Abstract: A system for resource recycling of sulfur dioxide includes a charcoal reduction furnace, a high temperature dust remover, a cooling separator A, a liquid sulfur tank, a cooling separator, a tail gas absorption tower, a gas stripping tower, a hypo reactor, a centrifuge, a mother liquor tank and a thickener. And a method for resource recycling of sulfur dioxide includes the following steps: (1) preparing elemental sulfur, (2) removing dust from a process gas containing gaseous sulfur, (3) separating elemental sulfur, (4) reabsorbing residual SO2 gas, (5) purifying sulfur powder, (6) preparing a slurry of cured hypo, (7) performing liquid-solid separation, and (8) preparing an absorption slurry. According to the method, SO2 gas is reduced into liquid sulfur and sulfur powder, and sodium thiosulfate is coproduced.

Abstract: The present disclosure includes an integrated circuit comprising a first pair of complementary transistors configured in series, a second pair of complementary transistors configured in series, and at least one charge extraction transistor having a gate coupled to a first potential, a source coupled to a second potential, and a drain coupled to a data storage node of one of the first or second pairs of complementary transistors. The first potential and second potential bias the at least one charge extraction transistor in a nonconductive state. The drain of the at least one charge extraction transistor is formed in a doped material shared with a drain of a transistor of the first or second pairs of complementary transistors.

Abstract: The present disclosure includes storage circuits, such latches. In one embodiment, a circuit includes a plurality of latches, each latch including a first N-type transistor formed in a first P-type material, a first P-type transistor formed in a first N-type material, a second N-type transistor formed in a second P-type material, and a second P-type transistor formed in a second N-type material. The first and second N-type transistors are formed in different P-wells and the first and second P-type transistors are formed in different N-wells. In other storage circuits, charge extraction transistors are coupled to data storage nodes and are biased in a nonconductive state. These techniques make the data storage circuits more resilient, for example, to an ionizing particle striking the circuit and generating charge carriers that would otherwise change the state of the storage node.

Abstract: A system for resource recycling of sulfur dioxide includes a charcoal reduction furnace, a high temperature dust remover, a cooling separator A, a liquid sulfur tank, a cooling separator, a tail gas absorption tower, a gas stripping tower, a hypo reactor, a centrifuge, a mother liquor tank and a thickener. And a method for resource recycling of sulfur dioxide includes the following steps: (1) preparing elemental sulfur, (2) removing dust from a process gas containing gaseous sulfur, (3) separating elemental sulfur, (4) reabsorbing residual SO2 gas, (5) purifying sulfur powder, (6) preparing a slurry of cured hypo, (7) performing liquid-solid separation, and (8) preparing an absorption slurry. According to the method, SO2 gas is reduced into liquid sulfur and sulfur powder, and sodium thiosulfate is coproduced.

Abstract: The present disclosure includes storage circuits, such latches. In one embodiment, a circuit includes a plurality of latches, each latch including a first N-type transistor formed in a first P-type material, a first P-type transistor formed in a first N-type material, a second N-type transistor formed in a second P-type material, and a second P-type transistor formed in a second N-type material. The first and second N-type transistors are formed in different P-wells and the first and second P-type transistors are formed in different N-wells. In other storage circuits, charge extraction transistors are coupled to data storage nodes and are biased in a nonconductive state. These techniques make the data storage circuits more resilient, for example, to an ionizing particle striking the circuit and generating charge carriers that would otherwise change the state of the storage node.

Abstract: A device for preparing a sulfite includes: a mother liquid tank and alkaline bin connected to a concentrated alkaline tank, connected to a tower reactor first reactor, one first reactor bottom output end is connected to a first gas-and-liquid mixer and another to a bubbling reaction kettle upper end, a bubbling reaction kettle gas output end is connected to the first mixer being connected to a first reactor upper portion; first reactor upper portion gas and second reactor bottom output ends are connected to a second mixer being connected to the second reactor top; and the bubbling reaction kettle is connected to a centrifugal machine or the alkaline tank, the machine being connected to a wet material bin and the liquid tank. A method includes preparing main and auxiliary absorption liquids, generating a middle slurry, reabsorbing residual gas SO2, generating a target product, separating the target product, drying and packaging.

