Patents by Inventor Yang Yu

Yang Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240058399
    Abstract: An application of a Lactobacillus fermentum in preparing products for preventing and/or treating thrombosis is provided in the present application, belonging to the technical field of microorganisms. The present application also discloses an inhibitory effect of a strain of Lactobacillus fermentum CQPC04 (LF-CQPC04) on thrombosis.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Inventors: Xin MA, Yang YU, Xueping YU, Xin ZHAO
  • Publication number: 20240064519
    Abstract: This application provides a method and an apparatus for verifying a personal identification number PIN code. When a first SIM card is inserted into a powered-on terminal device or the terminal device into which the first SIM card is inserted is powered on, whether a mapping relationship includes a PIN code to which a first ICCID of the first SIM card is mapped is queried; the PIN code is sent to the first SIM card if the mapping relationship includes the PIN code to which the first ICCID is mapped; and a verification result of the PIN code from the first SIM card is received.
    Type: Application
    Filed: December 14, 2021
    Publication date: February 22, 2024
    Inventors: Yuanfeng Li, Fengguang Qiu, Weilin Gong, Zeping Xu, Xiaotao Yan, Pingping Gu, Yang Yu, Yingfeng Hu
  • Patent number: 11908835
    Abstract: A method of manufacturing a semiconductor structure includes the following operations. A substrate is provided. A first conductive pillar, a second conductive pillar arid a third conductive pillar are disposed over the substrate. The first conductive pillar comprises a first height, the second conductive pillar comprises a second height, and the third conductive pillar comprises a third height. A first die is disposed over the first conductive pillar. A second die is disposed over the second conductive pillar. A first surface of the first die and a second surface of the second die are at substantially same level.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: February 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang
  • Patent number: 11909163
    Abstract: A radio frequency laser includes: a power box, a radio frequency cavity, an electrode, and a first metal blocking ring. A bottom plate of the power box is provided with a first installation hole and a first installation groove, and the first installation groove is arranged around the first installation hole. A top plate of the radio frequency cavity is provided with a second installation hole and a second installation groove, and the second installation groove is arranged around the second installation hole. When the power box is assembled with the radio frequency cavity, the second installation hole corresponds to the first installation hole, and the second installation groove corresponds to the first installation groove.
    Type: Grant
    Filed: November 2, 2023
    Date of Patent: February 20, 2024
    Assignee: Jilin Yongli Laser Technology Co., Ltd.
    Inventors: Yang Yu, Jie Liu, Huili Sun, Zhicheng Zhang, Qingdong Cui, Shangyong Sun
  • Publication number: 20240047322
    Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes an integrated substrate and a package component. The integrated substrate includes a substrate component laterally covered by an insulating encapsulation, a redistribution structure disposed over the substrate component and the insulating encapsulation, first conductive joints coupling the redistribution structure to the substrate component, and a buffer layer disposed on a lowermost dielectric layer of the redistribution structure and extending downwardly to cover an upper portion of each of the first conductive joints. A lower portion of each of the first conductive joints connected to the upper portion is covered by the insulating encapsulation. The package component disposed over and electrically coupled to the redistribution structure includes a semiconductor die laterally covered by an encapsulant.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 8, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang, Hao-Cheng Hou, Jung-Wei Cheng, Tsung-Ding Wang
  • Publication number: 20240043511
    Abstract: The present application provides a diagnosis and treatment method for chronic inflammation. The technical solution provided by the present application is an application of a reagent in preparing a product for preventing and/or treating chronic inflammation diseases: the reagent is a substance for inhibiting the activity of an abnormal content of IFP35 and/or NMI which is secreted outside the cell as an inflammatory factor. Experiments prove that using antibodies and the like to inhibit the activity of an abnormal content of IFP35 and/or NMI which is secreted outside the cell as an inflammatory factor can effectively treat chronic inflammation diseases. In the present application, IFP35 and/or NMI are also used as a target spot, providing a diagnosis/auxiliary diagnosis and treatment method and tool for infection of viruses, particularly novel coronavirus-19 (COVID-19).
    Type: Application
    Filed: March 31, 2020
    Publication date: February 8, 2024
    Applicant: Sun Yat-sen University
    Inventors: Huanhuan Liang, Yingfang Liu, Yang Yu
  • Publication number: 20240048444
    Abstract: Embodiments of this application disclose example communication port management methods and example related devices to manage a plurality of communication ports on a communication device connection panel. One example method includes obtaining at least two local images of the communication device connection panel, where each local image corresponds to one local area of the communication device connection panel, and where each of the plurality of communication ports is attached with a port label that identifies each communication port. An overall port information matrix of the communication device connection panel is generated based on the at least two local images, where the overall port information matrix indicates a port identifier of each communication port in the plurality of communication ports and a relative location of each communication port in an overall area of the communication device connection panel. Communication port management is performed based on the overall port information matrix.
