Patents by Inventor Xiaonan Zhang

Xiaonan Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210381231
    Abstract: A soft boundary structure is implemented using a resonator structure capable of receiving sound or vibration, establishing resonance coupled with received sound or vibration, and creating a reflection with a pi phase factor. A soft boundary is located on or closely adjacent the resonator structure. The soft boundary cooperates with the resonator structure to attenuate the sound or vibration.
    Type: Application
    Filed: December 23, 2019
    Publication date: December 9, 2021
    Inventors: Ping SHENG, Ho Yiu MAK, Xiaonan ZHANG, Zhen DONG
  • Publication number: 20210368873
    Abstract: A disposable highly-protective oral-nasal mask comprises a fixing part. A notch is formed in the portion, corresponding to an oral cavity, of the fixing part. An oral cavity coverage part is arranged at the notch, corresponding to the oral cavity, of the fixing part, and is detachably connected to the fixing part. A first fold part with upward external folds is further arranged on the oral cavity coverage part. A second fold part with downward external folds is arranged on a nasal cavity coverage part. Two easily deformed components are located in accommodating cavities which are formed in the fixing part in one-to-one correspondence with the easily deformed components. Both accommodating cavities are arranged in the length direction of the fixing part. One accommodating cavity is located between the oral cavity coverage part and the nasal cavity coverage part, and the other accommodating cavity is located above the nasal cavity coverage part.
    Type: Application
    Filed: November 25, 2020
    Publication date: December 2, 2021
    Inventors: Yuanyuan Fan, Jianghui Meng, Enshe Jiang, Xiaonan Zhang, Jing Liu, Weifeng Jiang
  • Patent number: 11103209
    Abstract: An ultrasonic system may include: an oral care device including: a head; a plurality of teeth cleaning elements extending from a first side of the head; and an ultrasound module including an ultrasound transceiver positioned in the head, the ultrasound transceiver configured to produce an ultrasound signal on the first side of the head and to generate a detection signal from a reflected ultrasound signal; and a processing module operably coupled to the ultrasound module to receive the detection signal; wherein the processing module includes a programmable processor configured to process the detection signal non-linearly with respect to time by first identifying a first reflection representing a surface of a tooth and then determining whether a second reflection peak is present in the detection signal at a time prior to the first reflection peak, the second reflection peak representing a biofilm on the surface of the tooth.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: August 31, 2021
    Assignee: Colgate-Palmolive Company
    Inventors: Xiaonan Zhang, Alan Sorrentino, Carlo Daep, Zi Wu
  • Patent number: 10991358
    Abstract: An active sound barrier has at least one passive sound absorber at or near a boundary location. A microphone provides an output to a frequency division module, in which a plural of frequencies are filtered to provide outputs corresponding to frequency segments of the receiving transducer output at respective ones of the frequencies. An active driving circuit drives plural speakers or output transducers at respective ones of the frequencies, with at least a subset of the speakers or output transducers at or close to the barrier. The speakers or output transducers cooperate with the passive sound absorber to reduce noise across a wide frequency band as well as to effect an electrically switchable soft boundary.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: April 27, 2021
    Assignees: THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY, HONG KONG BAPTIST UNIVERSITY
    Inventors: Ping Sheng, Zhen Dong, Xiaonan Zhang, Jie Pan, Ho Yiu Mak, Guancong Ma
  • Patent number: 10789276
    Abstract: Systems and methods for predicting content performance with interest data include receiving a content selection request that includes a client identifier. One or more topical interest categories associated with the client identifier may be used as inputs to a prediction model to predict the likelihood of an online action occurring as a result of third-party content being selected. The predicted likelihood may be used to select third-party content.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: September 29, 2020
    Assignee: Google LLC
    Inventors: Xiaonan Zhang, Shankar Ponnekanti, Oren Eli Zamir, Ting Liu
  • Publication number: 20200211527
    Abstract: An active sound barrier has at least one passive sound absorber at or near a boundary location. A microphone provides an output to a frequency division module, in which a plural of frequencies are filtered to provide outputs corresponding to frequency segments of the receiving transducer output at respective ones of the frequencies. An active driving circuit drives plural speakers or output transducers at respective ones of the frequencies, with at least a subset of the speakers or output transducers at or close to the barrier. The speakers or output transducers cooperate with the passive sound absorber to reduce noise across a wide frequency band as well as to effect an electrically switchable soft boundary.
    Type: Application
    Filed: December 31, 2019
    Publication date: July 2, 2020
    Inventors: Ping SHENG, Zhen DONG, Xiaonan ZHANG, Jie PAN, Ho Yiu MAK, Guancong MA
  • Publication number: 20200189989
    Abstract: An application of syringic acid in promoting the inhibition effect of decanediol on the nitrosification activity of nitrosomonas is provided. By inhibiting the activity of a nitrosomonas, the combined use of syringic acid and 1,9-decanediol can more efficiently inhibit a nitrification process in soil and at the plant rhizosphere, increase the nitrogen use efficiency, and reduce leaching of nitrate nitrogen, thereby reducing the loss of nitrogen and discharge of the greenhouse gas nitrous oxide in a denitrification process. The addition of syringic acid in the present invention can reduce the concentration at which 1,9-decanediol functions under the equivalent condition of nitrification inhibition activity, and thus save the relative input cost.
