Abstract: In a semiconductor memory device, third and fourth transistors are configured as a vertical structure. The third transistor is laminated over a first transistor, and the fourth transistor is laminated over a second transistor, whereby a reduction in cell area is achieved. A voltage, which is set on the condition that the difference between a source potential applied to each of the first and second transistors and the potential of a select level of a word line becomes greater than or equal to a threshold voltage of each of the third and fourth transistors, is supplied to a source electrode of each of the first and second transistors, to thereby perform “0” write compensation.

Abstract: A plurality of sets of circuits are provided, each of which generates an impedance code through the use of an impedance control circuit in association with a resistive element connected to an external terminal, and each of which varies the impedance in accordance with such an impedance code. The impedance control circuit includes an impedance comparator which is formed equivalently to the resistive element and the plurality of sets of circuits, and which performs an impedance comparison with each of a plurality of replica circuits to form an up signal that increases the impedance and a down signal that decreases the impedance. Counters are provided adjacent to the individuals of the plurality of sets of circuits to thereby generate the impedance codes in response to the up signal and the down signal.

Abstract: An electronic circuit device has a high-density mount board (2), on which are disposed a microcomputer (3) and random access memory (7) which are connected to each other through an exclusive memory bus (12) for high-speed data transfer, a programmable device (8) which is a variable logic circuit represented by FPGA, and an electrically-rewritable nonvolatile memory (16) which can store the operation program of the microcomputer. The high-density mount board has external mounting pins on the bottom surface so that it can be mounted on a mother board in the same manner as a system on-chip multi-chip module. With an intended logic function being set on the programmable device, a hardware-based function to be realized by the electronic circuit device can be simulated. With an operation program being written to the nonvolatile memory, a software-based function to be realized can be simulated.

Abstract: A heater control method for a built-in heater of a head includes turning the heater ON during a time corresponding to consecutive read operation time and write operation time, and turning the heater OFF during a time corresponding to a read operation time after a write operation time.

Abstract: In a semiconductor memory device, third and fourth transistors are configured as a vertical structure. The third transistor is laminated over a first transistor, and the fourth transistor is laminated over a second transistor, whereby a reduction in cell area is achieved. A voltage, which is set on the condition that the difference between a source potential applied to each of the first and second transistors and the potential of a select level of a word line becomes greater than or equal to a threshold voltage of each of the third and fourth transistors, is supplied to a source electrode of each of the first and second transistors, to thereby perform “0” write compensation.

Abstract: A memory cell of a SRAM has two drive MISFETs and two vertical MISFETs. The p channel vertical MISFETs are formed above the n channel drive MISFETs. The vertical MISFETs respectively mainly consist of a square pole laminate formed of a lower semiconductor layer, intermediate semiconductor layer and upper semiconductor layer laminated in this sequence, a gate insulating film of silicon oxide formed on the surface of the side wall of the laminate, and a gate electrode formed so as to cover the side wall of the laminate. The vertical MISFETs are perfect depletion type MISFETs.

Abstract: A heater control method for a built-in heater of a head includes turning the heater ON during a time corresponding to consecutive read operation time and write operation time, and turning the heater OFF during a time corresponding to a read operation time after a write operation time.

Abstract: The present invention relates to a polynucleotide comprising a nucleotide sequence of a promoter region of a gene encoding ? subunit Gm1 of trimeric G-protein, more specifically, said polynucleotide, wherein the nucleotide sequence of a promoter region is, for example, any of the following nucleotide sequences (1) and (2): (1) the nucleotide sequence of SEQ ID NO: 1, and (2) the nucleotide sequence of the nucleotide numbers 603 to 3871 in the nucleotide sequence of SEQ ID NO: 1 and the like.

Abstract: A memory cell of an SRAM has two drive MISFETs and two vertical MISFETs. The p channel vertical MISFETs are formed above the n channel drive MISFETs. The vertical MISFETs respectively mainly comprise laminate formed of a lower semiconductor layer, intermediate semiconductor layer and upper semiconductor layer laminated in this sequence, a gate insulating film of silicon oxide formed on the surface of the side wall of the laminate, and a gate electrode formed so as to cover the side wall of the laminate. The vertical MISFETs are perfect depletion type MISFETs.

Abstract: An input interface circuit is provided which includes an input transistor for receiving a digital input signal, a circuit for generating a reference value, and an integrating capacitor connected in series to a pair of current conducting electrodes of the input transistor for integrating the input signal. A logic level of the input signal is discriminated by comparing an integration of the input signal with the reference value. To provide a testing function, a test transistor is connected to a junction between the pair of current conducting electrodes of the input transistor and the integrating capacitor so that a current driving capability may be determined. Additionally, a discharge path circuit for controllably discharging the integrating capacitor is connected to the junction between the input transistor and the integrating capacitor.

Abstract: A heater control method for a built-in heater of a head includes turning the heater ON during a time corresponding to consecutive read operation time and write operation time, and turning the heater OFF during a time corresponding to a read operation time after a write operation time.

