated into the surface, patterned conductors that interconnect the transistors and route input signals to the transistors, with the patterned conductors including metal pads for receiving the input signals from an external source; wherein the improvement comprises respective diodes which are integrated into the surface directly beneath the metal pads, and which connect the pads to the substrate and conduct electrostatic charge therebetween. With this structure, no additional chip space is required over that which is used by the transistors which are being protected since the diodes are hidden in the normally unused chip space beneath the pads.