    Type: Application
    Filed: October 12, 2023
    Publication date: February 8, 2024
    Inventors: Yang YU, Qinxian LIN, Yida WEN
  • Publication number: 20240048260
    Abstract: This application relates to clock synchronization methods optical head ends, and optical terminals. In an example method, the optical head end receives a first packet from a controller. The first packet includes service data to be transmitted to a plurality of slave stations. The optical head end generates a second packet based on the first packet. The second packet includes the service data and time information. The time information indicates an execution time point at which the plurality of slave stations perform an operation based on the service data. The optical head end further sends the second packet to the plurality of optical terminals to request the plurality of optical terminals to control the plurality of slave stations to perform the operation at the execution time point based on the service data.
    Type: Application
    Filed: October 18, 2023
    Publication date: February 8, 2024
    Inventors: Yang YU, Chao ZHAO, Su WANG
  • Publication number: 20240045262
    Abstract: A liquid crystal display panel and a vehicle-mounted liquid crystal display device are provided. In the liquid crystal display panel, in an array substrate and/or a color filter substrate, a number of reflective interfaces in a functional area is greater than a number of reflective interfaces in a display area. Under the condition that an infrared optical transmittance is not affected, a reflectivity of light in the functional area is improved compared to the display area. This reduces or even eliminates a brightness difference between the functional area and the display area when a display is completely black.
    Type: Application
    Filed: November 25, 2021
    Publication date: February 8, 2024
    Applicant: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Li Xu, Yang Yu, Song Li
  • Patent number: 11894524
    Abstract: This application provides a positive electrode plate and an electrochemical apparatus and device associated therewith. The positive electrode plate includes a positive electrode current collector, a positive electrode active material layer disposed on at least one surface of the positive electrode current collector, and a safety layer disposed between the positive electrode active material layer and the positive electrode current collector. The safety layer includes a binding substance, a conductive substance, and a special sensitive substance, where the special sensitive substance is at least one product of esterification of polysaccharide in which a degree of esterification of monosaccharide units is 35% to 98%. The electrochemical apparatus prepared by using the positive electrode plate of this application has significantly improved safety and electrical performance (such as cycling performance).
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: February 6, 2024
    Assignee: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED
    Inventor: Yang Yu
  • Publication number: 20240038646
    Abstract: Semiconductor device packages and methods of forming the same are discussed. In an embodiment, a device includes: a redistribution structure comprising an upper dielectric layer and an under-bump metallization; a buffer feature on the under-bump metallization and the upper dielectric layer, the buffer feature covering an edge of the under-bump metallization, the buffer feature bonded to the upper dielectric layer; a reflowable connector extending through the buffer feature, the reflowable connector coupled to the under-bump metallization; an interposer coupled to the reflowable connector; and an encapsulant around the interposer and the reflowable connector, the encapsulant different from the buffer feature.
    Type: Application
    Filed: August 1, 2022
    Publication date: February 1, 2024
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Hao-Cheng Hou, Jung Wei Cheng, Yu-Min Liang, Tsung-Ding Wang
  • Patent number: 11884991
    Abstract: A method for producing a further wire, wherein the method includes, providing a first wire and feeding the first wire through a furnace to obtain the further wire. A further cast of the further wire is larger than a first cast of the first wire.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: January 30, 2024
    Assignee: Heraeus Materials Singapore Pte., Ltd.
    Inventors: Zhen Yun Liu, Muhammad Shahzali Bin Jolani, Yang Yu
  • Publication number: 20240028044
    Abstract: The instant disclosure provides a ranging method applied to a self-mobile robot configured with a first image collection apparatus and a second image collection apparatus.
    Type: Application
    Filed: April 8, 2021
    Publication date: January 25, 2024
    Applicant: Beijing Roborock Innovation Technology Co., Ltd.
    Inventors: Yang YU, Zhen WU
  • Publication number: 20240026763
    Abstract: A method of controlling a pumping stage of a fracturing fleet at a wellsite with a set of diesel pumps and at least one electric pump to smooth the flowrate transition to an operational setpoint with a higher flowrate. An optimization process communicatively connected to the plurality of pumping units can iterate an interim setpoint with a transfer function model to each pumping unit. The transfer function model can generate a smooth flowrate transition by decreasing the flowrate of at least one pump unit while increasing the flowrate to the remaining pump units.
