Abstract: A multilayer ceramic capacitor that includes a laminate which has a plurality of dielectric layers and a plurality of internal electrode layers respectively laminated. The dielectric layers are a perovskite type structure containing Ba, Sr, Zr, Ti and Hf, and optionally Ca, and further include V, wherein (number of moles of Sr)/(number of moles of Ba+number of moles of Ca+number of moles of Sr) is 0.6 to 0.95, (number of moles of Zr)/(number of moles of Zr+number of moles of Ti+number of moles of Hf) is 0.9 to 0.98, thicknesses of the dielectric layers are 1 ?m or less, and an average particle size of dielectric particles constituting the dielectric layers is 0.8 ?m or less.

Abstract: In a multilayer ceramic capacitor, each outer electrode includes a first outer electrode layer that contains Ni and that is disposed on each main surface of a multilayer body and a second outer electrode layer that contains a glass component and Cu and that covers one end portion of the first outer electrode layer which is closer to an end surface of the multilayer body, the first and second outer electrode layers are joined together in a region including an edge shared by the main surface and the end surface, the other end portion of the first outer electrode layer is exposed from the second outer electrode layer, and Ni of the first outer electrode layer is diffused in the second outer electrode layer and is dissolved in Cu of the second outer electrode layer to define a solid solution in the region including the edge.

Abstract: A multilayer ceramic capacitor that includes a layered body in which dielectric layers and internal electrode layers are layered alternately, an external electrode on a surface of the layered body and a plating layer on a surface of the external electrode. The external electrode contains Cu, and a protective layer containing Cu2O is provided at a joining portion between the external electrode and the plating layer. When heat is applied to the layered body after the external electrode is removed, a ratio of an arithmetic mean value Xa of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 350° C. with respect to an arithmetic mean value Y of a quantity of hydrogen generated per unit temperature in a range higher than or equal to 230° C. and lower than or equal to 250° C. (Xa/Y) is less than or equal to 0.66.

Abstract: A method for manufacturing a multilayer ceramic capacitor includes preparing a green multilayer body including a stack of dielectric sheets printed with inner electrodes, coating the green multilayer body with a conductive paste that is connected to the inner electrodes, and firing the conductive paste and the green multilayer body at the same time, wherein a rate of temperature increase from about 800° C. to about 1,100° C. during the firing is about 15° C. per minute or more.

Abstract: A multilayer ceramic capacitor includes a laminate in which dielectric layers and internal electrodes are alternately stacked, and a pair of external electrodes provided on the corresponding surfaces of the laminate. The laminate includes first and second principal surfaces facing each other in its thickness direction, first and second end surfaces facing each other in its lengthwise direction, and first and second side surfaces facing each other in its width direction. The external electrodes each include a metal layer covering the internal electrodes extended to the corresponding one of the end surfaces, a baked layer including glass and metal covering the metal layer, and a plated film covering the baked layer.

Abstract: A multilayer ceramic capacitor contains Ni in internal electrodes, and includes a sintered metal layer containing Cu in external electrodes. At a joined portion between each internal electrode and each external electrode, mutual diffusion layers of Cu and Ni extend across the internal and external electrodes. On each internal electrode, a mutual diffusion layer is present with a thickness t1, which is defined by a dimension from a first end surface or a second end surface to an interior end in a longitudinal direction, not smaller than about 0.5 ?m and not greater than about 5 ?m. On each external electrode, a mutual diffusion layer is present with a thickness t2, which is defined by a dimension from the first end surface or the second end surface to an exterior end in the longitudinal direction, not smaller than about 2.5% and not greater than about 33.3% of a thickness t0 of a sintered metal layer.

Abstract: External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.

Abstract: A multilayer ceramic capacitor having an external electrode with a glass phase, where an occupation rate of the glass phase is 30% to 60% on an area ratio, and a maximum length c of the glass phase is 5 ?m or less.

Abstract: A multilayer ceramic capacitor includes an external electrode that is unlikely to be peeled. First and second external electrodes each include base layers provided over a ceramic body and including a metal and glass, and Cu plated layers provided over the base layers. The multilayer ceramic capacitor includes a reactive layer. The reactive layer contains about 5 atomic % to about 15 atomic % of Ti, about 5 atomic % to about 15 atomic % of Si, and about 2 atomic % to about 10 atomic % of V.

