Abstract: A polyurethane composition including, on the basis of the total weight of the composition: A) 20-50 weight % of a polyurethane prepolymer PU, which is a reaction product of a polyether polyol with at least two aromatic polyisocyanates or mixture of the reaction products, wherein the polyether polyol includes a polyether diol and a polyether triol, and the weight ratio of the polyether triol to the polyether diol ranges from 4:1 to 13:1; and B) 12.5% to 17.5% of carbon black on the basis of the total weight of the composition. Also, the use of carbon black in polyurethane compositions for reducing blistering during curing and increasing matte effect.

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.

Abstract: Disclosed is a gas insulated substation cabinet for precise air supply control, comprising: cabinet doors arranged at one side of a cabinet body, a sealing mechanism arranged between a frame of the cabinet doors and a frame of the cabinet body, a supporting mechanism arranged in the cabinet body, a plurality of guiding mechanisms fixedly connected with the cabinet body inside along a vertical direction at equal intervals, electronic components respectively arranged in the guiding mechanisms, an air inlet device including a communicated pipeline, an air inlet mechanism on a top of communicated pipeline, an external air conditioner, and a filter mechanism at a bottom of the communicated pipeline, an air collecting device arranged at a bottom of an inner cavity of the cabinet and two air outlet devices respectively arranged on both sides of a bottom of the cabinet body.

Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.

Abstract: Disclosed is a method for rapidly amplifying CD8+T cells and functional cell subpopulations thereof in vitro. A TLR1/2 agonist, a TLR2/6 agonist and a TLR5 agonist or a combination of above agonists is added to a conventional culture system for in-vitro amplification of CD8+T cells. Recombinant cytokines IL-2, IL-7 and IL-15 as well as magnetic beads coated with an anti-human CD3 antibody and an anti-human CD28 antibody can be further added to the culture system for continuous co-stimulation.

Abstract: A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Abstract: Provided herein are compounds of Formula (I): and forms thereof, wherein w1, w2, w3, w4, w5, w6 and w7 are as defined herein, including compositions thereof and uses therewith for treating spinal muscular atrophy.

Abstract: Embodiments of this application disclose a semiconductor device and a manufacturing method thereof. The semiconductor device includes a substrate, a first nitride semiconductor layer disposed on the substrate and having a first bandgap, and a second nitride semiconductor layer disposed on the first nitride semiconductor layer and having a second bandgap. The second bandgap is larger than the first bandgap. The semiconductor device further includes a gate contact disposed over the second nitride semiconductor layer and a first field plate disposed over the gate contact. The first field plate has a first surface facing the substrate, a second surface facing the substrate, and a protruded portion. The protruded portion has a bottom surface facing the substrate. The bottom surface is located between the first surface and the second surface.

Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Abstract: A method for acquiring an object's attention information includes: displaying a three-dimensional (3D) virtual image in a virtual scene, the 3D virtual image being a 3D image corresponding to a virtual object in the virtual scene mapped from a physical object; determining a target object of the 3D virtual image displayed in a display area; and based on the target object, determining an attention focus object of the 3D virtual image, the attention focus object belonging to at least a part of the 3D virtual image.

Abstract: The present description relates to compounds of Formula (I), forms, and pharmaceutical compositions thereof and methods of using such compounds, forms, or compositions thereof for treating or ameliorating Huntington's disease.

Abstract: A heat pump system is provided. The heat pump system comprises a compressor, a first heat exchanger, a second heat exchanger, a third heat exchanger and a six-way valve. The compressor comprises an air suction port and an air discharge port. The first heat exchanger is arranged in a first circulation path, the second heat exchanger is arranged in a second circulation path, and the third heat exchanger is arranged in a third circulation path, wherein the first circulation path, the second circulation path and the third circulation path are parallel paths. A first end of the first circulation path, a first end of the second circulation path and a first end of the third circulation path are connected to the six-way valve and are in controllable communication with the air suction port and the air discharge port of the compressor by means of the six-way valve.

Abstract: Disclosed is a preparation technology for an artificial eyelash with a naturally arc-shaped stem, which automatically presses and sticks artificial eyelash by providing a transmission mechanism for transmitting a double-sided adhesive tape, a limiting mechanism for storing the artificial eyelash, a pressing mechanism for pressing the double-sided adhesive tape to the limiting mechanism to stick the artificial eyelash and a control mechanism; automatically synthesizes the artificial eyelash by providing a feeding roller assembly, a distributing roller assembly, a synthesis extrusion roller assembly, a recycling roller assembly and a collecting roller; and automatically glues and shears the artificial eyelash by eyelash thread rollers, front limiting rollers, glue injection mechanisms, rear limiting rollers, drying mechanisms and finished product rollers symmetrically arranged on two sides of a multi-layer eyelash sticker.

Abstract: A TFF2 protein and an IFN-? protein are combined to treat a novel coronavirus infection. A product comprises: (a) an IFN-? protein; (b) a TFF2 protein; and (c) an optional pharmaceutically acceptable carrier. Provided are an application of a combination of IFN-? protein and TFF2 protein in the preparation of a product for the treatment of a novel coronavirus infection and related diseases, and a method for using the product to treat a novel coronavirus infection and related diseases. The foregoing combination, application, and method have excellent therapeutic effects on novel coronavirus infections, and have application prospects and social benefits.

Abstract: Methods and an apparatus for removing particles or photoresist on substrates. In an embodiment, a method comprises the following steps: transferring one or more substrates into a DIO3 solution accommodated in a DIO3 bath; after the one or more substrates are processed in the DIO3 bath, taking the one or more substrates out from the DIO3 bath and transferring the one or more substrates into a SPM solution accommodated in a SPM bath; after the one or more substrates are processed in the SPM bath, taking the one or more substrates out from the SPM bath and rinsing the one or more substrates; and transferring the one or more substrates to one or more single chambers to perform single substrate cleaning and drying process. The method combines DIO3 and SPM in one cleaning sequence, which can remove particles or photoresist, especially remove photoresist treated by medium dose or high dose of ion implantation.

Abstract: A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate (20010) being cleaned.

Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.