Abstract: An electronic device including a protection layer, a display panel, and a sound broadcasting element is provided. The protection layer has an inner surface and a side surface directly connected to the inner surface. The display panel is disposed on the inner surface of the protection layer and has a back surface and a side surface directly connected to the back surface. The sound broadcasting element is located adjacent to the side surface of the display panel, and the sound broadcasting element includes a piezoelectric component and a connection component.

Abstract: A method for detecting and compensating CNC tools being implemented in an electronic device, receives from a detector first parameters and second parameters in respect of a first tool. Such first parameters include at least one of service life, blade break information, and blade chipping information of the first tool, and such second parameters include at least one of length extension information, length wear information, radial wear information, and blade thickness wear information of the first tool. Based on the first parameters, instructions to process the workpiece are transmitted or not. Upon receiving the second parameters, instructions to adjust operation of the first tool are transmitted, to compensate for deterioration in normal use.

Abstract: A filament forming method includes: performing first stage to apply first bias including gate and drain voltages to a resistive memory unit plural times until read current reaches first saturating state, latching read current in first saturating state as saturating read current, determining whether rate of increase of saturating read current is less than first threshold value; when rate of increase of saturating read current is not less than first threshold value, performing second stage to apply second bias, by increasing gate voltage and decreasing drain voltage, to the resistive memory unit plural times until read current reaches second saturating state, latching read current in second saturating state as saturating read current and determining whether rate of increase of saturating read current is less than first threshold value; finishing the method when rate of increase of saturating read current is less than first threshold value and saturating read current reaches target current value.

Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.

Abstract: A semiconductor device includes a package structure, a first heat spreader, and a second heat spreader. The first heat spreader is aside the package structure. The second heat spreader is in physical contact with the first heat spreader. The second heat spreader covers a top surface and sidewalls of the package structure. A material of the first heat spreader is different from a material of the second heat spreader.

Abstract: An information handling system includes a printed circuit board, a screw, and a processor. The printed circuit board includes a through hole via. The through hole via includes top and bottom sections plated with a conductive plating material, and a middle section without any conductive plating material. The screw in physical communication with the top, middle, and bottom sections of the through hole via in the printed circuit board. The processor determines whether an electrical circuit is formed between the screw, the top section of the through hole via, and the bottom section of the through hole via. Based on the determination of the electrical circuit being formed, the processor provides an indication that no intrusion has been made into the information handling system.

Abstract: Some embodiments relate to a semiconductor structure. The semiconductor structure includes a first substrate including a first plurality of conductive pads that are laterally spaced apart from one another on the first substrate. A first plurality of conductive bumps are disposed on the first plurality of conductive pads, respectively. A multi-tiered solder-resist structure is disposed on the first substrate and arranged between the first plurality of conductive pads. The multi-tiered solder-resist structure has different widths at a different heights over the first substrate and contacts sidewalls of the first plurality of conductive bumps to separate the first plurality of conductive bumps from one another.

Abstract: A method and a kit for detecting Mycobacterium tuberculosis are provided. The method includes a step of performing a nested qPCR assay to a specimen. The nested qPCR assay includes a first round of amplification using external primers and a second round of amplification using internal primers and a probe. The external primers have sequences of SEQ ID NOs. 1 and 2, and the internal primers and the probe have sequences of SEQ ID NOs. 3 to 5.

Abstract: A packaging method for a tire pressure monitoring sensor includes a step of placing, a step of pouring, and a step of hardening. In the step of placing, a sensing transmission module is put into a cavity of a modeling unit, and a positioning portion in the cavity restricts the sensing transmission module from moving transversely and toward an inner bottom of the cavity. In the step of pouring, a rubber compound is poured into the cavity and fills the cavity. The sensing transmission module is coated by the rubber compound to form a case on the outer surface of the sensing transmission module. In the step of hardening, the case is hardened and integrally formed with the sensing transmission module to form a tire pressure monitoring sensor which is removed from the cavity.

Abstract: A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.

Abstract: Embodiments of the present application provide a case of a battery, a battery, a power consumption device, and a method and device for preparing a battery. The case includes: an electrical chamber configured to accommodate a plurality of battery cells and a bus component, where at least one battery cell of the plurality of battery cells includes a pressure relief mechanism; a thermal management component configured to accommodate a fluid to adjust temperatures of the plurality of battery cells; and a collection chamber configured to collect, when the pressure relief mechanism is actuated, emissions from the battery cell provided with the pressure relief mechanism; where the thermal management component is configured to isolate the electrical chamber from the collection chamber. According to the technical solutions of the embodiments of the present application, the safety of the battery can be enhanced.

