Abstract: A semi-wafer level packaging method comprises the steps of providing a wafer; grinding a back side of the wafer; forming a metallization layer; removing a peripheral ring; bonding a first tape; applying a dicing process; bonding a second tape; removing the first tape; bonding a supporting structure; bonding a third tape; removing the second tape; and applying a singulation process. A semi-wafer level packaging method comprises the steps of providing a wafer; attaching a carrier wafer to the wafer; grinding a back side of the wafer; forming a metallization layer; applying a dicing process; bonding a supporting structure; removing the carrier wafer; bonding a tape; and applying a singulation process.

Abstract: The disclosed systems and methods for intelligent heterogeneous computation directed to receiving monitoring data and a set of training data, wherein the monitoring data includes an occupancy rate of a preprocessed data queue and a utilization factor of accelerating devices, generating a resource computation job list in accordance with the monitoring data, forwarding jobs, in the resource computation job list to be executed on a central processing unit (CPU), to a CPU worker queue, forwarding control messages to the CPU worker queue, wherein the control messages are associated with jobs in the resource computation job list to be executed on the accelerating devices, and executing, by the accelerating devices, jobs in the resource computation job list to be executed on the accelerating devices.

Abstract: A semi-wafer level packaging method comprises the steps of providing a wafer; grinding a back side of the wafer; forming a metallization layer; removing a peripheral ring; bonding a first tape; applying a dicing process; bonding a second tape; removing the first tape; bonding a supporting structure; bonding a third tape; removing the second tape; and applying a singulation process. A semi-wafer level packaging method comprises the steps of providing a wafer; attaching a carrier wafer to the wafer; grinding a back side of the wafer; forming a metallization layer; applying a dicing process; bonding a supporting structure; removing the carrier wafer; bonding a tape; and applying a singulation process.

Abstract: A semiconductor package comprises a lead frame, a chip, and a molding encapsulation. The lead frame comprises one or more die paddles, a first plurality of leads, and a second plurality of leads. A respective end surface of each lead of the first plurality of leads and the second plurality of leads is plated with a metal. A first respective window on a first side of each lead of the first plurality of leads and the second plurality of leads is not plated with the metal. A second respective window on a second side of each lead of the first plurality of leads and the second plurality of leads is not plated with the metal. A method for fabricating a semiconductor package comprises the steps of providing a lead frame array, mounting a chip, forming a molding encapsulation, and applying a cutting process or a punching process.

Abstract: The disclosed systems and methods are directed to generating cache IDs for each of a plurality of AI training pipelines, accessing training data elements included in a training data set, generating IDs corresponding to the training data elements, receiving the data IDs and an associated cache ID, randomizing the data IDs, selecting a subset of the randomized data IDs, fetching the training data elements previously cached by a cache node, receiving a portion of the training data elements present in the caching server corresponding to the subset of randomized data IDs, forwarding the portion of the training data elements present in the caching server to at least one consumer node, fetching the remaining training data elements associated with the subset of randomized data IDs from the training data set, and forwarding the remaining training data elements to at least one transformation node for training the neural network.

Abstract: The disclosed computing node comprises a processor and a non-transitory storage medium storing instructions executable by the processor. A method and a system are also disclosed. A subset of a plurality of conventional redo records, corresponding to received write requests, is selected based on an identical data location identifier. The conventional redo records of such selected subset are combined into a consolidated redo record. The consolidated redo record is then transmitted to a target node for processing.

Abstract: A semiconductor package fabrication method comprises the steps of providing a wafer, applying a seed layer, forming a photo resist layer, plating a copper layer, removing the photo resist layer, removing the seed layer, applying a grinding process, forming metallization, and applying a singulation process. A semiconductor package comprises a silicon layer, an aluminum layer, a passivation layer, a polyimide layer, a copper layer, and metallization. In one example, an area of a contact area of a gate clip is smaller than an area of a gate copper surface. The area of the contact area of the gate clip is larger than a gate aluminum surface. In another example, an area of a contact area of a gate pin is larger than an area of a gate copper surface. The area of the contact area of the gate pin is larger than a gate aluminum surface.

Abstract: A semiconductor package fabrication method comprises the steps of providing a wafer, applying a seed layer, forming a photo resist layer, plating a copper layer, removing the photo resist layer, removing the seed layer, applying a grinding process, forming metallization, and applying a singulation process. A semiconductor package comprises a silicon layer, an aluminum layer, a passivation layer, a polyimide layer, a copper layer, and metallization. In one example, an area of a contact area of a gate clip is smaller than an area of a gate copper surface. The area of the contact area of the gate clip is larger than a gate aluminum surface. In another example, an area of a contact area of a gate pin is larger than an area of a gate copper surface. The area of the contact area of the gate pin is larger than a gate aluminum surface.

Abstract: A semiconductor package comprises a lead frame, a first field-effect transistor (FET), a second low side FET, a first high side FET, a second high side FET, a first metal clip, a second metal clip, and a molding encapsulation. The semiconductor package further comprises an optional integrated circuit (IC) controller or an optional inductor. A method for fabricating a semiconductor package. The method comprises the steps of providing a lead frame; attaching a first low side FET, a second low side FET, a first high side FET, and a second high side FET to the lead frame; mounting a first metal clip and a second metal clip; forming a molding encapsulation; and applying a singulation process.