Abstract: A storage apparatus and a magnetic head driving device includes a recording/reproducing head including a write element and a magnetoresistive element, a driving circuit for driving the write element and the magnetoresistive element, and write wires and read wires which connect the recording/reproducing head to the driving circuit. The write wires and the read wires are disposed in parallel in at least a portion between the recording/reproducing head and the driving circuit. At a location between the recording/reproducing head and the driving circuit, either of the write wires and the read wires are disposed so that a polarity of the either of the write wires and the read wires is reversed with respect to a polarity of the other of the write wires and the read wires.

Abstract: A heater control method for carries out an ON/OFF control with respect to a built-in heater of a head, by turning the heater ON during a time corresponding to consecutive read operation time and write operation time, and turning the heater OFF during a time corresponding to a read operation time after a write operation time.

Abstract: In a semiconductor memory device, third and fourth transistors are configured as a vertical structure. The third transistor is laminated over a first transistor, and the fourth transistor is laminated over a second transistor, whereby a reduction in cell area is achieved. A voltage, which is set on the condition that the difference between a source potential applied to each of the first and second transistors and the potential of a select level of a word line becomes greater than or equal to a threshold voltage of each of the third and fourth transistors, is supplied to a source electrode of each of the first and second transistors, to thereby perform “0” write compensation.

Abstract: An electronic circuit device has a high-density mount board (2), on which are disposed a microcomputer (3) and random access memory (7) which are connected to each other through an exclusive memory bus (12) for high-speed data transfer, a programmable device (8) which is a variable logic circuit represented by FPGA, and an electrically-rewritable nonvolatile memory (16) which can store the operation program of the microcomputer. The high-density mount board has external mounting pins on the bottom surface so that it can be mounted on a mother board in the same manner as a system on-chip multi-chip module. With an intended logic function being set on the programmable device, a hardware-based function to be realized by the electronic circuit device can be simulated. With an operation program being written to the nonvolatile memory, a software-based function to be realized can be simulated.

Abstract: An electronic circuit device has a high-density mount board (2), on which are disposed a microcomputer (3) and random access memory (7) which are connected to each other through an exclusive memory bus (12) for high-speed data transfer, a programmable device (8) which is a variable logic circuit represented by FPGA, and an electrically-rewritable nonvolatile memory (16) which can store the operation program of the microcomputer. The high-density mount board has external mounting pins on the bottom surface so that it can be mounted on a mother board in the same manner as a system on-chip multi-chip module. With an intended logic function being set on the programmable device, a hardware-based function to be realized by the electronic circuit device can be simulated. With an operation program being written to the nonvolatile memory, a software-based function to be realized can be simulated.

Abstract: In a semiconductor memory device, third and fourth transistors are configured as a vertical structure. The third transistor is laminated over a first transistor, and the fourth transistor is laminated over a second transistor, whereby a reduction in cell area is achieved. A voltage, which is set on the condition that the difference between a source potential applied to each of the first and second transistors and the potential of a select level of a word line becomes greater than or equal to a threshold voltage of each of the third and fourth transistors, is supplied to a source electrode of each of the first and second transistors, to thereby perform “0” write compensation.

Abstract: An electronic circuit device has a high-density mount board, on which are disposed a microcomputer, a random access memory, a programmable device which is a variable logic circuit represented by FPGA, and an electrically-rewritable nonvolatile memory which can store the operation program of the microcomputer. The high-density mount board has external mounting pins on the bottom surface so as to be mounted on a mother board in the same manner as a system on-chip multi-chip module. With an intended logic function being set on the programmable device, a hardware-based function to be realized by the electronic circuit device is simulated. With an operation program being written to the nonvolatile memory, a software-based function to be realized is simulated. Consequently, the device facilitates the debugging at early stages of system development, configures a prototype system, and contributes to the time reduction throughout the system development, prototype fabrication and large-scale production.

Abstract: A plurality of sets of circuits are provided, each of which generates an impedance code through the use of an impedance control circuit in association with a resistive element connected to an external terminal, and each of which varies the impedance in accordance with such an impedance code. The impedance control circuit includes an impedance comparator which is formed equivalently to the resistive element and the plurality of sets of circuits, and which performs an impedance comparison with each of a plurality of replica circuits to form an up signal that increases the impedance and a down signal that decreases the impedance. Counters are provided adjacent to the individuals of the plurality of sets of circuits to thereby generate the impedance codes in response to the up signal and the down signal.

Abstract: A plurality of sets of circuits are provided, each of which generates an impedance code through the use of an impedance control circuit in association with a resistive element connected to an external terminal, and each of which varies the impedance in accordance with such an impedance code. The impedance control circuit includes an impedance comparator which is formed equivalently to the resistive element and the plurality of sets of circuits, and which performs an impedance comparison with each of a plurality of replica circuits to form an up signal that increases the impedance and a down signal that decreases the impedance. Counters are provided adjacent to the individuals of the plurality of sets of circuits to thereby generate the impedance codes in response to the up signal and the down signal.