Abstract: The present disclosure includes storage circuits, such latches. In one embodiment, a circuit includes a plurality of latches, each latch including a first N-type transistor formed in a first P-type material, a first P-type transistor formed in a first N-type material, a second N-type transistor formed in a second P-type material, and a second P-type transistor formed in a second N-type material. The first and second N-type transistors are formed in different P-wells and the first and second P-type transistors are formed in different N-wells. In other storage circuits, charge extraction transistors are coupled to data storage nodes and are biased in a nonconductive state. These techniques make the data storage circuits more resilient, for example, to an ionizing particle striking the circuit and generating charge carriers that would otherwise change the state of the storage node.

Abstract: The present disclosure includes storage circuits, such latches. In one embodiment, a circuit includes a plurality of latches, each latch including a first N-type transistor formed in a first P-type material, a first P-type transistor formed in a first N-type material, a second N-type transistor formed in a second P-type material, and a second P-type transistor formed in a second N-type material. The first and second N-type transistors are formed in different P-wells and the first and second P-type transistors are formed in different N-wells. In other storage circuits, charge extraction transistors are coupled to data storage nodes and are biased in a nonconductive state. These techniques make the data storage circuits more resilient, for example, to an ionizing particle striking the circuit and generating charge carriers that would otherwise change the state of the storage node.

Abstract: The invention relates to the field of sanitary products, in particular to a mask capable of preventing spectacles against mist. The mask comprises a mask body having an external surface and an internal surface, and a sponge strip fixedly connected to an upper part of the internal surface of the mask body. The side, away from the mask body, of the sponge strip is concave-convex to fit the nose bridge. The invention has the following beneficial effects: the sponge strip can well fit the nose bridge of the face of a wearer in shape, the sponge strip is compressible, the sponge strip will be squeezed by the mask body and the face of the wearer to deform to perfectly fit the face of different wearers; and the sponge is soft, so that the wear comfort of the mask can be improved.

Abstract: A circuit may include a ring oscillator circuit and monitoring circuitry. The ring oscillator circuit has a group of inverters in a loop, whereby the group of inverters includes first, second, and third output nodes. The monitoring circuitry may monitor for error events in a signal that has passed through the inverters from any one of the first, second, or third output nodes, and may generate first and second monitoring circuitry outputs. The circuit may further include an error correction circuit that produces an error correction output based on the first and second monitoring circuitry outputs. Accordingly, the monitoring circuitry may generate first and second updated monitoring circuitry outputs based on the error correction output. The first and second updated monitoring circuitry outputs may be logically combined using a logic circuit to reset the signal that has passed through the loop.

Abstract: An integrated circuit is provided that includes memory elements that exhibit immunity to soft error upset (SEU) events when subjected to high-energy atomic particle strikes. Each memory element may include at least two inverting circuits coupled in a feedback loop. Transistors in the memory element may be grouped in one contiguous region or divided into multiple separate regions. The memory element may include a long gate conductor that extends outside the boundary of the one contiguous region or the multiple separated regions. The long gate conductor may serve to provide parasitic resistance in the feedback loop to help mitigate SEU disturbances.

Abstract: An integrated circuit that includes an array of random-access memory cells is provided. Each memory cell may include inverting circuits formed from pull-up transistors and pull-down transistors and also access transistors coupled to the inverting circuits. The pull-up transistors may be formed in an n-well. The memory cells may also be coupled to single event latch-up (SEL) prevention circuitry. The SEL prevention circuitry may include a clamping circuit, a voltage sensing circuit, and a driver circuit. In response to a single event alpha particle strike at one of the memory cells, a temporary voltage rise may be presented at the clamping circuit. The voltage sensing circuit may detect the voltage rise and direct the driver circuit to bias the n-well into deep reverse bias region. Operated in this way, the SEL prevention circuitry can mitigate SEL while minimizing memory cell leakage.

Abstract: An integrated circuit is provided that includes memory elements that exhibit immunity to soft error upset (SEU) events when subjected to high-energy atomic particle strikes. Each memory element may include at least two inverting circuits coupled in a feedback loop. Transistors in the memory element may be grouped in one contiguous region or divided into multiple separate regions. The memory element may include a long gate conductor that extends outside the boundary of the one contiguous region or the multiple separated regions. The long gate conductor may serve to provide parasitic resistance in the feedback loop to help mitigate SEU disturbances.