    Type: Application
    Filed: May 15, 2019
    Publication date: June 18, 2020
    Inventors: Weiming Shi, Xiaonan Zhang, Yufang Lu
  • Publication number: 20190142365
    Abstract: An ultrasonic system may include: an oral care device including: a head; a plurality of teeth cleaning elements extending from a first side of the head; and an ultrasound module including an ultrasound transceiver positioned in the head, the ultrasound transceiver configured to produce an ultrasound signal on the first side of the head and to generate a detection signal from a reflected ultrasound signal; and a processing module operably coupled to the ultrasound module to receive the detection signal; wherein the processing module includes a programmable processor configured to process the detection signal non-linearly with respect to time by first identifying a first reflection representing a surface of a tooth and then determining whether a second reflection peak is present in the detection signal at a time prior to the first reflection peak, the second reflection peak representing a biofilm on the surface of the tooth.
    Type: Application
    Filed: November 12, 2018
    Publication date: May 16, 2019
    Applicant: Colgate-Palmolive Company
    Inventors: Xiaonan ZHANG, Alan SORRENTINO, Carlo DAEP, Zi WU
  • Publication number: 20190043817
    Abstract: The present disclosure provides packages and methods for fabricating packages. A package may comprise a wafer-level package (WLP) layer comprising a WLP contact and a component within the WLP layer associated with a component depth. A conductive pillar is disposed on the WLP contact and comprises an opposite surface that forms an array pad. The package further comprises a mold over the WLP layer and at least partially surrounding the conductive pillar, wherein the mold compound and the array pad form a substantially planar land grid array (LGA) contact surface that is configured to couple the package to a land grid array. The LGA contact surface has a height that is equal to a selected LGA component height, and the selected LGA component height is equal to a difference between a keepout distance associated with a characteristic of the component within the WLP layer and the component depth.
    Type: Application
    Filed: September 14, 2018
    Publication date: February 7, 2019
    Inventors: Manoj KADADE, Haiyong XU, Ruey Kae ZANG, Yue LI, Xiaonan ZHANG, Christine HAU-RIEGE
  • Patent number: 10109584
    Abstract: A semiconductor package according to some examples of the disclosure may include a first body layer, a transformer that may comprise one or more inductors, coupled inductors, or inductive elements positioned above the first body layer. A first ground plane is on a top of the first body layer between the first body layer and the inductive element. The first ground plane may have conductive lines generally perpendicular to a magnetic field generated by the inductive element, and a second ground plane on a bottom of the first body layer opposite the first ground plane. The first and second ground planes may also provide heat dissipation elements for the semiconductor as well as reduce or eliminate eddy current and parasitic effects produced by the inductive element.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: October 23, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Uei-Ming Jow, Young Kyu Song, Jung Ho Yoon, Jong-Hoon Lee, Xiaonan Zhang
  • Patent number: 10051741
    Abstract: An embedded layered inductor is provided that includes a first inductor layer and a second inductor layer coupled to the first inductor layer. The first inductor layer comprises a patterned metal layer that may also be patterned to form pads. The second inductor layer comprises metal deposited in a dielectric layer adjacent the patterned metal layer.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: August 14, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Young Kyu Song, Daeik Daniel Kim, Xiaonan Zhang, Ryan David Lane, Jonghae Kim
  • Publication number: 20180053740
    Abstract: The present disclosure provides packages and methods for fabricating packages. A package may comprise a wafer-level package (WLP) layer comprising first and second WLP contacts and first and second conductive pillars disposed on the first and second WLP contacts. Each conductive pillar may comprise a surface opposite the WLP contact that forms an array pad. The array pads may have different sizes. The package may further comprise a mold over the WLP layer and at least partially surrounding the conductive pillars, wherein the mold compound and the first array pads form a substantially planar LGA contact surface that is configured to couple the package to a land grid array.