Abstract: A ceramic electronic component includes a ceramic body, inner electrodes, a glass coating layer, and outer electrodes. The glass coating layer extends from an exposed portion of one of the inner electrodes at a first end surface to a first principal surface. The outer electrodes are each constituted by a plating film disposed directly above the glass coating layer. The glass coating layer includes a glass medium and metal powder particles that define conductive paths. The metal powder particles have an elongated or substantially elongated shape and are dispersed in the glass medium. The dimension of a portion of the glass coating layer located on the first principal surface in the length direction, is larger than that of a portion of the glass coating layer located on the first end surface in the thickness direction.

Abstract: A conductive paste includes a metal powder, a glass frit containing a Si component, and an organic vehicle. The metal powder has a flat shape with a ratio a/b of a maximum length a to a maximum thickness b of 2.5 or more, a molar content of SiO2 in the glass frit is 36 to 59 percent by mole, and a volume content of the glass frit is 6 to 11 percent by volume. In external electrodes of a multilayer ceramic capacitor using this conductive paste, the molar content of SiO2 in a glass phase is 38 to 60 percent by mole, and an occupation rate of the glass phase is 30% to 60% on the area ratio, and a maximum length c of the glass phase is 5 ?m or less.

Abstract: A multilayer ceramic capacitor that contains at least one kind of a first element that forms a covalent hydride with hydrogen (except for an element generating a hydride having a boiling point of less than 125° C.) and a second element that forms a hydride in a boundary region with hydrogen between an outermost plating layer constituting an external electrode and a dielectric layer constituting a ceramic element body.

Abstract: A multilayer ceramic capacitor includes an external electrode that is unlikely to be peeled. First and second external electrodes each include base layers provided over a ceramic body and including a metal and glass, and Cu plated layers provided over the base layers. The multilayer ceramic capacitor includes a reactive layer. The reactive layer contains about 5 atomic % to about 15 atomic % of Ti, about 5 atomic % to about 15 atomic % of Si, and about 2 atomic % to about 10 atomic % of V.

Abstract: External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.

Abstract: A laminated ceramic electronic component that includes a laminate having a plurality of dielectric layers and a plurality of internal electrode layers laminated together. External electrodes having underlying electrode layers and plating layers are formed on both end surfaces of the laminate. When a cross-section including the underlying electrode layers is observed, the underlying electrode layers contain a plurality of Cu crystals and glass, and an average value of lengths of demarcation lines of the Cu crystals having different crystal orientations is 3 ?m or less.

Abstract: A multilayer ceramic capacitor that includes a laminate which has a plurality of dielectric layers and a plurality of internal electrode layers respectively laminated. The dielectric layers are a perovskite type structure containing Ba, Sr, Zr, Ti and Hf, and optionally Ca, and further include V, wherein (number of moles of Sr)/(number of moles of Ba+number of moles of Ca+number of moles of Sr) is 0.6 to 0.95, (number of moles of Zr)/(number of moles of Zr+number of moles of Ti+number of moles of Hf) is 0.9 to 0.98, thicknesses of the dielectric layers are 1 ?m or less, and an average particle size of dielectric particles constituting the dielectric layers is 0.8 ?m or less.

Abstract: In a multilayer ceramic capacitor, each outer electrode includes a first outer electrode layer that contains Ni and that is disposed on each main surface of a multilayer body and a second outer electrode layer that contains a glass component and Cu and that covers one end portion of the first outer electrode layer which is closer to an end surface of the multilayer body, the first and second outer electrode layers are joined together in a region including an edge shared by the main surface and the end surface, the other end portion of the first outer electrode layer is exposed from the second outer electrode layer, and Ni of the first outer electrode layer is diffused in the second outer electrode layer and is dissolved in Cu of the second outer electrode layer to define a solid solution in the region including the edge.

Abstract: A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers.

Abstract: External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.

Abstract: A multilayer ceramic electronic component having outer electrodes that each include an end-face outer electrode disposed on an end face of a ceramic multilayer body and side-face outer electrodes formed by a sputtering method on side faces of the ceramic multilayer body and electrically connected to the end-face outer electrode. A sputtering electrode layer of each of the side-face outer electrodes in contact with the ceramic multilayer body is composed of a material containing 3% by mass or more of a metal having a standard oxidation-reduction potential of ?2.36 to ?0.74 V, and an outermost sputtering electrode layer which is an outermost layer of each of the side-face outer electrodes is composed of at least one of Sn and Bi or an alloy containing 5% by mass or more of at least one of Sn and Bi.