Abstract: A semiconductor package comprises a lead frame, a first field-effect transistor (FET), a second low side FET, a first high side FET, a second high side FET, a first metal clip, a second metal clip, and a molding encapsulation. The semiconductor package further comprises an optional integrated circuit (IC) controller or an optional inductor. A method for fabricating a semiconductor package. The method comprises the steps of providing a lead frame; attaching a first low side FET, a second low side FET, a first high side FET, and a second high side FET to the lead frame; mounting a first metal clip and a second metal clip; forming a molding encapsulation; and applying a singulation process.

Abstract: A semiconductor package has a plurality of pillars or portions of a plurality of lead strips, a plurality of semiconductor devices, one or two molding encapsulations and a plurality of electrical interconnections. The semiconductor package excludes a wire. The semiconductor package excludes a clip. A method is applied to fabricate semiconductor packages. The method includes providing a removable carrier; forming a plurality of pillars or a plurality of lead strips; attaching a plurality of semiconductor devices; forming one or two molding encapsulations; forming a plurality of electrical interconnections and removing the removable carrier. The method may further include a singulation process.

Abstract: A semiconductor package comprises a land grid array substrate, a first VDMOSFET, a second VDMOSFET, and a molding encapsulation. The land grid array substrate comprises a first metal layer, a second metal layer, a third metal layer, a plurality of vias, and a resin. A series of drain pads at a bottom surface of the semiconductor package follow a “drain 1, drain 2, drain 1, and drain 2” pattern. A method for fabricating a semiconductor package. The method comprises the steps of providing a land grid array substrate; mounting a first VDMOSFET and a second VDMOSFET on the land grid array substrate; applying a wire bonding process; forming a molding encapsulation; and applying a singulation process.

Abstract: The disclosed computing node comprises a processor and a non-transitory storage medium storing instructions executable by the processor. A method and a system are also disclosed. A subset of a plurality of conventional redo records, corresponding to received write requests, is selected based on an identical data location identifier. The conventional redo records of such selected subset are combined into a consolidated redo record. The consolidated redo record is then transmitted to a target node for processing.

Abstract: A semiconductor package comprises a land grid array substrate, a first VDMOSFET, a second VDMOSFET, and a molding encapsulation. The land grid array substrate comprises a first metal layer, a second metal layer, a third metal layer, a plurality of vias, and a resin. A series of drain pads at a bottom surface of the semiconductor package follow a “drain 1, drain 2, drain 1, and drain 2” pattern. A method for fabricating a semiconductor package. The method comprises the steps of providing a land grid array substrate; mounting a first VDMOSFET and a second VDMOSFET on the land grid array substrate; applying a wire bonding process; forming a molding encapsulation; and applying a singulation process.

Abstract: A semiconductor package comprises a lead frame, a first field-effect transistor (FET), a second low side FET, a first high side FET, a second high side FET, a first metal clip, a second metal clip, and a molding encapsulation. The semiconductor package further comprises an optional integrated circuit (IC) controller or an optional inductor. A method for fabricating a semiconductor package. The method comprises the steps of providing a lead frame; attaching a first low side FET, a second low side FET, a first high side FET, and a second high side FET to the lead frame; mounting a first metal clip and a second metal clip; forming a molding encapsulation; and applying a singulation process.

Abstract: Techniques for data replication from a primary system to a standby system. A first buffer portion of a transaction log buffer is allocated to a first transaction at a primary system. Upon determining that the first buffer portion is fully formed, before the log data is written to the storage on the primary system, and before the transaction log buffer is entirely full, the log data in the first buffer portion is transmitted to the standby system, from the primary system. Upon writing the log data to the storage on the primary system and after the log data in the first buffer portion is transmitted to the standby system, a notification is transmitted to the standby system, from the primary system, where the standby system is configured to process the received log data responsive to receiving the notification from the primary system.

Abstract: This application provides a data processing method and apparatus. The method includes: receiving, by a master storage node, information that is about a first transaction and that is sent by a read-write node, where the information about the first transaction is used to request to perform a write operation on first data stored on the master storage node; determining, by the master storage node, the first data based on the information about the first transaction, and executing the first transaction; generating, by the master storage node, first transaction status metadata when the first transaction ends, where the first transaction status metadata includes identification information of expired data and identification information of the first transaction; and sending, by the master storage node, the first transaction status metadata to at least one read-only node. According to the data processing method and apparatus, a read delay of a read-only node can be eliminated.

Abstract: A semiconductor package has a plurality of pillars or portions of a plurality of lead strips, a plurality of semiconductor devices, one or two molding encapsulations and a plurality of electrical interconnections. The semiconductor package excludes a wire. The semiconductor package excludes a clip. A method is applied to fabricate semiconductor packages. The method includes providing a removable carrier; forming a plurality of pillars or a plurality of lead strips; attaching a plurality of semiconductor devices; forming one or two molding encapsulations; forming a plurality of electrical interconnections and removing the removable carrier. The method may further include a singulation process.

Abstract: A semiconductor package has a plurality of pillars or portions of a plurality of lead strips, a plurality of semiconductor devices, one or two molding encapsulations and a plurality of electrical interconnections. The semiconductor package excludes a wire. The semiconductor package excludes a clip. A method is applied to fabricate semiconductor packages. The method includes providing a removable carrier; forming a plurality of pillars or a plurality of lead strips; attaching a plurality of semiconductor devices; forming one or two molding encapsulations; forming a plurality of electrical interconnections and removing the removable carrier. The method may further include a singulation process.

Abstract: Methods and systems are described for managing a shared database. One or more processing nodes may access a shared database. A common log node may manage the shared database. The common log node may validate database operations requested by the one or more processing nodes. During validation, the common log node may detect conflicts that occur between database operations requested by the one or more processing nodes.