Abstract: A sand column grouting filtration experimental device includes a sand column, a grout injection structure connected above the sand column and a grout exit structure connected below the sand column, the sand column comprises a plurality of connecting units; Four screws are provided around the sand column, and the four screws run through the grout injection structure and grout exit structure; A bottom plate is provided below the grout exit structure, a support plate one and a support plate two are provided between the bottom plate and the grout exit structure, and a sand column consolidation structure is provided between the support plate two and the support plate one. The experiment adopts a segmented combined sand column, in addition to ensuring the experimental results that can be obtained by the general sand column, segmented study of the interception and percolation effect of cement slurry in the sand column is implemented.

Abstract: The present disclosure provides a welding-pad repair device and a welding-pad repair method. The device includes: a de-soldering component, an insulating layer removal component and a cleaning component; a welding-pad coating mechanism for forming an initial welding pad, where the welding-pad coating mechanism includes a coating component and a curing component; and a welding-pad encapsulation mechanism for performing an encapsulation operation on a welding pad and a circuit exposed at a periphery of the initial welding pad to form a new welding pad having a predetermined exposure pattern. Embodiments of the present disclosure provide a welding-pad repair device and a welding-pad repair method capable of effectively repairing defective pads before and after dies are bonded, thereby solving problems of low product yield and high cost caused by defective welding pads.

Abstract: A display substrate is provided, including: a base substrate, and a first semiconductor layer, a first conductive layer, a second semiconductor layer and a fourth conductive layer sequentially arranged on the base substrate. The display substrate includes first and third transistors. The first transistor includes a first active layer in the second semiconductor layer, and first bottom and top gate electrodes respectively on opposite sides of the first active layer. The third transistor includes a third active layer in the first semiconductor layer and a third gate electrode, the third active layer containing a polysilicon semiconductor material. The fourth conductive layer is on a side of the first top gate electrode away from the base substrate, and includes second and third conductive components. The first transistor is electrically connected to the third gate electrode of the third transistor through the second and third conductive components.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.

Abstract: A resin matrix composite used as anti-ablation coating material and its preparation method is provided. The resin matrix composite is a mixture of yttria-stabilized zirconia (YSZ), a resin, Cu, and SiO2. The mixture is uniform and include spherical particles or spherical aggregates. A method for preparing a resin matrix composite for anti-ablation coating includes mixing YSZ, a resin, Cu, and SiO2 to obtain a mixed powder and performing spray granulation of the mixed powder to obtain a resin matrix composite including spherical particles or spherical agglomerates.

Abstract: A display apparatus includes a display panel having a first display region, a second display region and an opening region. When the display apparatus is in a black state, the first display region has a first luminance value I1, the second display region and the opening region have a first luminance difference value DI1, the first display region and the second display region have a second luminance difference value DI2, and each of a ratio of DI1 to I1 and a ratio of DI2 to I1 ranges from 0.001 to 0.1.

Abstract: Disclosed in the present invention is a non-invasive detection method for screening for a well-developed blastocyst. A DNA methylation profile of a few of trophectoderm cells in a blastocyst is detected, and the average methylation level and the methylation pattern of embryos identified as having a good morphology in Gardner morphological blastocyst grading process are used as the standard for screening for well-developed blastocysts. The nearer the methylation level of the trophectoderm cells of the blastocyst to be tested approaches the methylation level or state of the good embryo, the better the embryo development is and the higher the suitability for being implanted into a maternal subject is. Furthermore, results of methylation sequencing may be analyzed to determine whether a chromosome is abnormal, so as to directly exclude chromosome-abnormal embryos.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, a second encapsulant, and a conductive terminal. The first die includes a first connector, and the second die includes a second connector. The first encapsulant includes: a first portion, on the second die; a second portion, sandwiched between a first sidewall of the first die and a first sidewall of the second die; and a third portion, covering a second sidewall of the second die. The second encapsulant, laterally encapsulating the first die, the second die and the first encapsulant. The conductive terminal, electrically connected to the first die and the second die through a redistribution layer (RDL) structure. The third portion of first encapsulant is sandwiched between the second sidewall of the second die and the second encapsulant.

Abstract: Embodiments disclosed herein relate to reducing power consumption of an electronic device scanning for wireless communication signals while maintaining or even improving an efficiency of the scanning operations. To do so, the electronic device may include more than one scan core, such as a main core and a receiving core. The receiving core may have limited functionality compared to the main core. For example, the receiving core may only receive wireless signals (including scanning for wireless signals). That is, the receiving core may not support certain operations that consume relative high power that are supported by the main core, such as transmission of signals. In this way, operation of the receiving core, either in place of or in addition to the main core, may reduce power consumption of the electronic device by avoiding high power consuming operations, such as data transmission, while scanning for various signals.

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a redistribution layer, a semiconductor die, conducting connectors, dummy bumps and an underfill. The semiconductor die is disposed on a top surface of the redistribution layer and electrically connected with the redistribution layer. The conducting connectors are disposed between the semiconductor die and the redistribution layer, and are physically and electrically connected with the semiconductor die and the redistribution layer. The dummy bumps are disposed on the top surface of the redistribution layer, beside the conducting connectors and under the semiconductor die. The underfill is disposed between the semiconductor die and the redistribution layer and sandwiched between the dummy bumps and the semiconductor die. The dummy bumps are electrically floating. The dummy bumps are in contact with the underfill without contacting the semiconductor die.