Abstract: A method includes forming a first semiconductor fin and a second semiconductor fin over a substrate that both extend along a first direction. The method includes forming a dielectric fin extending along the first direction and is disposed between the first and second semiconductor fins. The method includes forming a dummy gate structure extending along a second direction and straddling the first and second semiconductor fins and the dielectric fin. The method includes removing a portion of the dummy gate structure over the dielectric fin to form a trench by performing an etching process that includes a plurality of stages. Each of the plurality of stages includes a combination of anisotropic etching and isotropic etching such that a variation of a distance between respective inner sidewalls of the trench along the second direction is within a threshold.

Abstract: A method includes attaching a package component to a package substrate, the package component includes: an interposer disposed over the package substrate; a first die disposed along the interposer; and a second die disposed along the interposer, the second die being laterally adjacent the first die; attaching a first thermal interface material to the first die, the first thermal interface material being composed of a first material; attaching a second thermal interface material to the second die, the second thermal interface material being composed of a second material different from the first material; and attaching a lid assembly to the package substrate, the lid assembly being further attached to the first thermal interface material and the second thermal interface material.

Abstract: The disclosure relates to the field of information processing, and more particularly to a method, electronic device and storage medium for information processing. According to the embodiments of the disclosure, the method of information processing includes: establishing an association relationship between a first application and a first file, the first application being a program for processing a service processing flow; determining service processing flow information of the first application; and displaying first information corresponding to the service processing flow information at a predetermined position in the first file. The method of information processing provided by the embodiments of the disclosure enables users to conveniently obtain service processing flow information related to the first file through the first file, and facilitates subsequent audit and review of the file or the corresponding service processing flow.

Abstract: A metalens including a transparent substrate and lenses is provided. The lenses are located on the transparent substrate. Each of the lenses includes first columnar microstructures continuously arranged along a first direction and second columnar microstructures continuously arranged along a second direction. A pitch of the first columnar microstructure is different from a pitch of the second columnar microstructure.

Abstract: The disclosure provides a method, apparatus, terminal and storage medium for service processing based on an online document. The method includes: determining a first application; establishing an association between the first application and a first online document; and performing a first processing on the first online document according to the information related to the first application. The information processing method provided by embodiments of the present disclosure can process the first online document based on the information related to the first application, so that the data processing of the first online document can adapt to the service logic of the first application itself. While fully utilizing the characteristics of openness and easy collaboration of the online document, the online document can reflect or adapt to the service logic, and improve the flexibility and stability of the service.

Abstract: The disclosure relates to the field of computers, and particularly to a method, apparatus, electronic device and storage medium for information processing. The method of information processing provided in the present disclosure includes: at a time before the end of a service processing flow about a first file, determining a save strategy for the first file in response to a user operation, so that the first file is saved based on the save strategy after the end of the service processing flow.

Abstract: A method of data processing for an application includes displaying service data in a first display area of a first application display interface; displaying first online document information in a second display area of a first application display interface, the first online document carrying a file required for processing the service data; and processing the service data in response to a first operation initiated based on the content carried by the first online document. The method of data processing for an application displays business data and the first online document in the first display area and the second display area respectively, and operates the business data based on the first operation initiated by the content carried by the first online document, so that the processing method of business data is associated with the content carried by the first online document, thereby improving the flexibility and convenience of business data processing.

Abstract: This disclosure provides a method and apparatus, terminal and storage medium for information processing. The method of information processing includes: receiving a first document for processing a business flow, the business flow comprising one or more business nodes; and when a predetermined operation is performed on a content of the first document, determining an associated person associated with at least one business node of the business flow based on the predetermined operation, and sending a notification message to the associated person.

Abstract: A semiconductor device includes a gate structure extending along a first lateral direction. The semiconductor device includes a source/drain structure disposed on one side of the gate structure along a second lateral direction, the second lateral direction perpendicular to the first lateral direction. The semiconductor device includes an air gap disposed between the gate structure and the source/drain structure along the second lateral direction, wherein the air gap is disposed over the source/drain structure.