    Type: Application
    Filed: August 22, 2016
    Publication date: February 22, 2018
    Inventors: Manoj KAKADE, Haiyong XU, Ruey Kae ZANG, Yue LI, Xiaonan ZHANG, Christine HAU-RIEGE
  • Patent number: 9812752
    Abstract: A flip-chip employing an integrated cavity filter is disclosed comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps. The plurality of conductive bumps is interconnected to at least one metal layer of the semiconductor die to provide a conductive “fence” that defines an interior resonator cavity for providing an integrated cavity filter in the flip-chip. The interior resonator cavity is configured to receive an input RF signal from an input transmission line through an input signal transmission aperture provided in an internal layer in the semiconductor die. The interior resonator cavity resonates the input RF signal to generate the output RF signal comprising a filtered RF signal of the input RF signal, and couples the output RF signal on an output signal transmission line in the flip-chip through an output transmission aperture provided in the aperture layer.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: November 7, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: John Jong-Hoon Lee, Young Kyu Song, Uei-Ming Jow, Sangjo Choi, Xiaonan Zhang
  • Patent number: 9806144
    Abstract: Some implementations provide an integrated device (e.g., semiconductor device) that includes a substrate and an inductor in the substrate. In some implementations, the inductor is a solenoid inductor. The inductor includes a set of windings. The set of windings has an inner perimeter. The set of windings includes a set of interconnects and a set of vias. The set of interconnects and the set of vias are located outside the inner perimeter of the set of windings. In some implementations, the set of windings further includes a set of capture pads. The set of interconnects is coupled to the set of vias through the set of capture pads. In some implementations, the set of windings has an outer perimeter. The set of pads is coupled to the set of interconnects such that the set of pads is at least partially outside the outer perimeter of the set of windings.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: October 31, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Daeik Daniel Kim, Young Kyu Song, Xiaonan Zhang, Jonghae Kim
  • Patent number: 9691694
    Abstract: An integrated circuit device that includes a package substrate and a die coupled to the package substrate. The package substrate includes at least one dielectric layer, a first stack of first interconnects in the at least one dielectric layer, and a second interconnect formed on at least one side portion of the at least one dielectric layer. The first stack of first interconnects is configured to provide a first electrical path for a non-ground reference signal, where the first stack of first interconnects is located along at least one side of the package substrate. The second interconnect is configured to provide a second electrical path for a ground reference signal.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: June 27, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Uei-Ming Jow, Young Kyu Song, Jong-Hoon Lee, Xiaonan Zhang, Mario Francisco Velez
  • Patent number: 9653533
    Abstract: An upper planar capacitor is spaced above a lower planar capacitor by a dielectric layer. A bridged-post inter-layer connector couples the capacitances in parallel, through first posts and second posts. The first posts and second posts extend through the dielectric layer, adjacent the upper and lower planar capacitors. A first level coupler extends under the dielectric layer and couples the first posts together and to a conductor of the lower planar capacitor, and couples another conductor of the lower planar capacitor to one of the second posts. A second level coupler extends above the dielectric layer, and couples the second posts together and to a conductor of the upper planar capacitor, and couples another conductor of the upper planar capacitor to one of the first posts.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: May 16, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Uei-Ming Jow, Young Kyu Song, Jong-Hoon Lee, Xiaonan Zhang
  • Publication number: 20170097982
    Abstract: Systems and methods for predicting content performance with interest data include receiving a content selection request that includes a client identifier. One or more topical interest categories associated with the client identifier may be used as inputs to a prediction model to predict the likelihood of an online action occurring as a result of third-party content being selected. The predicted likelihood may be used to select third-party content.
    Type: Application
    Filed: December 14, 2016
    Publication date: April 6, 2017
    Inventors: Xiaonan Zhang, Shankar Ponnekanti, Oren Eli Zamir, Ting Liu
  • Publication number: 20170077574
    Abstract: A flip-chip employing an integrated cavity filter is disclosed comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps. The plurality of conductive bumps is interconnected to at least one metal layer of the semiconductor die to provide a conductive “fence” that defines an interior resonator cavity for providing an integrated cavity filter in the flip-chip. The interior resonator cavity is configured to receive an input RF signal from an input transmission line through an input signal transmission aperture provided in an internal layer in the semiconductor die. The interior resonator cavity resonates the input RF signal to generate the output RF signal comprising a filtered RF signal of the input RF signal, and couples the output RF signal on an output signal transmission line in the flip-chip through an output transmission aperture provided in the aperture layer.
    Type: Application
    Filed: July 25, 2016
    Publication date: March 16, 2017
    Inventors: John Jong-Hoon Lee, Young Kyu Song, Uei-Ming Jow, Sangjo Choi, Xiaonan Zhang
  • Patent number: 9576718
    Abstract: An inductor structure includes a first set of traces corresponding to a first layer of an inductor, a second set of traces corresponding to a second layer of the inductor, and a third set of traces corresponding to a third layer of the inductor that is positioned between the first layer and the second layer. The first set of traces includes a first trace and a second trace that is parallel to the first trace. A dimension of the first trace is different from a corresponding dimension of the second trace. The second set of traces is coupled to the first set of traces. The second set of traces includes a third trace that is coupled to the first trace and to the second trace. The third set of traces is coupled to the first set of traces.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: February 21, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Uei-Ming Jow, Young Kyu Song, Jong-Hoon Lee, Jung Ho Yoon, Sangjo Choi, Xiaonan Zhang
  • Patent number: 9549017
    Abstract: Systems and methods for predicting content performance with interest data include receiving a content selection request that includes a client identifier. One or more topical interest categories associated with the client identifier may be used as inputs to a prediction model to predict the likelihood of an online action occurring as a result of third-party content being selected. The predicted likelihood may be used to select third-party content.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: January 17, 2017
    Assignee: Google Inc.
    Inventors: Xiaonan Zhang, Shankar Ponnekanti, Oren Eli Zamir, Ting Liu