Abstract: An electronic component includes a multilayer body including a multilayer main body and side gap portions, the multilayer main body including an inner layer portion including alternatively laminated dielectric layers and internal nickel electrode layers, and including end surfaces in a length direction. The internal nickel electrode layers are exposed at the end surfaces. The side gap portions are on both sides of the multilayer main body in a width direction. External nickel layers are on the end surfaces of the multilayer body. A deviation amount in the width direction between ends of two adjacent internal nickel electrode layers on both side surfaces is within about 0.5 ?m. The external nickel layers are on the end surface of the multilayer body, in a region other than a region including a rounded ridge portion. A thermosetting resin layer including metal filler is outside the external nickel layer.

Abstract: An electronic component includes a multilayer body including a multilayer main body including internal nickel electrode layers exposed at end surfaces thereof, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering one of the end surfaces. When dimensions of the external nickel layer and the multilayer body are TN and T0, a relationship of TN<T0 is satisfied. When dimensions of the external nickel layer and the multilayer body are WN and W0, a relationship of WN<W0 is satisfied. The internal nickel electrode layers include at least one uncovered region. The internal nickel electrode layers are directly bonded to the external copper electrode layers in the uncovered region. At least one diffusion region is provided in which copper of the external copper electrode layers is diffused.

Abstract: An electronic component includes a body, an inner electrode within the body, and an outer electrode outside of the body, wherein the outer electrode includes an outermost layer that includes metal particles but is not electrically connected to the inner electrode.

Abstract: An electronic component includes a body portion and an external electrode. The external electrode is provided on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer includes Ni particles having an average particle size of not more than about 52 nm.

Abstract: An electronic component includes a body portion and an external electrode on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer has a S concentration of not less than about 5.2×1018 atoms/cm3.

Abstract: A method for manufacturing a multilayer ceramic capacitor includes preparing a green multilayer body including a stack of dielectric sheets printed with inner electrodes, coating the green multilayer body with a conductive paste that is connected to the inner electrodes, and firing the conductive paste and the green multilayer body at the same time, wherein a rate of temperature increase from about 800° C. to about 1,100° C. during the firing is about 15° C. per minute or more.

Abstract: A conductive paste for an external electrode that includes a conductive metal powder; a glass frit having an average particle diameter D50 of not more than 0.8 ?m and having a flat shape with an average flatness of 1.5 to 5.5; and a binder resin. A method of manufacturing an electronic component includes preparing an electronic component element; applying the conductive paste for an external electrode onto an outer surface of the electronic component element; and baking the applied conductive paste to form an external electrode.

Abstract: A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.

Abstract: A multilayer ceramic capacitor includes a laminate in which dielectric layers and internal electrodes are alternately stacked, and a pair of external electrodes provided on the corresponding surfaces of the laminate. The laminate includes first and second principal surfaces facing each other in its thickness direction, first and second end surfaces facing each other in its lengthwise direction, and first and second side surfaces facing each other in its width direction. The external electrodes each include a metal layer covering the internal electrodes extended to the corresponding one of the end surfaces, a baked layer including glass and metal covering the metal layer, and a plated film covering the baked layer.

Abstract: A conductive paste for an external electrode that includes a conductive metal powder; a glass frit having an average particle diameter D50 of not more than 0.8 ?m and having a flat shape with an average flatness of 1.5 to 5.5; and a binder resin. A method of manufacturing an electronic component includes preparing an electronic component element; applying the conductive paste for an external electrode onto an outer surface of the electronic component element; and baking the applied conductive paste to form an external electrode.

Abstract: A first outer electrode and first inner electrodes are supplied with an anode potential and a second outer electrode and second inner electrodes are supplied with a cathode potential when a monolithic ceramic capacitor is mounted and in use. The first outer electrode supplied with the anode potential has a thickness that is greater than a thickness of the second outer electrode supplied with the cathode potential.

Abstract: An outer electrode includes sintered layers each containing a sintered metal, an electrically insulating glass layer, and metal layers each containing at least one of Sn and Cu. Each sintered layer covers a respective end surface of a body and extends from the end surface to at least one main surface of the body. The glass layer is directly provided on the sintered layers located on the end surfaces of the body, extends in a direction perpendicular or substantially perpendicular to side surfaces of the body, and defines a portion of a surface of the outer electrode. Each metal layer covers a portion of one of the sintered layers other than a portion of the corresponding sintered layer that is covered with the glass layer, and defines another portion of the surface of the outer electrode.

Abstract: A laminated ceramic electronic component that includes a laminate having a plurality of dielectric layers and a plurality of internal electrode layers laminated together. External electrodes having underlying electrode layers and plating layers are formed on both end surfaces of the laminate. When a cross-section including the underlying electrode layers is observed, the underlying electrode layers contain a plurality of Cu crystals and glass, and an average value of lengths of demarcation lines of the Cu crystals having different crystal orientations is 3 ?m or less.

Abstract: A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.

Abstract: A laminated ceramic electronic component that includes a laminate having a plurality of dielectric layers and a plurality of internal electrode layers laminated together. External electrodes having underlying electrode layers and plating layers are formed on both end surfaces of the laminate. When a cross-section including the underlying electrode layers is observed, the underlying electrode layers contain a plurality of Cu crystals and glass, and an average value of lengths of demarcation lines of the Cu crystals having different crystal orientations is 3 ?m or less.

Abstract: A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.

Abstract: A conductive paste for an external electrode that includes a conductive metal powder; a glass frit having an average particle diameter D50 of not more than 0.8 ?m and having a flat shape with an average flatness of 1.5 to 5.5; and a binder resin. A method of manufacturing an electronic component includes preparing an electronic component element; applying the conductive paste for an external electrode onto an outer surface of the electronic component element; and baking the applied conductive paste to form an external electrode.

Abstract: A multilayer ceramic capacitor having an external electrode with a glass phase, where an occupation rate of the glass phase is 30% to 60% on an area ratio, and a maximum length c of the glass phase is 5 ?m or less.

Abstract: A laminated ceramic electronic component that includes a laminate having a plurality of dielectric layers and a plurality of internal electrode layers laminated together. External electrodes having underlying electrode layers and plating layers are formed on both end surfaces of the laminate. When a cross-section including the underlying electrode layers is observed, the underlying electrode layers contain a plurality of Cu crystals and glass, and an average value of lengths of demarcation lines of the Cu crystals having different crystal orientations is 3 ?m or less.

Abstract: A multilayer ceramic capacitor includes an external electrode that is unlikely to be peeled. First and second external electrodes each include base layers provided over a ceramic body and including a metal and glass, and Cu plated layers provided over the base layers. The multilayer ceramic capacitor includes a reactive layer. The reactive layer contains about 5 atomic % to about 15 atomic % of Ti, about 5 atomic % to about 15 atomic % of Si, and about 2 atomic % to about 10 atomic % of V.