Abstract: Semiconductor structure and method of forming the same are provided. The structure includes a substrate. The substrate includes a first region and a second region arranged along a first direction. The first region includes a first isolation area. The second region includes a second isolation area. A central axis of the first isolation area parallel to the first direction does not coincide with a central axis of the second isolation area parallel to the first direction. The structure also includes a first gate structure on the first region, a first metal layer and a second metal layer on two sides of the first gate structure, a second gate structure on the second region, a third metal layer and a fourth metal layer on two sides of the second gate structure, a first isolation structure on the first isolation area, and a second isolation structure on the second isolation area.

Abstract: An application of Bacillus coagulans in preparing a medication for improving functional decline of organisms caused by hyperglycemia and hyperlipidemia is provided in the present application, belonging to the technical field of microbial strains. A Bacillus coagulans is disclosed in the present application, and the Bacillus coagulans is preserved in the China General Microbiological Culture Collection Center (CGMCC), Institute of Microbiology Chinese Academy of Sciences on Nov. 10, 2021, with a preservation number of CGMCC No.23766 and a preservation address of Institute of Microbiology, Chinese Academy of Sciences, No.3, No.1 Beichen West Road, Chaoyang District, Beijing.

Abstract: A package module includes an interposer, a plurality of semiconductor dies on the interposer and including a semiconductor die upper surface, an upper molding material layer on the plurality of semiconductor dies and including a recessed upper surface that is recessed from the semiconductor die upper surface, and a backside metal layer on the recessed upper surface of the upper molding material layer.

Abstract: A wearable device includes: a main structure, two straps, a connecting piece and a driving structure. The two straps are respectively connected to two ends of the main structure; the connecting piece is provided with a mounting cavity, a slide cavity in communication with the mounting cavity, and two communicating ports, each of the two straps having one end thereof distal to the main structure movably passing through one of the communicating ports to extend into the slide cavity, and the main structure, the two straps and the connecting piece enclosing a wearable space: the driving assembly is provided in the mounting cavity, the two transmission parts being provided spaced apart in the slide cavity and in transmission connection with the driving assembly, each of the two transmission parts being in respective transmission connection with the two straps.

Abstract: A scan circuit is provided, including first, second and third control signal driving circuits; wherein, in a first region, the first control signal driving circuit includes L stages, L being an integer ?1; in a second region, the second control signal driving circuit includes M1 stages and the third control signal driving circuit includes M2 stages, M1, M2 each being an integer ?1; in a third region, the first control signal driving circuit includes N1 stages, the second control signal driving circuit includes N2 stages, and the third control signal driving circuit includes N3 stages, N1, N2, N3 each being an integer ?2; and the first region, the second region, and the third region surround a first portion, a second portion, and a third portion of a perimeter of a display region, respectively, the first portion, the second portion, and the third portion being at least partially non-overlapping.

Abstract: A first interface comprising a call screen is displayed on an electronic device. First prompt information is displayed on the first interface following receiving information about a first red packet, the first prompt information provides a prompt to open the first red packet. Opening detail information of the first red packet is displayed on the first interface following an input for the first prompt information.

Abstract: A wireless device may use a 5 GHz frequency band to support both Wi-Fi and Bluetooth. The 5 GHz frequency band may be divided into two portions (e.g., high sub-band and low sub-band). A Wi-Fi module of the wireless device may perform a roam scan on a first sub-band to determine attempt to find a candidate channel that meets a target criteria. When the candidate channel that meets the target criteria is found on the first sub-band, the Wi-Fi module may join the candidate channel. If no acceptable candidate channel is found, the wireless device may perform a band switch protocol to allow the Wi-Fi module to preform a roam scan on a second sub-band.

Abstract: A DNA methylation profile of a few of trophectoderm cells in a blastocyst is detected, and the average methylation 5 level and the methylation pattern of embryos identified as having a good morphology in Gardner morphological blastocyst grading process are used as the standard for screening for well-developed blastocysts. The nearer the methylation level of the trophectoderm cells of the blastocyst to be tested approaches the methylation level or state of the good embryo, the better the embryo development is and the higher the 10 suitability for being implanted into a maternal subject is.

Abstract: Disclosed is a pixel circuit arranged in a display substrate, which comprises a first driving mode and a second driving mode. Content displayed in the display substrate comprises multiple display frames. In the first driving mode and the second driving mode, the display frames comprise refresh frames. A signal of a second scanning line is the same as that of a third scanning line. The time of which the signal of the second scanning line is an active level signal comprises a first refresh time period, a second refresh time period and a third refresh time period, which sequentially occur at intervals. During the second refresh time period, a signal of a first scanning line is an inactive level signal. The voltage of a signal at a reset voltage end is a positive voltage, and the voltage of a signal at a first initial voltage end is a negative voltage.

Abstract: Encrypting keystroke data on a computing device involves receiving a key identifier (ID) from a keyboard device, creating a keystroke cipher segment comprising a primary authentication code and the key ID, and encrypting the keystroke cipher segment to generate an encrypted keystroke cipher segment. The keystroke cipher segment is included within a keystroke message and transmitted from the keyboard device driver to a window event handler via an input/output (I/O) message channel native to an operating system running on the computing device. The encrypted keystroke cipher segment is decrypted to identify the key ID, which is transmitted to a first application for further processing.