Abstract: An integrated circuit that includes an array of random-access memory cells is provided. Each memory cell may include inverting circuits formed from pull-up transistors and pull-down transistors and also access transistors coupled to the inverting circuits. The pull-up transistors may be formed in an n-well. The memory cells may also be coupled to single event latch-up (SEL) prevention circuitry. The SEL prevention circuitry may include a clamping circuit, a voltage sensing circuit, and a driver circuit. In response to a single event alpha particle strike at one of the memory cells, a temporary voltage rise may be presented at the clamping circuit. The voltage sensing circuit may detect the voltage rise and direct the driver circuit to bias the n-well into deep reverse bias region. Operated in this way, the SEL prevention circuitry can mitigate SEL while minimizing memory cell leakage.

Abstract: An on-die-capacitor structure includes a first capacitor and a second capacitor. The first capacitor may have first and second terminals. The first and second terminals are directly connected to first and second power supply rail structures, respectively. The first power supply rail structure is different from the second power supply rail structure. The second capacitor may have third and fourth terminals. The second capacitor is connected in series between the second power supply rail structure and a third power supply rail structure. The third power supply rail structure is different from the first and second power supply rail structures. The third and fourth terminals are directly connected to the second and third power supply rail structures, respectively. The first capacitor may have a first capacitance and the second capacitor structure may have a second capacitance that is greater than the first capacitance.

Abstract: An on-die-capacitor structure includes a first capacitor and a second capacitor. The first capacitor may have first and second terminals. The first and second terminals are directly connected to first and second power supply rail structures, respectively. The first power supply rail structure is different from the second power supply rail structure. The second capacitor may have third and fourth terminals. The second capacitor is connected in series between the second power supply rail structure and a third power supply rail structure. The third power supply rail structure is different from the first and second power supply rail structures. The third and fourth terminals are directly connected to the second and third power supply rail structures, respectively. The first capacitor may have a first capacitance and the second capacitor structure may have a second capacitance that is greater than the first capacitance.

Abstract: A circuit may include a ring oscillator circuit and monitoring circuitry. The ring oscillator circuit has a group of inverters in a loop, whereby the group of inverters includes first, second, and third output nodes. The monitoring circuitry may monitor for error events in a signal that has passed through the inverters from any one of the first, second, or third output nodes, and may generate first and second monitoring circuitry outputs. The circuit may further include an error correction circuit that produces an error correction output based on the first and second monitoring circuitry outputs. Accordingly, the monitoring circuitry may generate first and second updated monitoring circuitry outputs based on the error correction output. The first and second updated monitoring circuitry outputs may be logically combined using a logic circuit to reset the signal that has passed through the loop.

Abstract: A circuit may include a ring oscillator circuit and monitoring circuitry. The ring oscillator circuit has a group of inverters in a loop, whereby the group of inverters includes first, second, and third output nodes. The monitoring circuitry may monitor for error events in a signal that has passed through the inverters from any one of the first, second, or third output nodes, and may generate first and second monitoring circuitry outputs. The circuit may further include an error correction circuit that produces an error correction output based on the first and second monitoring circuitry outputs. Accordingly, the monitoring circuitry may generate first and second updated monitoring circuitry outputs based on the error correction output. The first and second updated monitoring circuitry outputs may be logically combined using a logic circuit to reset the signal that has passed through the loop.

Abstract: Integrated circuits having flip-flops with asynchronous reset capabilities are provided. The flip-flops may be single event upset (SEU) hardened registers implemented using dual-interlocked cell (DICE) latch circuits. A logic gate may be inserted at the data input of each flip-flop. A multiplexer may be inserted at the input of the clock tree that is being used to feed clock signals to each of the flip-flops. Both the logic gate and the multiplexer may receive an asynchronous reset signal. The multiplexer may also receive a normal clock signal and a delayed clock pulse signal that is triggered in response to detecting assertion of the reset signal.

Abstract: A circuit may include a ring oscillator circuit and monitoring circuitry. The ring oscillator circuit has a group of inverters in a loop, whereby the group of inverters includes first, second, and third output nodes. The monitoring circuitry may monitor for error events in a signal that has passed through the inverters from any one of the first, second, or third output nodes, and may generate first and second monitoring circuitry outputs. The circuit may further include an error correction circuit that produces an error correction output based on the first and second monitoring circuitry outputs. Accordingly, the monitoring circuitry may generate first and second updated monitoring circuitry outputs based on the error correction output. The first and second updated monitoring circuitry outputs may be logically combined using a logic circuit to reset the signal that has passed through the loop.