    Type: Application
    Filed: July 14, 2022
    Publication date: January 25, 2024
    Inventors: Zhijie SUN, Yang YU, Tirumani SWAMINATHAN, Ian MITCHELL, Sergei PARSEGOV
  • Publication number: 20240018048
    Abstract: A method for preparing low-background cement includes: uniformly mixing a seed crystal of cement, C4AF whiskers, and high-magnesium raw material to yield a first mixture, calcining the first mixture at 1400-1500° C., to yield a low-background clinker, the first mixture including 1.0-5.0 wt. % of the seed crystal of cement, 1.0-5.0 wt. % of the C4AF whiskers, and the balance is the high-magnesium raw material; and grinding a second mixture of the low-background clinker and gypsum, to yield low-background cement. The seed crystal of cement is a high-magnesium and low hydration heat clinker, has a specific activity of Ra-226 radioactive nuclides within 50 Bq/kg, and the MgO content of the clinker is between 4.0 wt. % and 5.0 wt. %, with 50 wt. % <C3S <55.0 wt. %; and the high-magnesium raw material has a MgO content between 2.5 wt. % and 3.0 wt. %.
    Type: Application
    Filed: May 12, 2023
    Publication date: January 18, 2024
    Inventors: Wen HUANG, Yang YU, Min WANG, Zhaijun WEN, Tingting BAO, Guang YAO, Xin SHEN, Yun LIU, Jing WANG, Xianbin WANG, Zhongcheng MA, Xianshu GAO, Kunyue ZHANG, Guanbao TANG, Suihua GUO, Mingming SUN, Ao LIU
  • Publication number: 20240016860
    Abstract: Disclosed are a Bacillus coagulans and its application for improving constipation, belonging to the field of microbial strains. The Bacillus coagulans disclosed in the present application is preserved in China General Microbiological Culture Collection Center (CGMCC) on Nov. 10, 2021, with a preservation number of CGMCC No. 23766 and a preservation address of the Institute of Microbiology, Chinese Academy of Sciences, No. 3, Yard No. 1 Beichen West Road, Chaoyang District, Beijing.
    Type: Application
    Filed: September 1, 2023
    Publication date: January 18, 2024
    Inventors: Xueping YU, Xin MA, Yang YU
  • Publication number: 20240012425
    Abstract: The present disclosure provides a method for displaying a pose of a robot in a three-dimensional map, an apparatus, a device, and a storage medium. The method includes: acquiring a three-dimensional map of a space in which the robot is located; acquiring a two-dimensional map constructed by the robot; matching the three-dimensional map with the two-dimensional may constructed by the robot to obtain a correspondence between the three-dimensional map and the two-dimensional map constructed by the robot; acquiring a nose of the robot on the two-dimensional map constructed by the robot; and displaying a pose of the robot in the three-dimensional map based on the pose of the robot on the two-dimensional map constructed by the robot and the correspondence between the three-dimensional map and the two-dimensional map constructed by the robot.
    Type: Application
    Filed: November 29, 2021
    Publication date: January 11, 2024
    Inventors: Yang YU, Zhen WU
  • Patent number: 11861643
    Abstract: A system and method of determining a policy to prevent fading drivers is described. The system and method creates virtual trajectories of incentives such as coupons offered to drivers in a transportation hailing system and corresponding states of drivers in response to the incentives. A joint policy simulator is created from an incentive policy, a confounding incentive policy, and an incentive object policy to generate the simulated actions of drivers in response to different incentives. The rewards of the simulated actions of the drivers is determined by a discriminator. The incentive policy for preventing fading drivers is optimized by reinforcement learning based on the virtual trajectories generated by the joint policy simulator and discriminator.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: January 2, 2024
    Assignee: BEIJING DIDI INFINITY TECHNOLOGY AND DEVELOPMENT CO., LTD.
    Inventors: Wenjie Shang, Qingyang Li, Zhiwei Qin, Yiping Meng, Yang Yu, Jieping Ye
  • Patent number: 11863077
    Abstract: A power supply system includes an input stage comprising first and second input switches to provide a primary current responsive first and second input switching signals. A transformer generates a secondary current responsive to the primary current. An output stage comprises an output, a first output switch, a second output switch and a clamping switch. The output stage can be configured to generate an output voltage at the output by rectifying the secondary current responsive to respective first and second output switching signals. The clamping switch can be configured to close responsive to a clamp switching signal during an activation dead-time between closing the first input switch and the second input switch. The system further includes a switching controller configured to generate the first and second input switching signals and the first and second output switching signals based on the output voltage, and to generate the clamp switching signal.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: January 2, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Sheng-Yang Yu, Lieh-Chung Yin
  • Patent number: 11855057
    Abstract: Provided are a package structure and a method of forming the same. The method includes: laterally encapsulating a device die and an interconnect die by a first encapsulant; forming a redistribution layer (RDL) structure on the device die, the interconnect die, and the first encapsulant; bonding a package substrate onto the RDL structure, so that the RDL structure is sandwiched between the package substrate and the device die, the interconnect die, and the first encapsulant; laterally encapsulating the package substrate by a second encapsulant; and bonding a memory die onto the interconnect die, wherein the memory die is electrically connected to the device die through the interconnect die and the RDL structure.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yang Yu, Yu-Min Liang, Jiun-Yi Wu, Chien-Hsun Lee